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TMS320C5504AZCH15

Texas Instruments

TMS320C5504AZCH15 by Texas Instruments

TMS320C5504AZCH15 by Texas Instruments is a 32-bit DSP with 262144 RAM words, 12 MHz clock frequency, and 16 DMA channels. Ideal for digital signal processing applications requiring low power consumption and fixed-point format calculations. It features a commercial temperature grade, boundary scan capability, and a compact square package design.

Median Price

$5.705

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 215 parts In-Stock

1+ parts

$4.710

100+ parts

$4.620

1k+ parts

$4.520

10k+ parts

-

215

$4.710

$4.620

$4.520

-

Texas Instruments

USA . 28,336 parts In-Stock

1+ parts

$6.700

100+ parts

$5.852

1k+ parts

$4.036

10k+ parts

-

28,336

$6.700

$5.852

$4.036

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,649 parts In-Stock

1+ parts

$6.365

100+ parts

-

1k+ parts

-

10k+ parts

-

1,649

$6.365

-

-

-

Vyrian

USA . 4,830 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,830

-

-

-

-

Speed Components Ltd

Israel . 10 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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10

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 4,901 parts In-Stock

1+ parts

$6.030

100+ parts

-

1k+ parts

-

10k+ parts

-

4,901

$6.030

-

-

-

Corohmni

South Africa . 4,937 parts In-Stock

1+ parts

$8.230

100+ parts

-

1k+ parts

-

10k+ parts

-

4,937

$8.230

-

-

-

Component Stockers USA

USA . 8,148 parts In-Stock

1+ parts

$17.540

100+ parts

-

1k+ parts

-

10k+ parts

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8,148

$17.540

-

-

-

AZTECH Wire

Italy . 176 parts In-Stock

1+ parts

$18.760

100+ parts

-

1k+ parts

-

10k+ parts

-

176

$18.760

-

-

-

Parana Technologies

USA . 667 parts In-Stock

1+ parts

$76.311

100+ parts

-

1k+ parts

-

10k+ parts

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667

$76.311

-

-

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DigiPath Technology Company

USA . 263 parts In-Stock

1+ parts

$84.028

100+ parts

-

1k+ parts

-

10k+ parts

-

263

$84.028

-

-

-

ChromeModa Solutions

Germany . 2,736 parts In-Stock

1+ parts

$85.743

100+ parts

$70.309

1k+ parts

-

10k+ parts

-

2,736

$85.743

$70.309

-

-

IDEA Electronic Components Group

UK . 1,823 parts In-Stock

1+ parts

$85.743

100+ parts

$81.456

1k+ parts

$77.169

10k+ parts

-

1,823

$85.743

$81.456

$77.169

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Perfect Parts

USA . 2,885 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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2,885

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Overview

Unlock the power of digital signal processing with the TMS320C5504AZCH15 by Texas Instruments. Designed with precision and reliability in mind, this DSP offers unparalleled performance in a compact package. Ideal for a wide range of applications, this product provides value and benefits that exceed expectations. Experience seamless operation and high-quality results with the TMS320C5504AZCH15, setting a new standard in DSP technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material for the package body makes the product lightweight and cost-effective.

Surface Mount: YES

Being surface mountable allows for easier and more efficient PCB assembly processes.

Maximum Supply Voltage: 1.15 V

Operates efficiently within a safe voltage range, ensuring reliable performance.

Bit Size: 32

With a 32-bit architecture, this DSP can handle complex calculations and processing tasks efficiently.

Internal Bus Architecture: SINGLE

The single internal bus architecture enables streamlined communication within the DSP, optimizing performance.

Technology: CMOS

CMOS technology offers low power consumption, making the DSP efficient and suitable for battery-powered devices.

Maximum Clock Frequency: 12 MHz

Capable of high-speed processing with a maximum clock frequency of 12 MHz.

Technical Specifications

Digital Signal Processors (DSPs) TMS320C5504AZCH15 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Address Bus Width:

21

Barrel Shifter:

NO

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

12 MHz

External Data Bus Width:

16

Format:

FIXED POINT

Integrated Cache:

NO

Internal Bus Architecture:

SINGLE

JESD-30 Code:

S-PBGA-B196

JESD-609 Code:

e1

Length:

10 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

16

No. of External Interrupts:

2

No. of Terminals:

196

No. of Timers:

3

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-10 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA196,14X14,25

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.05/1.4,1.8/3.3

Qualification:

Not Qualified

RAM Words:

262144

ROM Programmability:

MROM

Maximum Seated Height:

1.3 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.15 V

Minimum Supply Voltage:

.998 V

Nominal Supply Voltage:

1.05 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Peripheral IC Type:

Trade Compliance

TMS320C5504AZCH15 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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