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TMS320C6416TBZLZD1

Texas Instruments

TMS320C6416TBZLZD1 by Texas Instruments

TMS320C6416TBZLZD1 by Texas Instruments is a 32-bit DSP with 64-bit external data bus, operating at max 75 MHz. Ideal for industrial applications, it features a fixed-point format and low power mode for efficient processing. With a wide temperature range of -40 to 90 °C, this DSP offers high performance in various digital signal processing tasks.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 2,900 parts In-Stock

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Digiode

USA . 1,349 parts In-Stock

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Connector Distribution Corp

USA . 17 parts In-Stock

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Right Parts Inc.

USA . 17 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 318 parts In-Stock

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$7.534

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One Stop Electronics

USA . 775 parts In-Stock

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$17.000

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Corohmni

South Africa . 2,518 parts In-Stock

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$51.668

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Parana Technologies

USA . 833 parts In-Stock

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$54.510

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833

$54.510

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DigiPath Technology Company

USA . 736 parts In-Stock

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$60.022

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$60.022

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ChromeModa Solutions

Germany . 4,147 parts In-Stock

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$61.247

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$50.223

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IDEA Electronic Components Group

UK . 1,512 parts In-Stock

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$61.247

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$58.185

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$55.122

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QUARKTWIN TECHNOLOGY LTD

USA . 25,113 parts In-Stock

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Corphita

USA . 592 parts In-Stock

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Microchip USA

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Overview

Experience seamless and efficient digital signal processing with the TMS320C6416TBZLZD1 by Texas Instruments. As a leader in the industry, Texas Instruments delivers top-quality DSPs that are perfect for a wide range of applications. Whether you're working on audio processing, telecommunications, or industrial automation, this DSP offers unmatched performance and reliability. With its advanced features and cutting-edge technology, the TMS320C6416TBZLZD1 provides exceptional value and benefits to customers looking to elevate their projects to the next level. Trust Texas Instruments for all your DSP needs and experience the difference firsthand.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the DSP, ensuring a longer lifespan.

Surface Mount: YES

Allows for easy and efficient PCB assembly, saving time and reducing manufacturing costs.

Maximum Supply Voltage: 1.24 V

Ensures stable operation within the specified voltage range, reducing the risk of damage to the DSP.

Address Bus Width: 23

Enables the DSP to access a large memory address space, facilitating complex data processing tasks.

Bit Size: 32

Provides high computational power and precision for processing digital signals with accuracy.

Power Supplies (V): 1.1,3.3

Allows for flexibility in power input options, making the DSP compatible with different power sources.

No. of Terminals: 532

Provides ample connectivity options for interfacing with external devices and peripherals.

Minimum Operating Temperature: -40 °C

Ensures reliable operation in extreme cold environments, making the DSP suitable for a wide range of applications.

Maximum Operating Temperature: 90 °C

Can withstand high temperatures without overheating, enhancing the reliability and longevity of the DSP.

Maximum Clock Frequency: 75 MHz

Allows for fast and efficient data processing, making the DSP suitable for real-time signal processing applications.

Technical Specifications

Digital Signal Processors (DSPs) TMS320C6416TBZLZD1 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Additional Features:

ALSO REQUIRES 3.3V SUPPLY

Address Bus Width:

23

Barrel Shifter:

NO

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

75 MHz

External Data Bus Width:

64

Format:

FIXED POINT

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B532

JESD-609 Code:

e1

Length:

23 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

4

No. of Terminals:

532

Maximum Operating Temperature:

90 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA532,26X26,32

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.1,3.3

Qualification:

Not Qualified

Maximum Seated Height:

3.25 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.24 V

Minimum Supply Voltage:

1.16 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

23 mm

Peripheral IC Type:

Trade Compliance

TMS320C6416TBZLZD1 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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