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TMS320C5504AZCHA10

Texas Instruments

TMS320C5504AZCHA10 by Texas Instruments

TMS320C5504AZCHA10 by Texas Instruments is a 16-bit DSP with 131072 RAM words, operating at max 12 MHz. Ideal for industrial applications, it features 196 terminals, 1.05V nominal voltage, and boundary scan capability for efficient digital signal processing tasks.

Median Price

$6.700

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 2,315 parts In-Stock

1+ parts

$6.700

100+ parts

$5.852

1k+ parts

$4.036

10k+ parts

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2,315

$6.700

$5.852

$4.036

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Distributors (In-Stock)

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Digiode

USA . 2,563 parts In-Stock

1+ parts

$6.365

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2,563

$6.365

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Vyrian

USA . 8,808 parts In-Stock

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8,808

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Speed Components Ltd

Israel . 150 parts In-Stock

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150

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Distributors (Availability)

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Corphita

USA . 1,386 parts In-Stock

1+ parts

$6.030

100+ parts

-

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1,386

$6.030

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AZTECH Wire

Italy . 527 parts In-Stock

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$21.530

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527

$21.530

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Parana Technologies

USA . 2,270 parts In-Stock

1+ parts

$29.505

100+ parts

-

1k+ parts

$60.122

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2,270

$29.505

-

$60.122

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ChromeModa Solutions

Germany . 3,960 parts In-Stock

1+ parts

$33.152

100+ parts

$27.185

1k+ parts

-

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3,960

$33.152

$27.185

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IDEA Electronic Components Group

UK . 523 parts In-Stock

1+ parts

$33.152

100+ parts

$31.494

1k+ parts

$29.837

10k+ parts

-

523

$33.152

$31.494

$29.837

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Corohmni

South Africa . 964 parts In-Stock

1+ parts

$85.543

100+ parts

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964

$85.543

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Kepictronics

USA . 687 parts In-Stock

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687

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DigiPath Technology Company

USA . 103 parts In-Stock

1+ parts

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100+ parts

$29.890

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103

-

$29.890

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Overview

Unleash the power of cutting-edge technology with the TMS320C5504AZCHA10 by Texas Instruments. As a leader in the industry, Texas Instruments delivers top-quality Digital Signal Processors (DSPs) that are perfect for a wide range of applications. With its high performance and efficiency, this product provides unmatched value and benefits to customers looking for reliable solutions. Experience the advantages of advanced features and seamless integration, all in a compact and durable package. Elevate your projects with the TMS320C5504AZCHA10 and discover a world of possibilities at your fingertips.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and protection for the components inside, ensuring a longer lifespan for the product.

Surface Mount: YES

Surface mount technology allows for easier and more compact PCB designs, saving space and enhancing the product's overall performance.

Maximum Supply Voltage: 1.15 V

Operating within the specified maximum supply voltage ensures the safety and reliability of the DSP, preventing damage from overvoltage.

On Chip Data RAM Width: 8

Having a 8-bit wide on-chip data RAM allows for faster data processing and improved efficiency in handling complex algorithms and computations.

Address Bus Width: 21

A wider address bus width of 21 bits enables the DSP to access a larger memory space and handle more data, making it suitable for high-performance applications.

Package Shape: SQUARE

The square package shape is conducive to efficient PCB layout and space utilization, making it easier to integrate the DSP into various electronic systems.

Bit Size: 16

With a 16-bit architecture, the DSP can perform complex mathematical operations with higher precision and accuracy, making it ideal for signal processing applications.

Power Supplies (V): 1.05/1.3,1.8/3.3

Having multiple power supply options allows for flexibility in design and compatibility with different voltage requirements, making the DSP versatile for various applications.

No. of Terminals: 196

With a high number of terminals, the DSP can accommodate a wide range of input/output connections, improving connectivity and expandability in system integration.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

The grid array, low profile, and fine pitch package style offers efficient thermal management, compact size, and high-density mounting options for the DSP.

Minimum Supply Voltage: 0.998 V

Operating at the specified minimum supply voltage ensures energy efficiency and optimal performance of the DSP, saving power consumption in applications.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85°C, the DSP can withstand harsh environmental conditions and extended operation without overheating or performance degradation.

No. of External Interrupts: 2

Having 2 external interrupts allows the DSP to handle external events or signals efficiently, enabling real-time response and effective multitasking capabilities in embedded systems.

Minimum Operating Temperature: -40 °C

Operating at a low temperature of -40°C ensures reliable performance in cold environments or during startup conditions, making the DSP suitable for a wide range of temperature conditions.

Terminal Finish: TIN SILVER COPPER

The terminal finish of TIN SILVER COPPER provides excellent conductivity, corrosion resistance, and solderability for reliable and long-lasting connections in the DSP.

Terminal Position: BOTTOM

Having terminals positioned at the bottom simplifies PCB assembly and improves heat dissipation, enhancing the overall reliability and thermal performance of the DSP.

