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TMS320C6203BGNZ300

Texas Instruments

TMS320C6203BGNZ300 by Texas Instruments

TMS320C6203BGNZ300 by Texas Instruments is a 32-bit DSP with integrated cache, 300 MHz clock frequency, and 524288 RAM words. Ideal for digital signal processing applications requiring high-speed data processing and low power consumption. Features include multiple internal bus architecture, boundary scan support, and 1mm terminal pitch.

Median Price

$117.878

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 1,171 parts In-Stock

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-

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$104.780

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$93.750

10k+ parts

$88.230

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$93.750

$88.230

Verical

USA . 1,126 parts In-Stock

1+ parts

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$130.975

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$117.188

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$110.287

1,126

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$130.975

$117.188

$110.287

Distributors (In-Stock)

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Digiode

USA . 2,787 parts In-Stock

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$110.590

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$110.590

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DigiKey Marketplace

USA . 1,630 parts In-Stock

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$121.080

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Vyrian

USA . 2,128 parts In-Stock

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Bristol Electronics

USA . 124 parts In-Stock

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Atlantic Semiconductor

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Distributors (Availability)

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Parana Technologies

USA . 1,963 parts In-Stock

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$38.153

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$38.153

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DigiPath Technology Company

USA . 2,013 parts In-Stock

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$42.012

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$38.651

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$42.012

$38.651

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IDEA Electronic Components Group

UK . 2,355 parts In-Stock

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$42.869

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$40.726

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$38.582

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$42.869

$40.726

$38.582

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ChromeModa Solutions

Germany . 1,165 parts In-Stock

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$42.869

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$35.153

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Corohmni

South Africa . 1,886 parts In-Stock

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Corphita

USA . 1,911 parts In-Stock

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Microchip USA

USA . 1,618 parts In-Stock

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$178.607

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Kepictronics

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Authorized Procurement Solutions

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Perfect Parts

USA . 728 parts In-Stock

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Overview

Unlock the power of digital signal processing with the TMS320C6203BGNZ300 by Texas Instruments. This cutting-edge DSP offers unparalleled performance and reliability, thanks to its integrated cache and advanced internal bus architecture. Whether you're working on audio processing, telecommunications, or industrial control applications, this versatile chip delivers the speed and precision you need. Trust in Texas Instruments' reputation for quality and innovation, and experience the value and efficiency that the TMS320C6203BGNZ300 brings to your projects. Upgrade your designs today and see the difference for yourself.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, ensuring a longer lifespan for the product.

Integrated Cache: YES

Improves processing speed by storing frequently accessed data for quick retrieval.

Maximum Supply Voltage: 1.57 V

Allows for efficient power usage while providing enough voltage for optimal performance.

On Chip Data RAM Width: 8

Enables simultaneous processing of multiple data streams, increasing overall efficiency.

Address Bus Width: 22

Allows for a larger memory address space, accommodating complex algorithms and calculations.

Package Shape: SQUARE

Facilitates easy integration into circuit boards, maximizing space efficiency.

Bit Size: 32

Provides high processing power for handling intricate digital signals and data.

Power Supplies (V): 1.5,3.3

Supports multiple voltage options for compatibility with various electronic systems.

No. of Terminals: 352

Offers a wide range of connectivity options for interfacing with other components.

Minimum Supply Voltage: 1.43 V

Ensures stable operation even under low voltage conditions, improving reliability.

Maximum Operating Temperature: 90 °C

Can withstand high temperatures without compromising performance, suitable for industrial applications.

No. of External Interrupts: 4

Allows for efficient handling of external events or signals, enhancing responsiveness.

Minimum Operating Temperature: 0 °C

Can operate in a wide range of temperatures, making it versatile for different environments.

Terminal Finish: Tin/Lead (Sn/Pb)

Provides reliable electrical connections and solder joints for stability during operation.

Maximum Seated Height: 2.8 mm

Low profile design for compact integration into small electronic devices.

RAM Words: 524288

Large memory capacity for storing and processing large amounts of data efficiently.

Width: 27 mm

Compact size for easy placement on PCBs with limited space.

Boundary Scan: YES

Facilitates testing and debugging of the chip during production and maintenance.

External Data Bus Width: 32

Allows for fast data transfer between the processor and external devices.

Maximum Clock Frequency: 300 MHz

High clock speed for rapid processing of digital signals and data.

Peak Reflow Temperature °C: 220

Can withstand high reflow temperatures during manufacturing processes.

Internal Bus Architecture: MULTIPLE

Efficient internal data routing for optimized performance and speed.

Length: 27 mm

Compact design for space-saving integration in electronic systems.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

Versatile functionality for diverse signal processing applications.

No. of Timers: 2

Facilitates timing and synchronization tasks in digital signal processing operations.

Technology: CMOS

Uses low power consumption CMOS technology for energy-efficient operation.

Terminal Form: BALL

Ball terminal design for secure connections and easy soldering.

Nominal Supply Voltage: 1.5 V

Stable voltage supply for consistent and reliable performance.

No. of DMA Channels: 4

Enables efficient data transfer and management for high-speed processing.

ROM Programmability: MROM

Non-volatile programmable memory for storing essential software and instructions.

Terminal Pitch: 1 mm

Standard terminal pitch for easy mounting on PCBs.

Format: FIXED POINT

Accurate and precise fixed-point arithmetic for digital signal processing tasks.

Moisture Sensitivity Level (MSL): 4

Designed to withstand moderate humidity levels during operation and storage.

Low Power Mode: YES

Provides energy-saving options for extended battery life in portable devices.

On Chip Program ROM Width: 8

Internal ROM for storing program instructions, enhancing processing speed.

Technical Specifications

Digital Signal Processors (DSPs) TMS320C6203BGNZ300 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Additional Features:

ALSO REQUIRES 3.3V SUPPLY

Address Bus Width:

22

Barrel Shifter:

NO

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

300 MHz

External Data Bus Width:

32

Format:

FIXED POINT

Integrated Cache:

YES

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B352

JESD-609 Code:

e0

Length:

27 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

4

No. of DMA Channels:

4

No. of External Interrupts:

4

No. of Terminals:

352

No. of Timers:

2

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

90 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Equivalence Code:

BGA352,26X26,40

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

220

Power Supplies (V):

1.5,3.3

Qualification:

Not Qualified

RAM Words:

524288

ROM Programmability:

MROM

Maximum Seated Height:

2.8 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.57 V

Minimum Supply Voltage:

1.43 V

Nominal Supply Voltage:

1.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

27 mm

Peripheral IC Type:

Trade Compliance

TMS320C6203BGNZ300 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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