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TLV5639CPWRG4

Texas Instruments

TLV5639CPWRG4 by Texas Instruments

TLV5639CPWRG4 by Texas Instruments is a 12-bit DAC with max output voltage of 5.1V, settling time of 7us, and linearity error of 0.0732%. Ideal for applications requiring precise analog signal generation in commercial temperature range.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 4,668 parts In-Stock

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Digiode

USA . 881 parts In-Stock

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881

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One Stop Electronics

USA . 230 parts In-Stock

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$1.000

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$1.000

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AZTECH Wire

Italy . 247 parts In-Stock

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$11.097

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Parana Technologies

USA . 1,954 parts In-Stock

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$15.928

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$16.284

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IDEA Electronic Components Group

UK . 915 parts In-Stock

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$17.897

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$17.002

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$16.107

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915

$17.897

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ChromeModa Solutions

Germany . 535 parts In-Stock

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$17.897

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$14.676

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535

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Component Stockers USA

USA . 574 parts In-Stock

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$99.990

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Corphita

USA . 1,855 parts In-Stock

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DigiPath Technology Company

USA . 722 parts In-Stock

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$16.136

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Microchip USA

USA . 281 parts In-Stock

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Overview

Experience superior analog output with the TLV5639CPWRG4 from Texas Instruments. As a leader in digital-to-analog converters, Texas Instruments delivers top-notch quality and performance. This versatile product is perfect for a wide range of applications, offering precise output voltage control and fast settling times. Enhance your projects with the value and benefits that this high-quality D/A converter provides. Trust Texas Instruments for exceptional results every time.

Feature Benefit Bullets

Maximum Analog Output Voltage: 5.1 V

Higher maximum analog output voltage allows for greater flexibility in output signal range, making this converter suitable for a variety of applications.

Package Body Material: PLASTIC/EPOXY

The use of a durable plastic/epoxy material ensures reliability and longevity in various operating conditions.

No. of Bits: 12

A higher number of bits results in better resolution and accuracy in converting digital signals to analog, making this product ideal for precise applications.

Maximum Settling Time: 7 us

Fast settling time ensures quick and accurate conversion, making this converter suitable for real-time applications.

Maximum Linearity Error (EL): 0.0732%

Low linearity error ensures accurate conversion with minimal distortion, making this product suitable for high-fidelity audio applications.

Nominal Settling Time (tstl): 3.5 us

Quick nominal settling time ensures efficient conversion performance, meeting the demands of time-sensitive applications.

Technology: CMOS

The CMOS technology offers low power consumption and high noise immunity, making this converter energy-efficient and robust in noisy environments.

Nominal Supply Voltage: 3 V

Operates at a standard nominal supply voltage, making integration with existing systems easier and more convenient.

Input Bit Code: BINARY

Binary input bit code simplifies the interface and compatibility with digital systems, ensuring seamless integration and ease of use.

Technical Specifications

Digital-to-Analog Converters TLV5639CPWRG4 attributes and parameters. Explore more Digital-to-Analog Converters devices from Texas Instruments

Converter Specifications

Technology:

CMOS

Sub-Category:

Other Converters

Input Format:

Parallel, Word

Input Bit Code:

Binary

Maximum Linearity Error (EL):

0.0732 %

Nominal Settling Time (tstl):

3.5 µs

Maximum Supply Current:

2.8 mA

Maximum Settling Time:

7 µs

No. of Bits:

12

No. of Functions:

1

Electrical Specifications

Nominal Supply Voltage:

3 V

Minimum Analog Output Voltage:

0 V

Maximum Analog Output Voltage:

5.1 V

Operating Conditions

Minimum Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

70 °C (158 °F)

Temperature Grade:

Form Factor

No. of Terminals:

20

Terminal Form:

Terminal Position:

Dual

Terminal Pitch:

0.026 in (0.65 mm)

Surface Mount:

Yes

Width:

0.173 in (4.4 mm)

Length:

0.256 in (6.5 mm)

Maximum Seated Height:

0.047 in (1.2 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Shape:

Package Style:

Small Outline, Thin Profile, Shrink Pitch

Package Code:

Package Equivalence Code:

TSSOP20,.25

Standards and Codes

Qualified:

No

JESD-30 Code:

R-PDSO-G20

Trade Compliance

TLV5639CPWRG4 Converters trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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