Maximum Seated Height: 1.3 mm

With a low maximum seated height of 1.3mm, the DSP offers a compact form factor for space-constrained applications and facilitates efficient thermal management in system designs.

RAM Words: 131072

With a large capacity of 131072 RAM words, the DSP can store and process a significant amount of data, enabling complex algorithms and computations in signal processing tasks.

Width: 10 mm

The compact width of 10mm allows for easy integration and placement of the DSP in a variety of electronic devices, optimizing space utilization and design flexibility.

Boundary Scan: YES

Boundary scan capability enables efficient testing and debugging of the DSP, reducing production costs and time-to-market for electronic products that incorporate the DSP.

External Data Bus Width: 16

With a wide external data bus width of 16 bits, the DSP can handle large data transfers and parallel processing effectively, improving overall performance in signal processing tasks.

Maximum Clock Frequency: 12 MHz

Operating at a maximum clock frequency of 12 MHz enables high-speed data processing and real-time operation in applications requiring rapid response times and computational efficiency.

Maximum Time At Peak Reflow Temperature (s): 30

The maximum time of 30 seconds at peak reflow temperature ensures reliable soldering and assembly of the DSP onto the PCB, meeting industry standards for manufacturing processes.

Peak Reflow Temperature °C: 260

The peak reflow temperature of 260°C allows for proper soldering and bonding of the DSP to the PCB, ensuring secure connections and reliable performance in electronic systems.

Internal Bus Architecture: SINGLE

A single internal bus architecture simplifies data transfer and communication within the DSP, reducing complexities in system design and enhancing overall efficiency in signal processing tasks.

Length: 10 mm

With a compact length of 10mm, the DSP can be easily integrated into small form factor devices, providing versatility and compatibility for a wide range of electronic applications.

Temperature Grade: INDUSTRIAL

Operating at an industrial temperature grade ensures reliability and durability of the DSP in harsh environmental conditions, making it suitable for industrial automation and control systems.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

Being a digital signal processor with additional peripheral ICs enhances the functionality and versatility of the DSP, enabling it to perform a variety of signal processing tasks efficiently.

No. of Timers: 3

Having 3 timers allows the DSP to manage and schedule tasks accurately, facilitating time-critical operations and synchronization in embedded systems and real-time applications.

Technology: CMOS

Utilizing CMOS technology offers low power consumption, high noise immunity, and fast switching speeds, making the DSP energy-efficient and suitable for battery-powered applications.

Terminal Form: BALL

The ball terminal form provides reliable solder joints and connectivity, ensuring robust electrical connections and secure attachment of the DSP to the PCB.

Nominal Supply Voltage: 1.05 V

Operating at a nominal supply voltage of 1.05V ensures stable and consistent performance of the DSP, meeting the power requirements for efficient signal processing tasks.

No. of DMA Channels: 16

Having 16 DMA channels enables efficient data transfer and management, reducing processor overhead and enhancing data throughput in applications with high data processing demands.

ROM Programmability: MROM

MROM programmability offers non-volatile storage for critical software or firmware, ensuring secure and reliable operation of the DSP even during power cycles or system resets.

Terminal Pitch: 0.65 mm

With a small terminal pitch of 0.65mm, the DSP allows for high-density mounting on the PCB, optimizing space utilization and enabling compact designs in electronic systems.

Format: FIXED POINT

Operating in fixed-point format provides efficient processing of integer arithmetic operations, reducing computational complexity and improving performance in signal processing algorithms.

Moisture Sensitivity Level (MSL): 3

Having a moisture sensitivity level of 3 indicates that the DSP requires careful handling and storage to prevent moisture-related damage during assembly and reflow processes.

Low Power Mode: YES

The low power mode feature allows the DSP to operate in power-efficient modes, extending battery life and reducing energy consumption in portable and battery-powered devices.

On Chip Program ROM Width: 8

With an 8-bit wide on-chip program ROM, the DSP can store program instructions efficiently, optimizing code execution and improving performance in signal processing applications.

Technical Specifications

Digital Signal Processors (DSPs) TMS320C5504AZCHA10 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Address Bus Width:

21

Barrel Shifter:

NO

Bit Size:

16

Boundary Scan:

YES

Maximum Clock Frequency:

12 MHz

External Data Bus Width:

16

Format:

FIXED POINT

Integrated Cache:

NO

Internal Bus Architecture:

SINGLE

JESD-30 Code:

S-PBGA-B196

JESD-609 Code:

e1

Length:

10 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

16

No. of External Interrupts:

2

No. of Terminals:

196

No. of Timers:

3

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA196,14X14,25

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.05/1.3,1.8/3.3

Qualification:

Not Qualified

RAM Words:

131072

ROM Programmability:

MROM

Maximum Seated Height:

1.3 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.15 V

Minimum Supply Voltage:

.998 V

Nominal Supply Voltage:

1.05 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Peripheral IC Type:

Trade Compliance

TMS320C5504AZCHA10 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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