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TMS320C6205GHKA200

Texas Instruments

TMS320C6205GHKA200 by Texas Instruments

TMS320C6205GHKA200 by Texas Instruments is a 32-bit DSP with 8-word cache, 32-bit address bus, and 200 MHz clock frequency. Ideal for industrial applications requiring low power consumption and fixed-point format processing. Features include integrated cache, multiple internal bus architecture, and boundary scan capability.

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Vyrian

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Digiode

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AZTECH Wire

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One Stop Electronics

USA . 664 parts In-Stock

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Corohmni

South Africa . 869 parts In-Stock

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$27.669

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Parana Technologies

USA . 359 parts In-Stock

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DigiPath Technology Company

USA . 410 parts In-Stock

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$45.694

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$42.039

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ChromeModa Solutions

Germany . 4,072 parts In-Stock

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$46.627

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$38.234

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IDEA Electronic Components Group

UK . 1,566 parts In-Stock

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$46.627

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$44.296

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$41.964

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Corphita

USA . 4,885 parts In-Stock

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Authorized Procurement Solutions

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Microchip USA

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Overview

Unlock the power of cutting-edge technology with the Texas Instruments TMS320C6205GHKA200 Digital Signal Processor. Renowned for its exceptional quality and reliability, Texas Instruments delivers state-of-the-art solutions for a wide range of applications. Whether you're in need of advanced signal processing capabilities or high-performance computing, this DSP offers unmatched value, benefits, and advantages for all your processing needs. Experience seamless operation and superior performance with the TMS320C6205GHKA200 - the ultimate choice for innovative solutions in the digital signal processing arena.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package body material makes the DSP lightweight and durable, making it easy to handle and resistant to damage during handling and transportation.

Integrated Cache: YES

Having an integrated cache improves the performance of the DSP by reducing the access time to frequently used instructions and data, enhancing overall processing speed.

Maximum Supply Voltage: 1.57 V

The maximum supply voltage of 1.57 V ensures that the DSP operates within safe voltage limits, preventing any potential damage to the device.

On Chip Data RAM Width: 8

The 8-bit wide on-chip data RAM allows for efficient storage and retrieval of data, enhancing the speed and efficiency of data processing operations.

Address Bus Width: 32

With a 32-bit wide address bus, the DSP can access a large memory address space, enabling it to handle complex computations and process a vast amount of data.

Package Shape: SQUARE

The square package shape provides a compact form factor, making it easier to integrate the DSP into various electronic devices and systems.

Bit Size: 32

Operating on a 32-bit architecture allows the DSP to handle large data sets and perform complex calculations with high precision and accuracy.

Power Supplies (V): 1.5,3.3,5

Supporting multiple power supply voltages (1.5V, 3.3V, 5V) gives flexibility in design and compatibility with different power sources, making it versatile for various applications.

No. of Terminals: 288

The high number of terminals provides ample connectivity options for interfacing with external components, peripherals, and communication interfaces, enhancing the DSP's functionality.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

The grid array, low profile, and fine pitch package style offers high-density packaging, optimizing space utilization and facilitating efficient heat dissipation for improved performance.

Minimum Supply Voltage: 1.43 V

The minimum supply voltage of 1.43V ensures the DSP can operate reliably even under low voltage conditions, providing stability and continued functionality.

Maximum Operating Temperature: 105 °C

With a maximum operating temperature of 105°C, the DSP can withstand high temperature environments, making it suitable for industrial applications.

No. of External Interrupts: 4

Having 4 external interrupts allows the DSP to respond quickly to external events and prioritize tasks, enhancing real-time processing capabilities.

Minimum Operating Temperature: -40 °C

The DSP's ability to operate in temperatures as low as -40°C ensures reliable performance in harsh environmental conditions, making it suitable for a wide range of applications.

Terminal Finish: TIN LEAD

The tin-lead terminal finish provides good solderability, ensuring reliable electrical connections and ease of assembly during manufacturing processes.

Terminal Position: BOTTOM

The terminals positioned at the bottom of the DSP facilitate easy mounting and soldering onto circuit boards, simplifying the assembly process.

Maximum Seated Height: 1.4 mm

The low maximum seated height of 1.4 mm minimizes the profile of the DSP, allowing it to be used in space-constrained applications without compromising performance.

