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TMS320C6414TBGLZ6

Texas Instruments

TMS320C6414TBGLZ6 by Texas Instruments

TMS320C6414TBGLZ6 by Texas Instruments is a 32-bit DSP with integrated cache, 64-bit external data bus width, and 262144 RAM words. It is used in digital signal processing applications requiring high clock frequency up to 75 MHz and low power mode for efficient performance.

Median Price

$95.765

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 559 parts In-Stock

1+ parts

$80.060

100+ parts

$78.470

1k+ parts

$76.870

10k+ parts

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559

$80.060

$78.470

$76.870

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Texas Instruments

USA . 1,855 parts In-Stock

1+ parts

$95.765

100+ parts

$92.885

1k+ parts

$72.004

10k+ parts

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1,855

$95.765

$92.885

$72.004

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Mouser Electronics

USA . 21 parts In-Stock

1+ parts

$150.480

100+ parts

$116.230

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21

$150.480

$116.230

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Distributors (In-Stock)

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Digiode

USA . 1,535 parts In-Stock

1+ parts

$90.977

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1,535

$90.977

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Vyrian

USA . 5,499 parts In-Stock

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5,499

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Flip Electronics

USA . 520 parts In-Stock

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520

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Inventory MP

USA . 8 parts In-Stock

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Bristol Electronics

USA . 8 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 1,081 parts In-Stock

1+ parts

$11.840

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-

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1,081

$11.840

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Parana Technologies

USA . 918 parts In-Stock

1+ parts

$15.351

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$15.741

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918

$15.351

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$15.741

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DigiPath Technology Company

USA . 1,424 parts In-Stock

1+ parts

$16.903

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$16.903

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ChromeModa Solutions

Germany . 4,493 parts In-Stock

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$17.248

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$14.143

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4,493

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$14.143

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IDEA Electronic Components Group

UK . 606 parts In-Stock

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$17.248

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$16.386

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$15.523

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606

$17.248

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$15.523

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Corohmni

South Africa . 2,956 parts In-Stock

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$29.623

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$29.623

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Corphita

USA . 1,792 parts In-Stock

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$86.188

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Overview

Unlock the power of cutting-edge technology with the Texas Instruments TMS320C6414TBGLZ6 Digital Signal Processor. Designed for high-performance applications, this DSP offers integrated cache, multiple power supplies, and a compact package shape for efficient processing. With Texas Instruments' reputation for quality and innovation, customers can trust in the reliability and durability of this product. From telecommunications to industrial automation, the TMS320C6414TBGLZ6 provides unmatched value and performance for a wide range of applications. Experience the difference with Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the components inside, ensuring a longer lifespan for the product.

Integrated Cache: YES

Having an integrated cache helps improve processing speed by storing frequently accessed data closer to the processor.

Maximum Supply Voltage: 1.16 V

The higher maximum supply voltage allows for more flexibility in power management and can support a wider range of applications.

Address Bus Width: 23

A wider address bus width enables the processor to access a larger memory space, allowing for more complex computations and tasks to be executed.

Bit Size: 32

A 32-bit architecture provides higher computational power and efficiency compared to lower bit sizes.

No. of Terminals: 532

Having a high number of terminals allows for more connectivity options and interfaces, enabling the processor to interact with a variety of devices and peripherals.

Minimum Supply Voltage: 1.05 V

The lower minimum supply voltage helps in reducing power consumption and heat generation, making the product more energy-efficient.

Maximum Operating Temperature: 90 °C

With a high maximum operating temperature, the processor can reliably function in a wide range of environmental conditions without experiencing overheating.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

This specific type of peripheral IC is tailored for processing digital signals efficiently, making it ideal for applications requiring high-speed signal processing.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and fast switching speeds, making it suitable for power-efficient and high-performance applications.

Technical Specifications

Digital Signal Processors (DSPs) TMS320C6414TBGLZ6 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Additional Features:

ALSO REQUIRES 3.3V SUPPLY

Address Bus Width:

23

Barrel Shifter:

NO

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

75 MHz

External Data Bus Width:

64

Format:

FIXED POINT

Integrated Cache:

YES

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B532

JESD-609 Code:

e0

Length:

23 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

4

No. of DMA Channels:

64

No. of External Interrupts:

4

No. of Terminals:

532

No. of Timers:

3

On Chip Program ROM Width:

8

Maximum Operating Temperature:

90 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA532,26X26,32

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Peak Reflow Temperature (C):

220

Power Supplies (V):

1.1,3.3

Qualification:

Not Qualified

RAM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

3.25 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.16 V

Minimum Supply Voltage:

1.05 V

Nominal Supply Voltage:

1.1 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

23 mm

Peripheral IC Type:

Trade Compliance

TMS320C6414TBGLZ6 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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