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TMS320C6202GJLA200

Texas Instruments

TMS320C6202GJLA200 by Texas Instruments

TMS320C6202GJLA200 by Texas Instruments is a 32-bit DSP with 8-word cache, 22-bit address bus, and 32-bit external data bus. It operates at up to 200 MHz clock frequency and is ideal for industrial applications requiring high-speed signal processing in a compact package.

Median Price

$144.550

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 387 parts In-Stock

1+ parts

$144.550

100+ parts

$141.670

1k+ parts

$138.780

10k+ parts

-

387

$144.550

$141.670

$138.780

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Verical

USA . 131 parts In-Stock

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Distributors (In-Stock)

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Digiode

USA . 4,369 parts In-Stock

1+ parts

$202.322

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4,369

$202.322

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Vyrian

USA . 4,231 parts In-Stock

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4,231

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DigiKey Marketplace

USA . 373 parts In-Stock

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373

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Bristol Electronics

USA . 279 parts In-Stock

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Dan-Mar Components

USA . 279 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 160 parts In-Stock

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Distributors (Availability)

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Parana Technologies

USA . 1,770 parts In-Stock

1+ parts

$42.275

100+ parts

-

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1,770

$42.275

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DigiPath Technology Company

USA . 17 parts In-Stock

1+ parts

$46.550

100+ parts

$42.826

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17

$46.550

$42.826

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ChromeModa Solutions

Germany . 3,482 parts In-Stock

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$47.500

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$38.950

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3,482

$47.500

$38.950

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IDEA Electronic Components Group

UK . 23 parts In-Stock

1+ parts

$47.500

100+ parts

$45.125

1k+ parts

$42.750

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23

$47.500

$45.125

$42.750

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Corphita

USA . 792 parts In-Stock

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$191.673

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792

$191.673

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Component Stockers USA

USA . 372 parts In-Stock

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$196.620

100+ parts

$184.830

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372

$196.620

$184.830

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Corohmni

South Africa . 700 parts In-Stock

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$207.423

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700

$207.423

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Microchip USA

USA . 248 parts In-Stock

1+ parts

$225.940

100+ parts

$219.920

1k+ parts

$216.900

10k+ parts

$213.890

248

$225.940

$219.920

$216.900

$213.890

Authorized Procurement Solutions

USA . 1,000 parts In-Stock

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Epart123

USA . 500 parts In-Stock

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$245.000

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$235.000

500

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$245.000

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$235.000

Perfect Parts

USA . 123 parts In-Stock

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Overview

Experience unparalleled performance and efficiency with the TMS320C6202GJLA200 from Texas Instruments. As a leader in digital signal processors, TI delivers cutting-edge technology that revolutionizes industries such as telecommunications, automotive, and consumer electronics. This DSP boasts integrated cache, multiple power supplies, and boundary scan capabilities, making it versatile for a wide range of applications. Whether you're optimizing audio processing or enhancing image recognition, the TMS320C6202GJLA200 offers maximum value with minimal power consumption. Upgrade your products today with this top-of-the-line solution from Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is cost-effective and durable, making the product suitable for a wide range of applications.

Integrated Cache: YES

Having an integrated cache helps in improving the processing speed and efficiency of the DSP.

Maximum Supply Voltage: 1.89 V

Higher maximum supply voltage allows for flexibility in power supply options.

Bit Size: 32

A 32-bit architecture enables handling of larger data sets and processing tasks efficiently.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature tolerance ensures reliable performance in harsh operating environments.

Maximum Clock Frequency: 200 MHz

A high clock frequency enables fast data processing and system responsiveness.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the product energy efficient and reliable.

ROM Programmability: MROM

MROM (Mask ROM) provides secure and permanent storage of firmware or software, enhancing data integrity and security.

Low Power Mode: YES

The low power mode feature helps in reducing power consumption during idle or low processing tasks, enhancing energy efficiency.

Technical Specifications

Digital Signal Processors (DSPs) TMS320C6202GJLA200 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Additional Features:

ALSO REQUIRES 3.3V SUPPLY

Address Bus Width:

22

Barrel Shifter:

NO

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

200 MHz

External Data Bus Width:

32

Format:

FIXED POINT

Integrated Cache:

YES

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B352

JESD-609 Code:

e0

Length:

27 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

4

No. of DMA Channels:

4

No. of External Interrupts:

4

No. of Terminals:

352

No. of Timers:

2

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA352,26X26,40

Package Shape:

Package Style (Meter):

GRID ARRAY, HEAT SINK/SLUG

Peak Reflow Temperature (C):

220

Power Supplies (V):

1.8,3.3

Qualification:

Not Qualified

RAM Words:

32768

ROM Programmability:

MROM

Maximum Seated Height:

3.8 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.89 V

Minimum Supply Voltage:

1.71 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

20

Width:

27 mm

Peripheral IC Type:

Trade Compliance

TMS320C6202GJLA200 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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