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TMS320C6201GGP167

Texas Instruments

TMS320C6201GGP167 by Texas Instruments

TMS320C6201GGP167 by Texas Instruments is a 32-bit DSP with 22-bit address bus, 32-bit external data bus, and max clock frequency of 167 MHz. Ideal for digital signal processing applications requiring low power consumption and fixed-point format calculations.

Median Price

$91.946

Lifecycle Status

Suppliers In-Stock

13

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 312 parts In-Stock

1+ parts

-

100+ parts

$81.730

1k+ parts

$73.130

10k+ parts

$68.820

312

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$81.730

$73.130

$68.820

DigiKey

USA . 312 parts In-Stock

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312

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Verical

USA . 312 parts In-Stock

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$102.162

1k+ parts

$91.412

10k+ parts

$86.025

312

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$102.162

$91.412

$86.025

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,277 parts In-Stock

1+ parts

$86.270

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1,277

$86.270

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Vyrian

USA . 5,677 parts In-Stock

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5,677

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Inland Empire Components Inc.

USA . 270 parts In-Stock

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270

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Resion

USA . 172 parts In-Stock

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Prism Electronics

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Lantek

USA . 110 parts In-Stock

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110

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Bristol Electronics

USA . 70 parts In-Stock

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70

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Semi Source

USA . 18 parts In-Stock

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DF Sales Co.

USA . 5 parts In-Stock

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DF Sales Co.

USA . 5 parts In-Stock

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Distributors (Availability)

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Parana Technologies

USA . 1,117 parts In-Stock

1+ parts

$31.049

100+ parts

-

1k+ parts

$71.759

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1,117

$31.049

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$71.759

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DigiPath Technology Company

USA . 1,286 parts In-Stock

1+ parts

$34.188

100+ parts

$31.453

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1,286

$34.188

$31.453

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ChromeModa Solutions

Germany . 5,596 parts In-Stock

1+ parts

$34.886

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$28.607

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5,596

$34.886

$28.607

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IDEA Electronic Components Group

UK . 2,048 parts In-Stock

1+ parts

$34.886

100+ parts

$33.142

1k+ parts

$31.397

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2,048

$34.886

$33.142

$31.397

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Corohmni

South Africa . 2,946 parts In-Stock

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$80.970

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$80.970

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Corphita

USA . 2,146 parts In-Stock

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$81.729

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2,146

$81.729

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Authorized Procurement Solutions

USA . 4,000 parts In-Stock

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Emar International I/E

Canada . 1,325 parts In-Stock

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Perfect Parts

USA . 420 parts In-Stock

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GreenTree Electronics

Israel . 110 parts In-Stock

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Assy Fe

Spain . 22 parts In-Stock

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Overview

Experience unparalleled performance and reliability with the TMS320C6201GGP167 from Texas Instruments, a leading manufacturer in the field of Digital Signal Processors (DSPs). This cutting-edge product offers a wide range of applications, delivering exceptional value and benefits to customers. With its advanced technology and high-quality components, this DSP ensures optimal performance for all your signal processing needs. Trust Texas Instruments for top-notch products that deliver results you can count on.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic and epoxy material provides durability and reliability for the package body, ensuring the longevity of the product.

Surface Mount: YES

Surface mount capability allows for easy installation and integration into various electronic devices.

Maximum Supply Voltage: 1.89 V

Allows for a higher supply voltage, providing flexibility in power requirements.

Address Bus Width: 22

Wide address bus width enables efficient memory access and processing capabilities.

Package Shape: SQUARE

Square package shape allows for easier placement and layout in PCB designs.

Bit Size: 32

32-bit architecture allows for high-performance processing and data handling capabilities.

Power Supplies (V): 2.5,3.3

Support for multiple power supply options gives flexibility in powering the device.

No. of Terminals: 352

High number of terminals provide connectivity options and flexibility for interfacing with other components.

Package Style (Meter): GRID ARRAY, LOW PROFILE

Grid array and low profile package style offer efficient space utilization and easy installation in compact devices.

Minimum Supply Voltage: 1.71 V

Low minimum supply voltage helps in energy efficiency and power savings.

Terminal Position: BOTTOM

Bottom terminal position facilitates easy mounting and soldering on PCBs.

Maximum Seated Height: 1.7 mm

Low seated height enables compact designs and space-saving in electronic devices.

RAM Words: 16384

Large RAM capacity allows for efficient data storage and processing in real-time applications.

Width: 35 mm

Compact width size enables easy integration into various electronic devices and PCB layouts.

Boundary Scan: YES

Boundary scan feature helps in testing and debugging of the device during manufacturing and troubleshooting.

External Data Bus Width: 32

Wide external data bus width supports high-speed data transfer and processing capabilities.

Maximum Clock Frequency: 167 MHz

High clock frequency enables faster processing speeds and real-time data handling.

Internal Bus Architecture: MULTIPLE

Multiple internal bus architecture enhances data flow and processing efficiency within the device.

Length: 35 mm

Compact length size allows for easy integration and placement in electronic devices.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

Dedicated peripheral IC type for digital signal processing enhances signal processing capabilities and performance.

Technology: CMOS

CMOS technology offers low power consumption and high performance for efficient operation.

Terminal Form: BALL

Ball terminal form allows for easy soldering and connection with other components on the PCB.

Nominal Supply Voltage: 1.8 V

Stable nominal supply voltage ensures consistent and reliable operation of the device.

Terminal Pitch: 1.27 mm

Optimal terminal pitch spacing facilitates ease of mounting and soldering on PCBs.

Format: FIXED POINT

Fixed point format offers precision and accuracy in numerical calculations and data processing.

Low Power Mode: YES

Low power mode feature helps in reducing power consumption and extending battery life in portable devices.

Technical Specifications

Digital Signal Processors (DSPs) TMS320C6201GGP167 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Additional Features:

ALSO REQUIRES 3.3V SUPPLY

Address Bus Width:

22

Barrel Shifter:

NO

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

167 MHz

External Data Bus Width:

32

Format:

FIXED POINT

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B352

Length:

35 mm

Low Power Mode:

YES

No. of Terminals:

352

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA352,26X26,50

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

2.5,3.3

Qualification:

Not Qualified

RAM Words:

16384

Maximum Seated Height:

1.7 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.89 V

Minimum Supply Voltage:

1.71 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

35 mm

Peripheral IC Type:

Trade Compliance

TMS320C6201GGP167 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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