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TMS320C6205GWT200

Texas Instruments

TMS320C6205GWT200 by Texas Instruments

TMS320C6205GWT200 by Texas Instruments is a 32-bit DSP with integrated cache, 32-bit external data bus width, and max clock frequency of 200 MHz. Ideal for digital signal processing applications requiring low power consumption and high-speed performance in a compact square package.

Median Price

$21.950

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 13 parts In-Stock

1+ parts

$21.950

100+ parts

$17.290

1k+ parts

$15.700

10k+ parts

$14.080

13

$21.950

$17.290

$15.700

$14.080

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,033 parts In-Stock

1+ parts

$20.852

100+ parts

-

1k+ parts

-

10k+ parts

-

1,033

$20.852

-

-

-

Vyrian

USA . 2,944 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,944

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 475 parts In-Stock

1+ parts

$16.412

100+ parts

-

1k+ parts

$16.706

10k+ parts

-

475

$16.412

-

$16.706

-

DigiPath Technology Company

USA . 463 parts In-Stock

1+ parts

$18.072

100+ parts

$16.626

1k+ parts

-

10k+ parts

-

463

$18.072

$16.626

-

-

ChromeModa Solutions

Germany . 6,393 parts In-Stock

1+ parts

$18.441

100+ parts

$15.122

1k+ parts

-

10k+ parts

-

6,393

$18.441

$15.122

-

-

IDEA Electronic Components Group

UK . 1,193 parts In-Stock

1+ parts

$18.441

100+ parts

$17.519

1k+ parts

$16.597

10k+ parts

-

1,193

$18.441

$17.519

$16.597

-

Corphita

USA . 2,998 parts In-Stock

1+ parts

$19.755

100+ parts

-

1k+ parts

-

10k+ parts

-

2,998

$19.755

-

-

-

Microchip USA

USA . 2,198 parts In-Stock

1+ parts

$25.310

100+ parts

$24.950

1k+ parts

$24.770

10k+ parts

$24.590

2,198

$25.310

$24.950

$24.770

$24.590

Corohmni

South Africa . 729 parts In-Stock

1+ parts

$36.043

100+ parts

-

1k+ parts

-

10k+ parts

-

729

$36.043

-

-

-

Overview

Unlock the power of digital signal processing with the TMS320C6205GWT200 by Texas Instruments. This high-quality DSP offers integrated cache, low power mode, and boundary scan capabilities, making it perfect for a wide range of applications. With Texas Instruments' reputation for excellence in semiconductor manufacturing, you can trust that this product delivers exceptional performance and reliability. Experience the value and benefits of this versatile DSP in your next project and take your designs to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material is durable and cost-effective, making the product suitable for a wide range of applications.

Integrated Cache: YES

Integrated cache helps in faster data access and processing, improving the overall performance of the DSP.

Maximum Supply Voltage: 1.57 V

Higher maximum supply voltage allows for flexibility in power input, ensuring stable operation in varying conditions.

Address Bus Width: 32

A wider address bus allows for accessing a larger memory space, enabling the DSP to handle complex computations efficiently.

Maximum Operating Temperature: 90 °C

High maximum operating temperature ensures reliability in demanding environments without risking overheating or malfunction.

Bit Size: 32

32-bit architecture allows for processing larger chunks of data at a time, improving performance and computational capabilities of the DSP.

Maximum Clock Frequency: 200 MHz

High clock frequency enables faster processing speed, making the DSP suitable for real-time signal processing applications.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity, making the DSP energy-efficient and reliable.

ROM Programmability: FLASH

Flash programmable ROM allows for easy firmware updates and customization, enhancing the flexibility and versatility of the DSP.

Technical Specifications

Digital Signal Processors (DSPs) TMS320C6205GWT200 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Additional Features:

ALSO REQUIRES 3.3V SUPPLY

Address Bus Width:

32

Barrel Shifter:

NO

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

200 MHz

External Data Bus Width:

32

Format:

FIXED POINT

Integrated Cache:

YES

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B288

JESD-609 Code:

e0

Length:

16 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

4

No. of External Interrupts:

4

No. of Terminals:

288

No. of Timers:

2

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

90 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA288,19X19,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

220

RAM Words:

65536

ROM Programmability:

FLASH

Maximum Seated Height:

1.4 mm

Maximum Supply Current:

290 mA

Maximum Supply Voltage:

1.57 V

Minimum Supply Voltage:

1.43 V

Nominal Supply Voltage:

1.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

20

Width:

16 mm

Peripheral IC Type:

Trade Compliance

TMS320C6205GWT200 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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