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TMS320BC52PZA57

Texas Instruments

TMS320BC52PZA57 by Texas Instruments

TMS320BC52PZA57 by Texas Instruments is a 16-bit DSP with max clock freq of 57.14 MHz, ideal for industrial applications. Features include 1056 RAM words, low power mode, and barrel shifter for efficient signal processing tasks in digital systems. Package style: flatpack, low profile, fine pitch.

Median Price

$28.670

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 1,401 parts In-Stock

1+ parts

$28.670

100+ parts

$28.100

1k+ parts

$27.520

10k+ parts

-

1,401

$28.670

$28.100

$27.520

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,326 parts In-Stock

1+ parts

-

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7,326

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Digiode

USA . 264 parts In-Stock

1+ parts

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264

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Legend Electronics Inc.

USA . 28 parts In-Stock

1+ parts

-

100+ parts

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28

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 427 parts In-Stock

1+ parts

$11.058

100+ parts

-

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-

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427

$11.058

-

-

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Parana Technologies

USA . 1,670 parts In-Stock

1+ parts

$19.426

100+ parts

$1,804.002

1k+ parts

$17.483

10k+ parts

-

1,670

$19.426

$1,804.002

$17.483

-

DigiPath Technology Company

USA . 439 parts In-Stock

1+ parts

$21.390

100+ parts

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439

$21.390

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IDEA Electronic Components Group

UK . 1,809 parts In-Stock

1+ parts

$21.827

100+ parts

$20.736

1k+ parts

$19.644

10k+ parts

-

1,809

$21.827

$20.736

$19.644

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ChromeModa Solutions

Germany . 1,549 parts In-Stock

1+ parts

$21.827

100+ parts

$17.898

1k+ parts

-

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1,549

$21.827

$17.898

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One Stop Electronics

USA . 1,419 parts In-Stock

1+ parts

$26.000

100+ parts

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1,419

$26.000

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Corohmni

South Africa . 594 parts In-Stock

1+ parts

$63.224

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594

$63.224

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Corphita

USA . 3,476 parts In-Stock

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3,476

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Perfect Parts

USA . 309 parts In-Stock

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309

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Microchip USA

USA . 185 parts In-Stock

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185

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Futuretech Components

Singapore . 120 parts In-Stock

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Kepictronics

USA . 120 parts In-Stock

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120

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Overview

Discover the cutting-edge technology of the TMS320BC52PZA57 by Texas Instruments, a top-of-the-line Digital Signal Processor that guarantees high performance and reliability. With a wide range of applications in industries such as telecommunications, automotive, and consumer electronics, this product offers exceptional value to customers seeking efficient signal processing solutions. Trust in the expertise of Texas Instruments and elevate your projects with the superior quality and advantages of the TMS320BC52PZA57.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic or epoxy for the package body material can help in reducing the overall weight of the product, making it more portable and easier to handle.

Surface Mount: YES

Being surface mountable allows for easy and efficient installation on circuit boards, saving space and facilitating automated assembly processes.

Maximum Supply Voltage: 5.25 V

The high maximum supply voltage ensures reliable performance and protection against electrical surges or fluctuations.

Address Bus Width: 16

A wider address bus width allows for accessing a larger range of memory locations, enabling complex algorithms and data processing tasks.

Package Shape: SQUARE

The square package shape aids in efficient utilization of space on a circuit board, optimizing layout and minimizing footprint.

Bit Size: 16

A 16-bit architecture provides enhanced processing capabilities, suitable for handling diverse digital signal processing tasks with precision.

Power Supplies (V): 5

Operating at a standard 5V power supply simplifies integration into existing systems and ensures compatibility with common power sources.

No. of Terminals: 100

With a large number of terminals, the DSP offers connectivity options for various external components and interfaces, enhancing versatility in applications.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

The combination of flatpack, low profile, and fine pitch package style ensures a compact and lightweight design, suitable for space-constrained environments.

