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TMS320BC51PZ100

Texas Instruments

TMS320BC51PZ100 by Texas Instruments

TMS320BC51PZ100 by Texas Instruments is a 16-bit DSP with 512 RAM words, operating at max 100 MHz clock frequency. Ideal for digital signal processing applications due to its low power mode, barrel shifter feature, and CMOS technology. It comes in a square package with 100 terminals and supports boundary scan testing.

Median Price

$29.610

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 76 parts In-Stock

1+ parts

-

100+ parts

$25.620

1k+ parts

$22.920

10k+ parts

$21.580

76

-

$25.620

$22.920

$21.580

DigiKey

USA . 76 parts In-Stock

1+ parts

-

100+ parts

$29.610

1k+ parts

-

10k+ parts

-

76

-

$29.610

-

-

Verical

USA . 66 parts In-Stock

1+ parts

-

100+ parts

$32.025

1k+ parts

$28.650

10k+ parts

$26.975

66

-

$32.025

$28.650

$26.975

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 789 parts In-Stock

1+ parts

$27.046

100+ parts

-

1k+ parts

-

10k+ parts

-

789

$27.046

-

-

-

Vyrian

USA . 3,010 parts In-Stock

1+ parts

-

100+ parts

-

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3,010

-

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DigiKey Marketplace

USA . 76 parts In-Stock

1+ parts

-

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76

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PC Components Company LLC

USA . 34 parts In-Stock

1+ parts

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34

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Bristol Electronics

USA . 34 parts In-Stock

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34

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Advanced Electronics

New Zealand . 40 parts In-Stock

1+ parts

$13.316

100+ parts

$12.118

1k+ parts

$10.919

10k+ parts

-

40

$13.316

$12.118

$10.919

-

Corohmni

South Africa . 3,148 parts In-Stock

1+ parts

$24.411

100+ parts

-

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-

10k+ parts

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3,148

$24.411

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Corphita

USA . 4,743 parts In-Stock

1+ parts

$25.623

100+ parts

-

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4,743

$25.623

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Component Stockers USA

USA . 154 parts In-Stock

1+ parts

$29.530

100+ parts

-

1k+ parts

-

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154

$29.530

-

-

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Parana Technologies

USA . 1,672 parts In-Stock

1+ parts

$56.836

100+ parts

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10k+ parts

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1,672

$56.836

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DigiPath Technology Company

USA . 424 parts In-Stock

1+ parts

$62.584

100+ parts

$57.577

1k+ parts

-

10k+ parts

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424

$62.584

$57.577

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-

Microchip USA

USA . 337 parts In-Stock

1+ parts

$62.860

100+ parts

$61.770

1k+ parts

$61.220

10k+ parts

$60.670

337

$62.860

$61.770

$61.220

$60.670

ChromeModa Solutions

Germany . 6,664 parts In-Stock

1+ parts

$63.861

100+ parts

$52.366

1k+ parts

-

10k+ parts

-

6,664

$63.861

$52.366

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IDEA Electronic Components Group

UK . 1,170 parts In-Stock

1+ parts

$63.861

100+ parts

$60.668

1k+ parts

$57.475

10k+ parts

-

1,170

$63.861

$60.668

$57.475

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Assy Fe

Spain . 10 parts In-Stock

1+ parts

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100+ parts

-

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10

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Overview

Unlock the power of high-quality and reliable digital signal processing with the TMS320BC51PZ100 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-notch products that meet the highest standards in performance and efficiency. Ideal for a wide range of applications, this DSP offers customers unparalleled value and benefits, from its low power mode to its advanced technology and precision engineering. Elevate your projects with the TMS320BC51PZ100 and experience the advantages of cutting-edge technology at your fingertips.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and cost-effective, making the product easy to handle and affordable for mass production.

Maximum Supply Voltage: 5.25 V

Allows for a higher supply voltage which can lead to better performance and efficiency in certain applications.

Bit Size: 16

Higher bit size allows for more precision and accuracy in processing digital signals, making this DSP suitable for complex algorithms and calculations.

Internal Bus Architecture: MULTIPLE

Multiple internal bus architecture allows for efficient data transfer and processing, ensuring high performance and speed in handling signal processing tasks.

Maximum Clock Frequency: 100 MHz

High maximum clock frequency enables fast signal processing, making this DSP ideal for applications that require real-time data handling.

Technical Specifications

Digital Signal Processors (DSPs) TMS320BC51PZ100 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Additional Features:

1K WORDS DATA/PROG RAM

Address Bus Width:

16

Barrel Shifter:

YES

Bit Size:

16

Boundary Scan:

YES

Maximum Clock Frequency:

100 MHz

External Data Bus Width:

16

Format:

FIXED POINT

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PQFP-G100

Length:

14 mm

Low Power Mode:

YES

No. of Terminals:

100

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Qualification:

Not Qualified

RAM Words:

512

Maximum Seated Height:

1.6 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

4.75 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

14 mm

Peripheral IC Type:

Trade Compliance

TMS320BC51PZ100 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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