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TMS320C6416TBCLZ7

Texas Instruments

TMS320C6416TBCLZ7 by Texas Instruments

TMS320C6416TBCLZ7 by Texas Instruments is a 32-bit DSP with integrated cache, 64-bit external data bus width, and max clock frequency of 75 MHz. Ideal for digital signal processing applications requiring high-speed performance and low power consumption.

Median Price

$138.563

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 1,485 parts In-Stock

1+ parts

$138.563

100+ parts

$134.396

1k+ parts

$104.183

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1,485

$138.563

$134.396

$104.183

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Distributors (In-Stock)

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Digiode

USA . 4,471 parts In-Stock

1+ parts

$131.635

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4,471

$131.635

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Vyrian

USA . 2,208 parts In-Stock

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2,208

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Distributors (Availability)

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AZTECH Wire

Italy . 412 parts In-Stock

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$19.050

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412

$19.050

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Parana Technologies

USA . 476 parts In-Stock

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$77.207

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476

$77.207

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Corohmni

South Africa . 228 parts In-Stock

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$82.848

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228

$82.848

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DigiPath Technology Company

USA . 574 parts In-Stock

1+ parts

$85.014

100+ parts

$78.213

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574

$85.014

$78.213

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ChromeModa Solutions

Germany . 1,357 parts In-Stock

1+ parts

$86.749

100+ parts

$71.134

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1,357

$86.749

$71.134

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IDEA Electronic Components Group

UK . 30 parts In-Stock

1+ parts

$86.749

100+ parts

$82.412

1k+ parts

$78.074

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30

$86.749

$82.412

$78.074

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Ampacity Inc.

Singapore . 1,127 parts In-Stock

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$117.780

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1,127

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Corphita

USA . 4,022 parts In-Stock

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$124.707

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$124.707

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Microchip USA

USA . 1,548 parts In-Stock

1+ parts

$143.890

100+ parts

$140.050

1k+ parts

$138.130

10k+ parts

$136.220

1,548

$143.890

$140.050

$138.130

$136.220

QUARKTWIN TECHNOLOGY LTD

USA . 23,768 parts In-Stock

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23,768

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iodParts Technologies Inc.

India . 4,715 parts In-Stock

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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Perfect Parts

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941

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Kepictronics

USA . 225 parts In-Stock

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Futuretech Components

Singapore . 225 parts In-Stock

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225

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Component Stockers USA

USA . 20 parts In-Stock

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20

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Overview

Enhance your digital signal processing projects with the TMS320C6416TBCLZ7 by Texas Instruments. This top-tier DSP offers unparalleled quality and reliability, thanks to its innovative design and cutting-edge technology. With integrated cache and a wide range of power supplies, this DSP is perfect for applications in telecommunications, audio processing, and more. Unlock the full potential of your projects with the TMS320C6416TBCLZ7 and experience the value and benefits it brings to your work.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the product easy to handle and resistant to damage.

Integrated Cache: YES

Having an integrated cache improves the performance of the DSP by reducing memory access times and increasing overall speed.

Maximum Supply Voltage: 1.24 V

The maximum supply voltage of 1.24 V ensures safe operation and prevents damage to the DSP.

Address Bus Width: 20

A wider address bus allows for increased memory addressing capabilities, which is essential for complex signal processing tasks.

Bit Size: 32

A 32-bit architecture allows for higher precision calculations and improved performance in digital signal processing applications.

Power Supplies (V): 1.2,3.3

Support for multiple power supplies enables flexibility in powering the DSP in different environments and applications.

No. of Terminals: 532

The large number of terminals allows for more connectivity options and integration with other components in a system.

RAM Words: 4096

A generous amount of RAM enables the DSP to efficiently store and process data, improving overall performance.

Maximum Clock Frequency: 75 MHz

A high clock frequency allows for fast data processing and real-time operation, making the DSP suitable for time-sensitive applications.

ROM Programmability: FLASH

Being able to program the ROM using flash technology provides flexibility for updating firmware and customizing the DSP for specific tasks.

Technical Specifications

Digital Signal Processors (DSPs) TMS320C6416TBCLZ7 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Address Bus Width:

20

Barrel Shifter:

NO

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

75 MHz

External Data Bus Width:

64

Format:

FIXED POINT

Integrated Cache:

YES

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B532

JESD-609 Code:

e1

Length:

23 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

4

No. of DMA Channels:

64

No. of External Interrupts:

4

No. of Terminals:

532

No. of Timers:

3

On Chip Program ROM Width:

8

Maximum Operating Temperature:

90 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA532,26X26,32

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2,3.3

Qualification:

Not Qualified

RAM Words:

4096

ROM Programmability:

FLASH

Maximum Seated Height:

3.25 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.24 V

Minimum Supply Voltage:

1.16 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

23 mm

Peripheral IC Type:

Trade Compliance

TMS320C6416TBCLZ7 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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