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TMS320C6414TBZLZA8

Texas Instruments

TMS320C6414TBZLZA8 by Texas Instruments

TMS320C6414TBZLZA8 by Texas Instruments is a 32-bit DSP with 262144 RAM words, 64-bit external data bus width, and operates at a max clock frequency of 75 MHz. Ideal for industrial applications requiring high-speed signal processing in a compact package with low power mode capability.

Median Price

$222.892

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 392 parts In-Stock

1+ parts

$204.960

100+ parts

$192.660

1k+ parts

$180.360

10k+ parts

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392

$204.960

$192.660

$180.360

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DigiKey

USA . 398 parts In-Stock

1+ parts

-

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398

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Verical

USA . 392 parts In-Stock

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100+ parts

$240.825

1k+ parts

$225.450

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392

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$240.825

$225.450

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 703 parts In-Stock

1+ parts

$226.081

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703

$226.081

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Vyrian

USA . 5,461 parts In-Stock

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5,461

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Distributors (Availability)

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Corohmni

South Africa . 1,155 parts In-Stock

1+ parts

$44.275

100+ parts

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1,155

$44.275

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Parana Technologies

USA . 2,185 parts In-Stock

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$51.605

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2,185

$51.605

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DigiPath Technology Company

USA . 50 parts In-Stock

1+ parts

$56.823

100+ parts

$52.277

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-

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50

$56.823

$52.277

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ChromeModa Solutions

Germany . 6,725 parts In-Stock

1+ parts

$57.983

100+ parts

$47.546

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6,725

$57.983

$47.546

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IDEA Electronic Components Group

UK . 693 parts In-Stock

1+ parts

$57.983

100+ parts

$55.084

1k+ parts

$52.185

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693

$57.983

$55.084

$52.185

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Corphita

USA . 3,326 parts In-Stock

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$214.182

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3,326

$214.182

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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Microchip USA

USA . 2,155 parts In-Stock

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2,155

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A-Z Elektronik GmbH

Germany . 813 parts In-Stock

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813

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Perfect Parts

USA . 560 parts In-Stock

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560

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Overview

Unlock the power of cutting-edge technology with the TMS320C6414TBZLZA8 by Texas Instruments. Designed for high-performance digital signal processing applications, this DSP offers unparalleled quality and reliability. With a maximum clock frequency of 75 MHz and a wide external data bus width of 64, this versatile processor is perfect for a range of industrial uses. Experience seamless integration and exceptional efficiency with this innovative solution. Trust Texas Instruments to deliver superior products that exceed expectations. Elevate your projects to new heights with the TMS320C6414TBZLZA8.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides lightweight and durable packaging for the DSP, ensuring protection during handling and transportation.

Maximum Supply Voltage: 1.24 V

Allows for efficient power consumption and helps in reducing power losses in the system.

Bit Size: 32

Offers high processing capabilities and precision for digital signal processing tasks.

RAM Words: 262144

Provides ample memory storage for storing and processing data efficiently.

Maximum Clock Frequency: 75 MHz

Enables fast data processing speeds, making the DSP suitable for real-time applications.

Technology: CMOS

Uses low power consumption and high noise immunity, making it energy efficient and reliable for signal processing operations.

Technical Specifications

Digital Signal Processors (DSPs) TMS320C6414TBZLZA8 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Additional Features:

ALSO REQUIRES 3.3V SUPPLY

Address Bus Width:

23

Barrel Shifter:

NO

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

75 MHz

External Data Bus Width:

64

Format:

FIXED POINT

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B532

JESD-609 Code:

e1

Length:

23 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

4

No. of Terminals:

532

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA532,26X26,32

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.1,3.3

Qualification:

Not Qualified

RAM Words:

262144

Maximum Seated Height:

3.25 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.24 V

Minimum Supply Voltage:

1.16 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

23 mm

Peripheral IC Type:

Trade Compliance

TMS320C6414TBZLZA8 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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