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TMS320C5534AZAY10

Texas Instruments

TMS320C5534AZAY10 by Texas Instruments

TMS320C5534AZAY10 by Texas Instruments is a 16-bit DSP with 131072 RAM words, operating at max 12 MHz clock frequency. Ideal for digital signal processing applications due to its low power mode, multiple internal bus architecture, and 1.3V nominal voltage.

Median Price

$6.674

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 62,980 parts In-Stock

1+ parts

$4.818

100+ parts

$4.221

1k+ parts

$2.385

10k+ parts

-

62,980

$4.818

$4.221

$2.385

-

Mouser Electronics

USA . 320 parts In-Stock

1+ parts

$8.530

100+ parts

$4.940

1k+ parts

$4.100

10k+ parts

$3.940

320

$8.530

$4.940

$4.100

$3.940

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,312 parts In-Stock

1+ parts

$4.577

100+ parts

-

1k+ parts

-

10k+ parts

-

1,312

$4.577

-

-

-

Vyrian

USA . 6,801 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,801

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 4,050 parts In-Stock

1+ parts

$4.336

100+ parts

-

1k+ parts

-

10k+ parts

-

4,050

$4.336

-

-

-

Corohmni

South Africa . 46 parts In-Stock

1+ parts

$49.648

100+ parts

-

1k+ parts

-

10k+ parts

-

46

$49.648

-

-

-

Parana Technologies

USA . 231 parts In-Stock

1+ parts

$51.398

100+ parts

-

1k+ parts

-

10k+ parts

-

231

$51.398

-

-

-

DigiPath Technology Company

USA . 2,134 parts In-Stock

1+ parts

$56.596

100+ parts

$52.068

1k+ parts

-

10k+ parts

-

2,134

$56.596

$52.068

-

-

ChromeModa Solutions

Germany . 1,910 parts In-Stock

1+ parts

$57.751

100+ parts

$47.356

1k+ parts

-

10k+ parts

-

1,910

$57.751

$47.356

-

-

IDEA Electronic Components Group

UK . 1,150 parts In-Stock

1+ parts

$57.751

100+ parts

$54.863

1k+ parts

$51.976

10k+ parts

-

1,150

$57.751

$54.863

$51.976

-

Overview

Unlock the power of cutting-edge technology with the TMS320C5534AZAY10 by Texas Instruments. This high-quality Digital Signal Processor offers unparalleled performance and versatility, making it ideal for a wide range of applications. From audio processing to industrial automation, this DSP delivers reliable and efficient operation, backed by the reputation of a trusted manufacturer. Experience the benefits of seamless integration, advanced features, and superior value with the TMS320C5534AZAY10 – the perfect choice for your next project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material ensures durability and reliability in various operating conditions.

Surface Mount: YES

Surface mount capability allows for easy and efficient installation on PCBs.

Maximum Supply Voltage: 1.43 V

Ability to operate at a maximum supply voltage of 1.43V allows for flexibility in power supply options.

On Chip Data RAM Width: 16

Wide on-chip data RAM width of 16 enables efficient data processing and storage.

Package Shape: SQUARE

Square package shape provides compact form factor for space-constrained applications.

Bit Size: 16

16-bit architecture allows for high-speed processing and accuracy in data calculations.

No. of Terminals: 144

Abundance of terminals offers ample connectivity options for interfacing with external components.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

Grid array package style with low profile and fine pitch enhances overall product reliability and performance.

Minimum Supply Voltage: 1.24 V

Operating at a minimum supply voltage of 1.24V ensures energy efficiency and lower power consumption.

Maximum Operating Temperature: 70 °C

High maximum operating temperature of 70°C allows for reliable performance in demanding environmental conditions.

No. of External Interrupts: 2

Having 2 external interrupts enables efficient handling of external events or signals for timely responses.

Minimum Operating Temperature: -10 °C

Low minimum operating temperature of -10°C ensures operability in cold environments without compromising performance.

Terminal Finish: TIN SILVER COPPER

Terminal finish of tin silver copper provides superior conductivity and corrosion resistance for long-term reliability.

Terminal Position: BOTTOM

Bottom terminal position facilitates ease of PCB layout and assembly, optimizing space utilization.

Maximum Seated Height: 1.4 mm

Low maximum seated height of 1.4mm offers compact design options for space-constrained applications.

RAM Words: 131072

Large RAM capacity of 131072 words enables efficient data storage and retrieval for complex processing tasks.

Width: 12 mm

Compact width of 12mm allows for easy integration into various electronic systems and devices.

Boundary Scan: YES

Boundary scan feature facilitates easy testing and debugging during product development and manufacturing.

Maximum Clock Frequency: 12 MHz

High maximum clock frequency of 12MHz enables fast data processing and real-time operation.

Maximum Time At Peak Reflow Temperature (s): 30

Ability to withstand peak reflow temperature for 30 seconds ensures reliability during soldering processes.

Peak Reflow Temperature °C: 260

High peak reflow temperature of 260°C ensures robust solder joints and reliability in manufacturing processes.

Internal Bus Architecture: MULTIPLE

Multiple internal bus architecture enhances data transfer efficiency and overall system performance.

Length: 12 mm

Compact length of 12mm allows for flexible placement within electronic systems and devices.

Temperature Grade: COMMERCIAL

Commercial temperature grade ensures reliable operation in standard operating environments.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

Peripheral IC type of digital signal processor and other features indicate versatile functionality for various applications.

No. of Timers: 4

Having 4 timers allows for precise timing control and synchronization of tasks within the system.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity for efficient operation.

Terminal Form: BALL

Ball terminal form ensures reliable connections and ease of soldering during PCB assembly.

Nominal Supply Voltage: 1.3 V

Nominal supply voltage of 1.3V provides stable operation and power efficiency for the product.

No. of DMA Channels: 16

Abundance of DMA channels (16) enables efficient data transfer and processing without CPU intervention.

ROM Programmability: MROM

MROM programmability ensures data integrity and security in the read-only memory for critical operations.

Terminal Pitch: 0.8 mm

Narrow terminal pitch of 0.8mm allows for high-density mounting on PCBs and compact design solutions.

Format: FIXED POINT

Fixed-point format offers efficient numerical representation and calculation for digital signal processing tasks.

Moisture Sensitivity Level (MSL): 3

Moisture sensitivity level of 3 indicates moderate sensitivity to moisture, requiring appropriate handling and storage conditions.

Low Power Mode: YES

Low power mode feature enables energy-efficient operation and prolongs battery life in portable devices.

On Chip Program ROM Width: 8

On-chip program ROM width of 8 allows for efficient storage and execution of program instructions for the DSP.

Technical Specifications

Digital Signal Processors (DSPs) TMS320C5534AZAY10 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Additional Features:

IT ALSO OPERATES AT 1.05 V AT 50 MHZ

Address Bus Width:

0

Barrel Shifter:

NO

Bit Size:

16

Boundary Scan:

YES

Maximum Clock Frequency:

12 MHz

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B144

JESD-609 Code:

e1

Length:

12 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

16

No. of External Interrupts:

2

No. of Terminals:

144

No. of Timers:

4

On Chip Data RAM Width:

16

On Chip Program ROM Width:

8

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-10 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA144,14X14,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Words:

131072

ROM Programmability:

MROM

Maximum Seated Height:

1.4 mm

Maximum Supply Voltage:

1.43 V

Minimum Supply Voltage:

1.24 V

Nominal Supply Voltage:

1.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

12 mm

Peripheral IC Type:

Trade Compliance

TMS320C5534AZAY10 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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