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TMS320C6412GNZ500

Texas Instruments

TMS320C6412GNZ500 by Texas Instruments

TMS320C6412GNZ500 by Texas Instruments is a 32-bit DSP with 262144 RAM words, 64-bit external data bus width, and 75.19 MHz max clock frequency. Ideal for digital signal processing applications due to its multiple internal bus architecture and low power mode feature.

Median Price

$30.162

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 226 parts In-Stock

1+ parts

-

100+ parts

$26.810

1k+ parts

$23.990

10k+ parts

$22.580

226

-

$26.810

$23.990

$22.580

DigiKey

USA . 226 parts In-Stock

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-

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226

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Verical

USA . 26 parts In-Stock

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$33.513

1k+ parts

$29.988

10k+ parts

$28.225

26

-

$33.513

$29.988

$28.225

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,612 parts In-Stock

1+ parts

$28.300

100+ parts

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1,612

$28.300

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Vyrian

USA . 3,159 parts In-Stock

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3,159

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DigiKey Marketplace

USA . 226 parts In-Stock

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226

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Distributors (Availability)

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Ampacity Inc.

Singapore . 151 parts In-Stock

1+ parts

$25.320

100+ parts

-

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151

$25.320

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Corphita

USA . 3,840 parts In-Stock

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$26.811

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3,840

$26.811

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Component Stockers USA

USA . 672 parts In-Stock

1+ parts

$30.080

100+ parts

$28.290

1k+ parts

-

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672

$30.080

$28.290

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Corohmni

South Africa . 2,480 parts In-Stock

1+ parts

$54.865

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2,480

$54.865

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Parana Technologies

USA . 712 parts In-Stock

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$65.736

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712

$65.736

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DigiPath Technology Company

USA . 1,644 parts In-Stock

1+ parts

$72.384

100+ parts

$66.593

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1,644

$72.384

$66.593

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ChromeModa Solutions

Germany . 5,815 parts In-Stock

1+ parts

$73.861

100+ parts

$60.566

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5,815

$73.861

$60.566

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IDEA Electronic Components Group

UK . 2,134 parts In-Stock

1+ parts

$73.861

100+ parts

$70.168

1k+ parts

$66.475

10k+ parts

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2,134

$73.861

$70.168

$66.475

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Overview

Elevate your digital signal processing capabilities with the TMS320C6412GNZ500 by Texas Instruments, a cutting-edge DSP that delivers unparalleled performance and reliability. As a leader in semiconductor manufacturing, Texas Instruments ensures top-notch quality in every product they release. This powerful DSP is ideal for a wide range of applications, from telecommunications to audio processing, offering customers unmatched value, efficiency, and versatility. Experience the advantage of seamless integration, high-speed processing, and exceptional functionality with the TMS320C6412GNZ500. Take your projects to the next level with this innovative solution from Texas Instruments.

Feature Benefit Bullets

Package Body Material : PLASTIC/EPOXY

This material is commonly used for electronic components as it provides good protection and insulation for the DSP, making it reliable and durable.

Surface Mount : YES

Surface mount technology allows for easy and efficient assembly of the DSP onto circuit boards, saving space and reducing production costs.

Maximum Supply Voltage : 1.26 V

With a relatively low maximum supply voltage, this DSP is suitable for low-power applications and helps to minimize power consumption.

Address Bus Width : 23

A wider address bus allows for more memory addressing capabilities, enabling the DSP to handle larger and more complex tasks efficiently.

Package Shape : SQUARE

The square package shape helps in efficient placement and routing of the DSP on the circuit board, optimizing space utilization.

Bit Size : 32

The 32-bit architecture of the DSP allows for processing larger chunks of data at a time, improving overall performance and speed.

Power Supplies (V) : 1.2,3.3

Support for multiple power supply voltages makes the DSP versatile and adaptable to different system requirements and power sources.

No. of Terminals : 548

Having a high number of terminals allows for more connections and interfaces, providing flexibility in interfacing with other components in the system.

Package Style (Meter) : GRID ARRAY

The grid array package style offers enhanced mechanical strength and thermal performance, ensuring reliability under varying operating conditions.

Minimum Supply Voltage : 1.14 V

The low minimum supply voltage ensures operational stability even under low power conditions, enhancing the efficiency of the DSP.

Terminal Finish : TIN LEAD

The tin lead terminal finish provides good solderability and reliability in the connection between the DSP and the circuit board.

Peripheral IC Type : DIGITAL SIGNAL PROCESSOR, OTHER

Being specifically designed as a digital signal processor with additional peripheral capabilities, this product offers comprehensive processing and interface options.

Technology : CMOS

The CMOS technology used in the DSP ensures low power consumption, high noise immunity, and compatibility with a wide range of operating voltages.

Format : FIXED POINT

The fixed-point format simplifies arithmetic operations and accelerates signal processing tasks, making this DSP suitable for real-time applications.

Moisture Sensitivity Level (MSL) : 4

Having a moisture sensitivity level of 4 means the DSP can withstand exposure to moderate levels of moisture during storage and handling.

Low Power Mode : YES

The availability of a low power mode allows the DSP to operate in a more energy-efficient state when processing tasks with lower computational demands.

Technical Specifications

Digital Signal Processors (DSPs) TMS320C6412GNZ500 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Additional Features:

ALSO REQUIRES 3.3V SUPPLY

Address Bus Width:

23

Barrel Shifter:

NO

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

75.19 MHz

External Data Bus Width:

64

Format:

FIXED POINT

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B548

JESD-609 Code:

e0

Length:

27 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

4

No. of Terminals:

548

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Equivalence Code:

BGA548,26X26,40

Package Shape:

Package Style (Meter):

GRID ARRAY

Power Supplies (V):

1.2,3.3

Qualification:

Not Qualified

RAM Words:

262144

Maximum Seated Height:

2.8 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.26 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Width:

27 mm

Peripheral IC Type:

Trade Compliance

TMS320C6412GNZ500 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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