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TMS320C6202BGNY250

Texas Instruments

TMS320C6202BGNY250 by Texas Instruments

TMS320C6202BGNY250 by Texas Instruments is a 32-bit DSP with 32768 RAM words, 250 MHz clock frequency, and 384 terminals. Ideal for digital signal processing applications, it features integrated cache, 1.5-3.3V power supplies, and boundary scan capability.

Median Price

$117.652

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 646 parts In-Stock

1+ parts

-

100+ parts

$104.580

1k+ parts

$93.570

10k+ parts

$88.060

646

-

$104.580

$93.570

$88.060

DigiKey

USA . 646 parts In-Stock

1+ parts

-

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646

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Verical

USA . 549 parts In-Stock

1+ parts

-

100+ parts

$130.725

1k+ parts

$116.963

10k+ parts

$110.075

549

-

$130.725

$116.963

$110.075

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,844 parts In-Stock

1+ parts

$94.031

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-

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3,844

$94.031

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Vyrian

USA . 5,118 parts In-Stock

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5,118

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DigiKey Marketplace

USA . 646 parts In-Stock

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646

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Lantek

USA . 20 parts In-Stock

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20

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Distributors (Availability)

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Corohmni

South Africa . 1,870 parts In-Stock

1+ parts

$16.007

100+ parts

-

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1,870

$16.007

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Parana Technologies

USA . 336 parts In-Stock

1+ parts

$72.175

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-

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336

$72.175

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IDEA Electronic Components Group

UK . 2,160 parts In-Stock

1+ parts

$81.096

100+ parts

$77.041

1k+ parts

$72.986

10k+ parts

-

2,160

$81.096

$77.041

$72.986

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ChromeModa Solutions

Germany . 972 parts In-Stock

1+ parts

$81.096

100+ parts

$66.499

1k+ parts

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972

$81.096

$66.499

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Ampacity Inc.

Singapore . 558 parts In-Stock

1+ parts

$84.130

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558

$84.130

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Corphita

USA . 1,670 parts In-Stock

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$89.082

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1,670

$89.082

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Microchip USA

USA . 1,544 parts In-Stock

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$208.620

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1,544

$208.620

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DigiPath Technology Company

USA . 1,572 parts In-Stock

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$73.116

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1,572

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$73.116

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Authorized Procurement Solutions

USA . 140 parts In-Stock

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140

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GreenTree Electronics

Israel . 50 parts In-Stock

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50

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Overview

Discover the power of the TMS320C6202BGNY250 by Texas Instruments, a top-tier manufacturer renowned for its high-quality digital signal processors. Ideal for a wide range of applications, this DSP offers integrated cache and low power mode, making it a valuable asset for your projects. With a maximum clock frequency of 250 MHz and multiple internal bus architecture, this product provides exceptional performance and efficiency. Embrace innovation and elevate your designs with the TMS320C6202BGNY250.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the DSP, making it suitable for various environments.

Integrated Cache: YES

The integrated cache improves processing speed by storing frequently accessed data, increasing overall performance.

Maximum Supply Voltage: 1.57 V

This voltage range allows for efficient power usage while maintaining optimal performance.

Address Bus Width: 22

A wider address bus width allows for accessing larger memory spaces, increasing versatility and capability.

Bit Size: 32

A 32-bit architecture enables faster computation and processing of data, enhancing speed and efficiency.

Maximum Clock Frequency: 250 MHz

With a high clock frequency, this DSP can handle complex signal processing tasks with speed and accuracy.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, enhancing the efficiency and reliability of the DSP.

Technical Specifications

Digital Signal Processors (DSPs) TMS320C6202BGNY250 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Additional Features:

ALSO REQUIRES 3.3V SUPPLY

Address Bus Width:

22

Barrel Shifter:

NO

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

250 MHz

External Data Bus Width:

32

Format:

FIXED POINT

Integrated Cache:

YES

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B384

JESD-609 Code:

e0

Length:

18 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

4

No. of DMA Channels:

4

No. of External Interrupts:

4

No. of Terminals:

384

No. of Timers:

2

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

90 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA384,22X22,32

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Peak Reflow Temperature (C):

220

Power Supplies (V):

1.5,3.3

Qualification:

Not Qualified

RAM Words:

32768

ROM Programmability:

MROM

Maximum Seated Height:

2.35 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.57 V

Minimum Supply Voltage:

1.43 V

Nominal Supply Voltage:

1.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

20

Width:

18 mm

Peripheral IC Type:

Trade Compliance

TMS320C6202BGNY250 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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