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TMS320C6412AGNZ5

Texas Instruments

TMS320C6412AGNZ5 by Texas Instruments

TMS320C6412AGNZ5 by Texas Instruments is a 32-bit DSP with integrated cache, 64-bit external data bus width, and max clock frequency of 75.19 MHz. Ideal for digital signal processing applications requiring low power mode and boundary scan capability.

Median Price

$71.117

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 1,716 parts In-Stock

1+ parts

$71.117

100+ parts

$63.216

1k+ parts

$46.482

10k+ parts

-

1,716

$71.117

$63.216

$46.482

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Rochester

USA . 847 parts In-Stock

1+ parts

-

100+ parts

$66.810

1k+ parts

$59.780

10k+ parts

$56.260

847

-

$66.810

$59.780

$56.260

DigiKey

USA . 847 parts In-Stock

1+ parts

-

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847

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Verical

USA . 782 parts In-Stock

1+ parts

-

100+ parts

$83.513

1k+ parts

$74.725

10k+ parts

$70.325

782

-

$83.513

$74.725

$70.325

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,958 parts In-Stock

1+ parts

$61.332

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-

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2,958

$61.332

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Vyrian

USA . 2,996 parts In-Stock

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-

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2,996

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Bristol Electronics

USA . 533 parts In-Stock

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533

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Atlantic Semiconductor

USA . 533 parts In-Stock

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533

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,329 parts In-Stock

1+ parts

$31.042

100+ parts

-

1k+ parts

$71.567

10k+ parts

-

1,329

$31.042

-

$71.567

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DigiPath Technology Company

USA . 1,738 parts In-Stock

1+ parts

$34.181

100+ parts

$31.447

1k+ parts

-

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1,738

$34.181

$31.447

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ChromeModa Solutions

Germany . 2,769 parts In-Stock

1+ parts

$34.879

100+ parts

$28.601

1k+ parts

-

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2,769

$34.879

$28.601

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IDEA Electronic Components Group

UK . 630 parts In-Stock

1+ parts

$34.879

100+ parts

$33.135

1k+ parts

$31.391

10k+ parts

-

630

$34.879

$33.135

$31.391

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Ampacity Inc.

Singapore . 1,092 parts In-Stock

1+ parts

$54.880

100+ parts

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1,092

$54.880

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Corphita

USA . 1,077 parts In-Stock

1+ parts

$58.104

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1,077

$58.104

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Corohmni

South Africa . 2,737 parts In-Stock

1+ parts

$72.630

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2,737

$72.630

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Microchip USA

USA . 2,180 parts In-Stock

1+ parts

$154.420

100+ parts

$151.740

1k+ parts

$150.390

10k+ parts

$149.050

2,180

$154.420

$151.740

$150.390

$149.050

QUARKTWIN TECHNOLOGY LTD

USA . 15,951 parts In-Stock

1+ parts

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15,951

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Overview

Experience unparalleled processing power and efficiency with the TMS320C6412AGNZ5 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-notch quality and reliability. This Digital Signal Processor (DSP) is equipped with integrated cache and multiple power supplies for optimal performance. Perfect for applications in telecommunications, audio processing, and industrial automation, this product offers customers exceptional value, benefits, and advantages. Trust Texas Instruments to provide cutting-edge technology that exceeds your expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the DSP, making it suitable for various environments.

Integrated Cache: YES

Enhances the performance of the DSP by storing frequently accessed data for quick retrieval.

Maximum Supply Voltage: 1.26 V

Allows for efficient power usage and prevents damage from excessive voltage.

Address Bus Width: 23

Enables the DSP to access a large memory address space for complex processing tasks.

Package Shape: SQUARE

Facilitates easy mounting and integration into electronic devices.

Bit Size: 32

Provides high computational capabilities for signal processing applications.

Power Supplies (V): 1.2,3.3

Allows flexibility in power input options for different operational requirements.

No. of Terminals: 548

Offers numerous connectivity options for interfacing with other components.

Package Style (Meter): GRID ARRAY

Ensures secure and reliable connections for the DSP within electronic systems.

Minimum Supply Voltage: 1.14 V

Maintains stable operation at lower voltage levels, improving energy efficiency.

Maximum Operating Temperature: 90 °C

Can withstand high temperatures, suitable for demanding operating conditions.

Internal Bus Architecture: MULTIPLE

Enhances data processing speed and efficiency within the DSP.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

Indicates the specialized functionality of the DSP for digital signal processing tasks.

Technical Specifications

Digital Signal Processors (DSPs) TMS320C6412AGNZ5 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Additional Features:

ALSO REQUIRES 3.3V SUPPLY

Address Bus Width:

23

Barrel Shifter:

NO

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

75.19 MHz

External Data Bus Width:

64

Format:

FIXED POINT

Integrated Cache:

YES

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B548

JESD-609 Code:

e0

Length:

27 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

4

No. of DMA Channels:

64

No. of External Interrupts:

4

No. of Terminals:

548

No. of Timers:

3

Maximum Operating Temperature:

90 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Equivalence Code:

BGA548,26X26,40

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

220

Power Supplies (V):

1.2,3.3

Qualification:

Not Qualified

RAM Words:

262144

Maximum Seated Height:

2.8 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.26 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

27 mm

Peripheral IC Type:

Trade Compliance

TMS320C6412AGNZ5 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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