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TMS320C6414TBCLZW8

Texas Instruments

TMS320C6414TBCLZW8 by Texas Instruments

TMS320C6414TBCLZW8 by Texas Instruments is a 32-bit DSP with 4096 RAM words, operating at 1.2-3.3V. It features a grid array package style and ball terminal form, suitable for digital signal processing applications requiring fixed-point format and CMOS technology.

Median Price

$152.205

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 187 parts In-Stock

1+ parts

$139.960

100+ parts

$131.560

1k+ parts

$123.160

10k+ parts

-

187

$139.960

$131.560

$123.160

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DigiKey

USA . 187 parts In-Stock

1+ parts

-

100+ parts

-

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187

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Verical

USA . 187 parts In-Stock

1+ parts

-

100+ parts

$164.450

1k+ parts

$153.950

10k+ parts

-

187

-

$164.450

$153.950

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,115 parts In-Stock

1+ parts

$154.384

100+ parts

-

1k+ parts

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4,115

$154.384

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-

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DigiKey Marketplace

USA . 187 parts In-Stock

1+ parts

$169.010

100+ parts

-

1k+ parts

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10k+ parts

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187

$169.010

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Vyrian

USA . 7,183 parts In-Stock

1+ parts

-

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7,183

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 663 parts In-Stock

1+ parts

$16.225

100+ parts

-

1k+ parts

-

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663

$16.225

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Parana Technologies

USA . 2,330 parts In-Stock

1+ parts

$33.016

100+ parts

-

1k+ parts

$117.227

10k+ parts

-

2,330

$33.016

-

$117.227

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DigiPath Technology Company

USA . 2,289 parts In-Stock

1+ parts

$36.355

100+ parts

-

1k+ parts

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10k+ parts

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2,289

$36.355

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ChromeModa Solutions

Germany . 2,404 parts In-Stock

1+ parts

$37.097

100+ parts

$30.420

1k+ parts

-

10k+ parts

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2,404

$37.097

$30.420

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IDEA Electronic Components Group

UK . 1,715 parts In-Stock

1+ parts

$37.097

100+ parts

$35.242

1k+ parts

$33.387

10k+ parts

-

1,715

$37.097

$35.242

$33.387

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Corphita

USA . 461 parts In-Stock

1+ parts

$146.259

100+ parts

-

1k+ parts

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10k+ parts

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461

$146.259

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Overview

Unleash the power of cutting-edge technology with the TMS320C6414TBCLZW8 by Texas Instruments. As a leader in digital signal processors, Texas Instruments ensures unmatched quality and reliability in their products. The TMS320C6414TBCLZW8 is a game-changer in its category, providing seamless performance and efficiency. With its advanced features and versatile applications, this DSP offers unparalleled value and benefits to customers looking to elevate their projects to the next level. Trust Texas Instruments to deliver excellence every time.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good thermal and mechanical properties, making the product resistant to harsh environmental conditions.

Surface Mount: YES

Surface mount technology enables easy and efficient integration onto PCBs, saving space and simplifying assembly.

Package Shape: SQUARE

Square package shape allows for efficient use of space on the PCB, maximizing component density.

Bit Size: 32

32-bit processing capabilities provide high computational power and precision for signal processing tasks.

Power Supplies (V): 1.2, 3.3

Support for multiple voltage supplies allows versatile integration into various systems and power requirements.

No. of Terminals: 532

Large number of terminals enable connectivity to multiple components and peripherals for enhanced functionality.

Package Style (Meter): GRID ARRAY, HEAT SINK/SLUG, FINE PITCH

Various package styles provide flexibility for different mounting and cooling options to suit specific application needs.

Terminal Finish: TIN SILVER COPPER

This terminal finish offers good solderability and conductivity for reliable electrical connections.

Terminal Position: BOTTOM

Bottom terminal position facilitates easy and secure mounting onto the PCB, improving overall stability.

RAM Words: 4096

Large RAM size allows for efficient storage and processing of data, enhancing overall performance.

Maximum Time At Peak Reflow Temperature (s): 30

This spec ensures proper solder reflow process during assembly, leading to high-quality and reliable connections.

Peak Reflow Temperature °C: 260

High peak reflow temperature enables robust solder joints, ensuring long-term reliability under challenging conditions.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

Support for various peripheral IC types increases compatibility and functionality with a wide range of external devices and applications.

Technology: CMOS

CMOS technology offers low power consumption, high integration density, and fast processing speeds for efficient signal processing tasks.

Terminal Form: BALL

Ball terminal form provides a reliable connection and simplifies the soldering process during assembly.

Terminal Pitch: 0.8 mm

Narrow terminal pitch allows for compact design and high pin count, enabling dense integration onto the PCB.

Format: FIXED POINT

Fixed-point format simplifies arithmetic operations and algorithms, leading to efficient processing of signals and data.

Moisture Sensitivity Level (MSL): 4

MSL 4 indicates the level of protection needed against moisture, ensuring the product's reliability and longevity in various environments.

Technical Specifications

Digital Signal Processors (DSPs) TMS320C6414TBCLZW8 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Bit Size:

32

Format:

FIXED POINT

JESD-30 Code:

S-PBGA-B532

JESD-609 Code:

e1

Moisture Sensitivity Level (MSL):

4

No. of Terminals:

532

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA532,26X26,32

Package Shape:

Package Style (Meter):

GRID ARRAY, HEAT SINK/SLUG, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2,3.3

Qualification:

Not Qualified

RAM Words:

4096

Sub-Category:

Digital Signal Processors

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Peripheral IC Type:

Trade Compliance

TMS320C6414TBCLZW8 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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