Loading...

TMS320C6204GHKA200

Texas Instruments

TMS320C6204GHKA200 by Texas Instruments

TMS320C6204GHKA200 by Texas Instruments is a 32-bit DSP with 1.57V max supply voltage, 200MHz clock frequency, and 288 terminals. Ideal for industrial applications, it features integrated cache, 8-bit RAM width, and boundary scan capability for efficient digital signal processing tasks.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,579 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,579

-

-

-

-

Digiode

USA . 1,428 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,428

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 408 parts In-Stock

1+ parts

$7.000

100+ parts

-

1k+ parts

-

10k+ parts

-

408

$7.000

-

-

-

AZTECH Wire

Italy . 456 parts In-Stock

1+ parts

$14.657

100+ parts

-

1k+ parts

-

10k+ parts

-

456

$14.657

-

-

-

Corohmni

South Africa . 83 parts In-Stock

1+ parts

$43.632

100+ parts

-

1k+ parts

-

10k+ parts

-

83

$43.632

-

-

-

Parana Technologies

USA . 2,228 parts In-Stock

1+ parts

$68.168

100+ parts

-

1k+ parts

-

10k+ parts

-

2,228

$68.168

-

-

-

DigiPath Technology Company

USA . 184 parts In-Stock

1+ parts

$75.061

100+ parts

$69.056

1k+ parts

-

10k+ parts

-

184

$75.061

$69.056

-

-

ChromeModa Solutions

Germany . 6,360 parts In-Stock

1+ parts

$76.593

100+ parts

$62.806

1k+ parts

-

10k+ parts

-

6,360

$76.593

$62.806

-

-

IDEA Electronic Components Group

UK . 1,291 parts In-Stock

1+ parts

$76.593

100+ parts

$72.763

1k+ parts

$68.934

10k+ parts

-

1,291

$76.593

$72.763

$68.934

-

Component Stockers USA

USA . 440 parts In-Stock

1+ parts

$99.990

100+ parts

-

1k+ parts

-

10k+ parts

-

440

$99.990

-

-

-

Corphita

USA . 3,717 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,717

-

-

-

-

Microchip USA

USA . 437 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

437

-

-

-

-

Overview

Unlock the power of digital signal processing with the TMS320C6204GHKA200 by Texas Instruments. As a leader in cutting-edge technology, Texas Instruments delivers exceptional quality and reliability in every product they create. The TMS320C6204GHKA200 is a versatile DSP that can be utilized in a wide range of applications, offering customers unparalleled value and benefits. Experience high performance, integrated cache, and low power mode, all packed into a compact package that is perfect for industrial use. Trust Texas Instruments to provide you with the tools you need to take your projects to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection to the components inside the package, ensuring reliability in various environments.

Integrated Cache: YES

The integrated cache improves processing speed by storing frequently used data and instructions, reducing access time and enhancing overall performance.

Maximum Supply Voltage: 1.57 V

With a relatively high maximum supply voltage, this DSP can handle fluctuations in the power supply without compromising its operation.

Address Bus Width: 22

A wider address bus allows for addressing a larger memory space, enabling more complex algorithms and programs to be run efficiently.

Bit Size: 32

The 32-bit architecture allows for processing larger chunks of data at once, increasing computational efficiency and performance.

Maximum Operating Temperature: 105 °C

The high operating temperature range makes this DSP suitable for industrial applications where temperature variations are common.

Technology: CMOS

CMOS technology offers low power consumption, making the DSP energy-efficient and suitable for applications requiring extended battery life.

Maximum Clock Frequency: 200 MHz

A high clock frequency enables quick processing of data and instructions, making the DSP suitable for real-time signal processing applications.

Technical Specifications

Digital Signal Processors (DSPs) TMS320C6204GHKA200 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Additional Features:

ALSO REQUIRES 3.3V SUPPLY

Address Bus Width:

22

Barrel Shifter:

NO

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

200 MHz

External Data Bus Width:

32

Format:

FIXED POINT

Integrated Cache:

YES

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B288

JESD-609 Code:

e0

Length:

16 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

4

No. of External Interrupts:

4

No. of Terminals:

288

No. of Timers:

2

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA288,19X19,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

220

Power Supplies (V):

1.5,3.3

Qualification:

Not Qualified

RAM Words:

65536

ROM Programmability:

MROM

Maximum Seated Height:

1.4 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Current:

290 mA

Maximum Supply Voltage:

1.57 V

Minimum Supply Voltage:

1.43 V

Nominal Supply Voltage:

1.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

20

Width:

16 mm

Peripheral IC Type:

Trade Compliance

TMS320C6204GHKA200 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

New products
from Texas Instruments 7

Similar products 20