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TMS320C5545AZQW06

Texas Instruments

TMS320C5545AZQW06 by Texas Instruments

TMS320C5545AZQW06 by Texas Instruments is a DSP with 118 terminals, operating at -10 to 70°C. It has a supply voltage range of 0.998V to 1.15V and features CMOS technology. Ideal for applications requiring low power consumption and fixed-point format processing.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,918 parts In-Stock

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Vyrian

USA . 2,708 parts In-Stock

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2,708

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Distributors (Availability)

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AZTECH Wire

Italy . 227 parts In-Stock

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$12.290

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227

$12.290

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Parana Technologies

USA . 1,390 parts In-Stock

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$21.268

100+ parts

$1,975.087

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$19.141

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1,390

$21.268

$1,975.087

$19.141

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DigiPath Technology Company

USA . 1,290 parts In-Stock

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$23.419

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1,290

$23.419

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ChromeModa Solutions

Germany . 4,464 parts In-Stock

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$23.897

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$19.596

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4,464

$23.897

$19.596

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IDEA Electronic Components Group

UK . 569 parts In-Stock

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$23.897

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$22.702

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$21.507

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569

$23.897

$22.702

$21.507

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One Stop Electronics

USA . 282 parts In-Stock

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$35.000

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282

$35.000

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Corohmni

South Africa . 1,137 parts In-Stock

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$64.919

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$64.919

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Corphita

USA . 3,490 parts In-Stock

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Microchip USA

USA . 111 parts In-Stock

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Overview

Elevate your digital signal processing capabilities with the TMS320C5545AZQW06 by Texas Instruments, a top-tier manufacturer known for delivering high-quality products. This DSP offers unparalleled value and benefits to customers, with applications ranging from audio processing to industrial control systems. Experience the advantages of its advanced technology, low power mode, and precise internal bus architecture, all packaged in a compact, surface-mount design. Upgrade your projects with the TMS320C5545AZQW06 and unlock a new realm of possibilities today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material for the package body makes the product lightweight and durable, ideal for portable devices or applications where weight is a concern.

Surface Mount: YES

Being surface mountable allows for easier and more efficient assembly of the product onto printed circuit boards, saving time and reducing manufacturing costs.

Maximum Supply Voltage: 1.15 V

The high maximum supply voltage ensures compatibility with a wide range of power sources, providing flexibility in design and usage.

Package Shape: SQUARE

The square package shape aids in uniform heat dissipation and efficient use of space on the PCB, contributing to better overall performance and reliability.

No. of Terminals: 118

Having a large number of terminals allows for more connectivity options and integration with other components, offering versatility in system design.

Terminal Form: BALL

The ball terminal form ensures reliable electrical connections and minimizes the risk of solder joint cracking, enhancing the product's durability and longevity.

Technology: CMOS

Utilizing CMOS technology results in low power consumption, enabling the product to operate efficiently and conserve energy, making it suitable for battery-powered devices.

Technical Specifications

Digital Signal Processors (DSPs) TMS320C5545AZQW06 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Address Bus Width:

0

Barrel Shifter:

NO

Boundary Scan:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B118

JESD-609 Code:

e1

Length:

7 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

118

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-10 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1 mm

Maximum Supply Voltage:

1.15 V

Minimum Supply Voltage:

.998 V

Nominal Supply Voltage:

1.05 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7 mm

Peripheral IC Type:

Trade Compliance

TMS320C5545AZQW06 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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