Minimum Supply Voltage: 4.75 V

The low minimum supply voltage allows for efficient power management and flexibility in operating conditions, improving overall energy efficiency.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, the DSP can withstand harsh environmental conditions and extended use without compromising performance.

Minimum Operating Temperature: -40 °C

The wide operating temperature range enables reliable operation in extreme cold environments, making the DSP suitable for a variety of applications.

Terminal Position: QUAD

The quad terminal position provides secure and stable connections, reducing the risk of signal loss or interference in high-frequency applications.

Maximum Seated Height: 1.6 mm

The low maximum seated height contributes to a slim profile and compact form factor, allowing for easy integration into tight spaces or low-profile devices.

RAM Words: 1056

Having a large RAM capacity of 1056 words enables efficient data storage and processing, accommodating complex algorithms and increasing overall performance.

Width: 14 mm

The narrow width of 14mm facilitates space-saving installation on PCBs, ideal for compact electronic devices or systems with limited board space.

Boundary Scan: YES

The presence of boundary scan capability allows for enhanced testing and debugging of the DSP during manufacturing or maintenance, ensuring product reliability.

External Data Bus Width: 16

A wide external data bus width of 16 bits enables fast and efficient data transfer between the DSP and external memory or peripherals, enhancing overall performance.

Maximum Clock Frequency: 57.14 MHz

The high maximum clock frequency of 57.14 MHz enables rapid execution of instructions and real-time processing of digital signals, making the DSP suitable for high-speed applications.

Internal Bus Architecture: MULTIPLE

Having multiple internal bus architectures allows for parallel processing of instructions and data, increasing computational efficiency and accelerating signal processing tasks.

Length: 14 mm

The compact length of 14mm contributes to a space-efficient design, enabling the DSP to be seamlessly integrated into small form factor devices or systems.

Temperature Grade: INDUSTRIAL

Designed for industrial applications, the DSP can withstand harsh operating conditions, temperature variations, and mechanical stress, ensuring long-term reliability and durability.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

The inclusion of various peripheral IC types enhances the DSP's versatility and compatibility with different types of external devices or interfaces, expanding its range of application possibilities.

Technology: CMOS

Utilizing CMOS technology offers low power consumption, high noise immunity, and compatibility with a wide range of voltage levels, making the DSP energy-efficient and reliable.

Terminal Form: GULL WING

The gull wing terminal form provides robust connections and easy soldering during assembly, ensuring reliable electrical connections and mechanical stability.

Nominal Supply Voltage: 5 V

The 5V nominal supply voltage simplifies power management and integration with standard power sources, ensuring consistent and reliable operation in diverse applications.

Terminal Pitch: 0.5 mm

The small terminal pitch of 0.5mm allows for dense packing of terminals on the DSP, maximizing connectivity options and enabling high-density PCB designs.

Format: FIXED POINT

Utilizing fixed-point format simplifies arithmetic operations and reduces computational complexity, making the DSP suitable for real-time signal processing applications that require fast and efficient calculations.

Low Power Mode: YES

The availability of a low power mode enables energy-efficient operation and prolongs battery life in portable devices or power-constrained environments, making the DSP suitable for a wide range of applications.

Barrel Shifter: YES

The presence of a barrel shifter facilitates efficient shifting and rotation operations on data, enhancing data manipulation capabilities and improving overall performance in digital signal processing tasks.

Technical Specifications

Digital Signal Processors (DSPs) TMS320BC52PZA57 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Address Bus Width:

16

Barrel Shifter:

YES

Bit Size:

16

Boundary Scan:

YES

Maximum Clock Frequency:

57.14 MHz

External Data Bus Width:

16

Format:

FIXED POINT

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PQFP-G100

Length:

14 mm

Low Power Mode:

YES

No. of Terminals:

100

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Qualification:

Not Qualified

RAM Words:

1056

Maximum Seated Height:

1.6 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

4.75 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

14 mm

Peripheral IC Type:

Trade Compliance

TMS320BC52PZA57 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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