RAM Words: 16384

With 16384 RAM words, the DSP has sufficient memory capacity to store and manipulate data efficiently, enabling it to handle complex algorithms and processing tasks effectively.

Width: 16 mm

The 16 mm width of the DSP allows for compact integration into electronic devices, maximizing space efficiency and enabling sleek design aesthetics.

Boundary Scan: YES

Boundary scan capability enables efficient testing and debugging of the DSP during manufacturing and maintenance, ensuring high product quality and reliability.

External Data Bus Width: 32

With a 32-bit wide external data bus, the DSP can efficiently transfer data to and from external devices, enabling high-speed data communication and processing.

Maximum Clock Frequency: 200 MHz

Operating at a maximum clock frequency of 200 MHz, the DSP delivers fast performance, allowing for rapid data processing and real-time computations.

Maximum Time At Peak Reflow Temperature (s): 20

The maximum time allowance of 20 seconds at peak reflow temperature of 220°C ensures proper soldering and reliability during the manufacturing process.

Peak Reflow Temperature °C: 220

The peak reflow temperature of 220°C guarantees sufficient heat exposure for solder reflow, leading to reliable and durable solder joints.

Internal Bus Architecture: MULTIPLE

Utilizing multiple internal buses allows for efficient data transfer and parallel processing within the DSP, enhancing performance and overall speed of the device.

Length: 16 mm

With a length of 16 mm, the DSP maintains a compact form factor, making it suitable for space-constrained applications while delivering high processing capabilities.

Temperature Grade: INDUSTRIAL

Designed for industrial temperature ranges, the DSP can operate reliably in demanding environments, ensuring performance consistency in critical applications.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

The DSP serves as a specialized peripheral integrated circuit, dedicated to processing digital signals efficiently, providing enhanced performance and capabilities for signal processing tasks.

No. of Timers: 2

Having 2 timers allows the DSP to schedule and control timing operations accurately, enabling precise synchronization of tasks and real-time processing capabilities.

Technology: CMOS

Utilizing CMOS technology ensures low power consumption, high speed, and reliable performance for the DSP, making it energy-efficient and suitable for battery-powered applications.

Terminal Form: BALL

The ball terminal form facilitates soldering and mounting of the DSP on circuit boards, ensuring secure connections and reliable performance in electronic systems.

Nominal Supply Voltage: 1.5 V

The nominal supply voltage of 1.5V provides stable power delivery to the DSP, ensuring consistent performance and reliability in a variety of operating conditions.

No. of DMA Channels: 4

Having 4 direct memory access (DMA) channels allows for efficient data transfer between memory and peripherals, reducing processor overhead and improving overall system performance.

Terminal Pitch: 0.8 mm

The 0.8 mm terminal pitch provides precise spacing for the terminals, enabling easy assembly and soldering of the DSP onto circuit boards, ensuring reliable connections.

Format: FIXED POINT

Operating in fixed-point format simplifies arithmetic operations and improves processing speed, making the DSP efficient for numerical calculations and digital signal processing tasks.

Moisture Sensitivity Level (MSL): 3

With an MSL of 3, the DSP has moderate moisture sensitivity, requiring standard handling precautions during storage and assembly to prevent any moisture-related damage.

Low Power Mode: YES

The low power mode feature allows the DSP to conserve energy during idle periods or low processing loads, extending battery life and reducing power consumption in portable devices.

On Chip Program ROM Width: 8

The 8-bit wide on-chip program ROM enhances program storage capacity and facilitates quick access to program instructions, ensuring efficient execution of algorithms and functions.

Technical Specifications

Digital Signal Processors (DSPs) TMS320C6205GHKA200 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Additional Features:

ALSO REQUIRES 3.3V SUPPLY

Address Bus Width:

32

Barrel Shifter:

NO

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

200 MHz

External Data Bus Width:

32

Format:

FIXED POINT

Integrated Cache:

YES

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B288

JESD-609 Code:

e0

Length:

16 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

4

No. of External Interrupts:

4

No. of Terminals:

288

No. of Timers:

2

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA288,19X19,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

220

Power Supplies (V):

1.5,3.3,5

Qualification:

Not Qualified

RAM Words:

16384

Maximum Seated Height:

1.4 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.57 V

Minimum Supply Voltage:

1.43 V

Nominal Supply Voltage:

1.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

20

Width:

16 mm

Peripheral IC Type:

Trade Compliance

TMS320C6205GHKA200 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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