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TMS320BC52PJ57

Texas Instruments

TMS320BC52PJ57 by Texas Instruments

TMS320BC52PJ57 by Texas Instruments is a 16-bit DSP with 512 RAM words, operating at 57.14 MHz clock frequency. Ideal for digital signal processing applications, it features a max supply voltage of 5.25 V and operates in commercial temperature grade range of 0-70°C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,365 parts In-Stock

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6,365

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Digiode

USA . 4,182 parts In-Stock

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4,182

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 674 parts In-Stock

1+ parts

$17.308

100+ parts

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674

$17.308

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One Stop Electronics

USA . 531 parts In-Stock

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$18.000

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531

$18.000

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Parana Technologies

USA . 1,927 parts In-Stock

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$37.266

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1,927

$37.266

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DigiPath Technology Company

USA . 980 parts In-Stock

1+ parts

$41.035

100+ parts

$37.752

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980

$41.035

$37.752

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ChromeModa Solutions

Germany . 3,593 parts In-Stock

1+ parts

$41.872

100+ parts

$34.335

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3,593

$41.872

$34.335

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IDEA Electronic Components Group

UK . 1,593 parts In-Stock

1+ parts

$41.872

100+ parts

$39.778

1k+ parts

$37.685

10k+ parts

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1,593

$41.872

$39.778

$37.685

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Corohmni

South Africa . 46 parts In-Stock

1+ parts

$79.495

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46

$79.495

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Corphita

USA . 2,898 parts In-Stock

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Microchip USA

USA . 465 parts In-Stock

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Overview

Experience unparalleled performance and reliability with the TMS320BC52PJ57 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments ensures top-notch quality and cutting-edge technology in their digital signal processors. With applications ranging from audio processing to telecommunications, this DSP offers exceptional value and benefits to customers, providing fast data processing, low power consumption, and versatile functionality. Upgrade your system with the TMS320BC52PJ57 and unleash its full potential today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the product easy to handle and resistant to damage.

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly onto printed circuit boards, saving time and space.

Maximum Supply Voltage: 5.25 V

Ability to handle higher supply voltage can provide stability and reliability in operation.

Address Bus Width: 16

A wider address bus width allows for greater memory addressability and flexibility in data processing.

Package Shape: RECTANGULAR

Rectangular shape makes it easy to stack or place multiple units in a compact space.

Bit Size: 16

A 16-bit processor allows for processing larger chunks of data at a time, increasing efficiency.

Power Supplies (V): 5

Standard voltage supply ensures compatibility with existing power sources.

No. of Terminals: 100

Having more terminals allows for greater connectivity and functionality in the device.

Package Style (Meter): FLATPACK

Flatpack style offers a low profile design, saving space and enabling efficient heat dissipation.

Minimum Supply Voltage: 4.75 V

Ability to operate at lower voltages can help in energy efficiency and power savings.

Maximum Operating Temperature: 70 °C

High maximum operating temperature ensures reliable performance even in demanding conditions.

Minimum Operating Temperature: 0 °C

Low minimum operating temperature allows for operation in a wide range of environmental conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

This finish provides corrosion resistance and ensures reliable electrical connections over time.

Terminal Position: QUAD

Quad terminal position allows for easy and secure connection to the PCB, enhancing stability.

Maximum Seated Height: 3.1 mm

Low seated height enables a compact design with efficient use of space.

RAM Words: 512

Ample RAM capacity allows for efficient storage and manipulation of data during processing.

Width: 14 mm

Narrow width allows for easy integration into various electronic devices with space constraints.

Boundary Scan: YES

Boundary scan capability enables efficient testing and debugging during production and operation.

External Data Bus Width: 16

Wider external data bus width allows for faster data transfer rates and enhanced performance.

Maximum Clock Frequency: 57.14 MHz

High clock frequency enables fast processing speeds and real-time data handling.

Maximum Time At Peak Reflow Temperature (s): 30

Optimal reflow temperature tolerance allows for efficient soldering during assembly.

Peak Reflow Temperature °C: 260

High peak reflow temperature ensures secure and reliable solder joints during assembly.

Internal Bus Architecture: MULTIPLE

Multiple internal bus architecture enhances data transmission efficiency and supports complex processing tasks.

Length: 20 mm

Compact length facilitates easy integration into tight spaces and compact electronic devices.

Temperature Grade: COMMERCIAL

Commercial temperature grade ensures compatibility with standard operating environments and applications.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

Versatile peripheral IC type supports a wide range of signal processing applications and functions.

Technology: CMOS

CMOS technology offers low power consumption and high-speed performance, ideal for digital signal processing.

Terminal Form: GULL WING

Gull wing terminal form provides secure and reliable connections to the PCB, enhancing overall device durability.

Nominal Supply Voltage: 5 V

Stable nominal supply voltage ensures consistent and reliable performance in the operating range.

Terminal Pitch: 0.65 mm

Compact terminal pitch allows for high-density mounting and efficient use of PCB space.

Format: FIXED POINT

Fixed-point format ensures precision in numerical calculations and enhances overall processing accuracy.

Moisture Sensitivity Level (MSL): 4

MSL level 4 indicates resistance to moisture and enables extended shelf life and reliability in harsh environments.

Low Power Mode: YES

Low-power mode option helps in reducing energy consumption and extending battery life in portable devices.

Barrel Shifter: YES

Barrel shifter feature enhances data manipulation capabilities and supports complex arithmetic operations efficiently.

Technical Specifications

Digital Signal Processors (DSPs) TMS320BC52PJ57 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Address Bus Width:

16

Barrel Shifter:

YES

Bit Size:

16

Boundary Scan:

YES

Maximum Clock Frequency:

57.14 MHz

External Data Bus Width:

16

Format:

FIXED POINT

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

R-PQFP-G100

JESD-609 Code:

e4

Length:

20 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

4

No. of Terminals:

100

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Equivalence Code:

QFP100,.7X.9

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

RAM Words:

512

Maximum Seated Height:

3.1 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

4.75 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Trade Compliance

TMS320BC52PJ57 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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