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TMS320BC52PJ100

Texas Instruments

TMS320BC52PJ100 by Texas Instruments

TMS320BC52PJ100 by Texas Instruments is a 16-bit DSP with 1056 RAM words, operating at max 100 MHz clock frequency. Ideal for digital signal processing applications, it features a 16-bit external data bus width and low power mode for efficient performance in commercial temperature grades.

Median Price

$33.140

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 359 parts In-Stock

1+ parts

$33.140

100+ parts

$32.480

1k+ parts

$31.810

10k+ parts

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359

$33.140

$32.480

$31.810

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,806 parts In-Stock

1+ parts

$31.483

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4,806

$31.483

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Vyrian

USA . 7,752 parts In-Stock

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7,752

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Electronics Depot

USA . 139 parts In-Stock

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139

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Prism Electronics

USA . 9 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 201 parts In-Stock

1+ parts

$18.740

100+ parts

-

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201

$18.740

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Advanced Electronics

New Zealand . 2,500 parts In-Stock

1+ parts

$26.472

100+ parts

$24.090

1k+ parts

$21.707

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$26.472

$24.090

$21.707

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Corphita

USA . 1,272 parts In-Stock

1+ parts

$29.826

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$29.826

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Parana Technologies

USA . 484 parts In-Stock

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$48.315

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484

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DigiPath Technology Company

USA . 1,045 parts In-Stock

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$53.200

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$53.200

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IDEA Electronic Components Group

UK . 789 parts In-Stock

1+ parts

$54.286

100+ parts

$51.572

1k+ parts

$48.857

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789

$54.286

$51.572

$48.857

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ChromeModa Solutions

Germany . 199 parts In-Stock

1+ parts

$54.286

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$44.515

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199

$54.286

$44.515

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Corohmni

South Africa . 2,853 parts In-Stock

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$56.118

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$56.118

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Component Stockers USA

USA . 473 parts In-Stock

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$99.990

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473

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Microchip USA

USA . 164 parts In-Stock

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Overview

Experience unparalleled performance with the TMS320BC52PJ100 by Texas Instruments. As a leader in the industry, Texas Instruments delivers top-quality digital signal processors that are ideal for a wide range of applications. From audio processing to telecommunications, this DSP offers advanced capabilities and reliability. Elevate your projects with the TMS320BC52PJ100 and unlock a world of possibilities.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good protection for the internal components of the DSP, ensuring durability and longevity.

Maximum Supply Voltage: 5.25 V

Allows for a wide range of operating conditions and compatibility with different power supplies.

Address Bus Width: 16

Enables the DSP to efficiently handle memory addresses and data transfer, increasing overall processing speed.

Bit Size: 16

Provides a good balance between processing power and efficiency for a variety of applications.

Package Style (Meter): FLATPACK

Offers a compact and space-saving design for easy integration into different electronic systems.

Maximum Operating Temperature: 70 °C

Ensures reliable performance even in high-temperature environments, making it suitable for a wide range of applications.

RAM Words: 1056

Sufficient memory capacity for storing and processing data, enabling complex signal processing tasks.

Maximum Clock Frequency: 100 MHz

High clock frequency allows for fast data processing, making the DSP suitable for real-time signal processing applications.

Technical Specifications

Digital Signal Processors (DSPs) TMS320BC52PJ100 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Address Bus Width:

16

Barrel Shifter:

YES

Bit Size:

16

Boundary Scan:

YES

Maximum Clock Frequency:

100 MHz

External Data Bus Width:

16

Format:

FIXED POINT

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

R-PQFP-G100

JESD-609 Code:

e4

Length:

20 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

4

No. of Terminals:

100

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Equivalence Code:

QFP100,.7X.9

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

RAM Words:

1056

Maximum Seated Height:

3.1 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

4.75 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Trade Compliance

TMS320BC52PJ100 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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