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TMS320C5532AZHH10

Texas Instruments

TMS320C5532AZHH10 by Texas Instruments

DIGITAL SIGNAL PROCESSOR, OTHER; Temperature Grade: COMMERCIAL; Terminal Form: BALL; No. of Terminals: 144; Package Code: BGA; Package Shape: SQUARE;

Median Price

$2.837

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 269 parts In-Stock

1+ parts

$5.740

100+ parts

$4.230

1k+ parts

$3.590

10k+ parts

$2.770

269

$5.740

$4.230

$3.590

$2.770

Rochester

USA . 536 parts In-Stock

1+ parts

-

100+ parts

$2.540

1k+ parts

$2.270

10k+ parts

$2.140

536

-

$2.540

$2.270

$2.140

Verical

USA . 376 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$2.837

10k+ parts

$2.675

376

-

-

$2.837

$2.675

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,501 parts In-Stock

1+ parts

$2.670

100+ parts

-

1k+ parts

-

10k+ parts

-

1,501

$2.670

-

-

-

Vyrian

USA . 3,409 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,409

-

-

-

-

DigiKey Marketplace

USA . 546 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

546

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 2,779 parts In-Stock

1+ parts

$2.529

100+ parts

-

1k+ parts

-

10k+ parts

-

2,779

$2.529

-

-

-

Parana Technologies

USA . 287 parts In-Stock

1+ parts

$24.798

100+ parts

-

1k+ parts

$25.470

10k+ parts

-

287

$24.798

-

$25.470

-

DigiPath Technology Company

USA . 2,061 parts In-Stock

1+ parts

$27.306

100+ parts

-

1k+ parts

-

10k+ parts

-

2,061

$27.306

-

-

-

ChromeModa Solutions

Germany . 2,233 parts In-Stock

1+ parts

$27.863

100+ parts

$22.848

1k+ parts

-

10k+ parts

-

2,233

$27.863

$22.848

-

-

IDEA Electronic Components Group

UK . 612 parts In-Stock

1+ parts

$27.863

100+ parts

$26.470

1k+ parts

$25.077

10k+ parts

-

612

$27.863

$26.470

$25.077

-

Corohmni

South Africa . 2,691 parts In-Stock

1+ parts

$31.006

100+ parts

-

1k+ parts

-

10k+ parts

-

2,691

$31.006

-

-

-

Perfect Parts

USA . 1,400 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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1,400

-

-

-

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Microchip USA

USA . 172 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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172

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-

-

-

Technical Specifications

Digital Signal Processors (DSPs) TMS320C5532AZHH10 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Additional Features:

IT ALSO OPERATES AT 1.05 V AT 50 MHZ

Address Bus Width:

0

Barrel Shifter:

NO

Bit Size:

16

Boundary Scan:

YES

Maximum Clock Frequency:

12 MHz

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B144

JESD-609 Code:

e1

Length:

12 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

16

No. of External Interrupts:

2

No. of Terminals:

144

No. of Timers:

4

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-10 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Equivalence Code:

BGA144,14X14,32

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.05/1.3,1.8/3.3

Qualification:

Not Qualified

RAM Words:

32768

ROM Programmability:

MROM

Maximum Seated Height:

1.4 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.43 V

Minimum Supply Voltage:

1.24 V

Nominal Supply Voltage:

1.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

12 mm

Peripheral IC Type:

Trade Compliance

TMS320C5532AZHH10 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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