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TMS320C5534AZAY05

Texas Instruments

TMS320C5534AZAY05 by Texas Instruments

TMS320C5534AZAY05 by Texas Instruments is a 16-bit DSP with 131072 RAM words, operating at max 12 MHz. Ideal for digital signal processing applications, it features low power mode, boundary scan support, and 1.05V nominal voltage.

Median Price

$6.191

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 1,486 parts In-Stock

1+ parts

$4.472

100+ parts

$3.919

1k+ parts

$2.214

10k+ parts

-

1,486

$4.472

$3.919

$2.214

-

Mouser Electronics

USA . 160 parts In-Stock

1+ parts

$7.910

100+ parts

$4.580

1k+ parts

$3.820

10k+ parts

$3.650

160

$7.910

$4.580

$3.820

$3.650

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,065 parts In-Stock

1+ parts

$4.248

100+ parts

-

1k+ parts

-

10k+ parts

-

4,065

$4.248

-

-

-

Vyrian

USA . 2,459 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,459

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 3,708 parts In-Stock

1+ parts

$4.025

100+ parts

-

1k+ parts

-

10k+ parts

-

3,708

$4.025

-

-

-

Parana Technologies

USA . 2,133 parts In-Stock

1+ parts

$21.186

100+ parts

-

1k+ parts

$21.475

10k+ parts

-

2,133

$21.186

-

$21.475

-

ChromeModa Solutions

Germany . 6,996 parts In-Stock

1+ parts

$23.804

100+ parts

$19.519

1k+ parts

-

10k+ parts

-

6,996

$23.804

$19.519

-

-

IDEA Electronic Components Group

UK . 1,200 parts In-Stock

1+ parts

$23.804

100+ parts

$22.614

1k+ parts

$21.424

10k+ parts

-

1,200

$23.804

$22.614

$21.424

-

Microchip USA

USA . 1,648 parts In-Stock

1+ parts

$28.340

100+ parts

$28.170

1k+ parts

$28.080

10k+ parts

$27.990

1,648

$28.340

$28.170

$28.080

$27.990

Corohmni

South Africa . 3,005 parts In-Stock

1+ parts

$73.473

100+ parts

-

1k+ parts

-

10k+ parts

-

3,005

$73.473

-

-

-

DigiPath Technology Company

USA . 1,545 parts In-Stock

1+ parts

-

100+ parts

$21.462

1k+ parts

-

10k+ parts

-

1,545

-

$21.462

-

-

Overview

Unleash the power of cutting-edge technology with the TMS320C5534AZAY05 by Texas Instruments! As a leading manufacturer in the field of Digital Signal Processors, Texas Instruments delivers top-notch quality and reliability. With applications ranging from audio processing to telecommunications, this product offers exceptional value and benefits. Experience seamless performance, innovative features, and unmatched advantages that set this DSP apart from the rest. Elevate your projects to new heights with the TMS320C5534AZAY05 and witness the difference it can make in your design process.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and reliability for the product.

Surface Mount: YES

Allows for easy and efficient installation on circuit boards.

Maximum Supply Voltage: 1.15 V

Ensures stable and safe operation within specified voltage limits.

On Chip Data RAM Width: 16

Provides ample space for data storage and processing.

Package Shape: SQUARE

Compact shape helps in efficient space utilization on the PCB.

Bit Size: 16

Provides high processing power for handling complex algorithms.

No. of Terminals: 144

Offers versatile connectivity options for external components.

Package Style: GRID ARRAY, LOW PROFILE, FINE PITCH

Enhances overall performance and reliability of the product.

Minimum Supply Voltage: 0.998 V

Allows for operation in low voltage scenarios without compromising performance.

Maximum Operating Temperature: 70 °C

Can withstand high temperatures, suitable for various operating environments.

No. of External Interrupts: 2

Provides flexibility for handling external events and interrupts.

Minimum Operating Temperature: -10 °C

Ensures reliable performance even in cold temperature conditions.

Terminal Finish: TIN SILVER COPPER

Provides good conductivity and corrosion resistance for terminal connections.

Terminal Position: BOTTOM

Facilitates easy mounting and connectivity on the PCB.

Maximum Seated Height: 1.4 mm

Low profile design for space-constrained applications.

RAM Words: 131072

Offers large memory capacity for data storage and processing.

Width: 12 mm

Compact size for easy integration into electronic devices.

Boundary Scan: YES

Allows for testing and debugging of the product during manufacturing.

Maximum Clock Frequency: 12 MHz

Enables high-speed processing of signals and data.

Maximum Time At Peak Reflow Temperature: 30 s

Ensures proper soldering and reliability during manufacturing process.

Peak Reflow Temperature: 260

Can withstand high-temperature reflow soldering process.

Internal Bus Architecture: MULTIPLE

Efficient data transfer and communication within the chip.

Length: 12 mm

Compact dimensions for space-saving integration on the PCB.

Temperature Grade: COMMERCIAL

Suitable for standard commercial applications.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

Designed for processing digital signals efficiently.

No. of Timers: 4

Offers timing capabilities for various operations and applications.

Technology: CMOS

Low power consumption and reliable performance.

Terminal Form: BALL

Allows for reliable soldering connections on the PCB.

Nominal Supply Voltage: 1.05 V

Optimal voltage level for stable performance.

No. of DMA Channels: 16

Efficient data transfer capabilities for high-speed processing.

ROM Programmability: MROM

Non-volatile memory for storing essential data and instructions.

Terminal Pitch: 0.8 mm

Fine pitch for compact and reliable terminal connections.

Format: FIXED POINT

Suitable for fixed point arithmetic operations.

Moisture Sensitivity Level (MSL): 3

Ensures reliability in humid or moisture-prone environments.

Low Power Mode: YES

Reduces power consumption for energy-efficient operation.

On Chip Program ROM Width: 8

Additional on-chip memory for program storage and execution.

Technical Specifications

Digital Signal Processors (DSPs) TMS320C5534AZAY05 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Address Bus Width:

0

Barrel Shifter:

NO

Bit Size:

16

Boundary Scan:

YES

Maximum Clock Frequency:

12 MHz

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B144

JESD-609 Code:

e1

Length:

12 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

16

No. of External Interrupts:

2

No. of Terminals:

144

No. of Timers:

4

On Chip Data RAM Width:

16

On Chip Program ROM Width:

8

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-10 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA144,14X14,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Words:

131072

ROM Programmability:

MROM

Maximum Seated Height:

1.4 mm

Maximum Supply Voltage:

1.15 V

Minimum Supply Voltage:

.998 V

Nominal Supply Voltage:

1.05 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

12 mm

Peripheral IC Type:

Trade Compliance

TMS320C5534AZAY05 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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