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DAC7512N/3KG4

Texas Instruments

DAC7512N/3KG4 by Texas Instruments

DAC7512N/3KG4 by Texas Instruments is a 12-bit D/A converter with max analog output voltage of 5.5V and settling time of 10us. Ideal for industrial applications, it operates b/w -40 to 105°C, features serial input format, and consumes only 0.2mA supply current.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

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Chip Stock

USA . 11,500 parts In-Stock

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Vyrian

USA . 4,357 parts In-Stock

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Digiode

USA . 1,218 parts In-Stock

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Nova Conductors

Japan . 500 parts In-Stock

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500

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Semicontronic

India . 807 parts In-Stock

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$3.000

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$2.925

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$2.910

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807

$3.000

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$2.910

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Ampacity Inc.

Singapore . 1,098 parts In-Stock

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$5.000

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AZTECH Wire

Italy . 219 parts In-Stock

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$5.152

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One Stop Electronics

USA . 1,352 parts In-Stock

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$8.000

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Corohmni

South Africa . 350 parts In-Stock

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$21.377

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Parana Technologies

USA . 1,951 parts In-Stock

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$21.715

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$22.154

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DigiPath Technology Company

USA . 2,026 parts In-Stock

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$23.911

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$21.998

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ChromeModa Solutions

Germany . 3,504 parts In-Stock

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$24.399

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$20.007

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IDEA Electronic Components Group

UK . 971 parts In-Stock

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$24.399

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$23.179

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$21.959

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Kepictronics

USA . 21,000 parts In-Stock

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A-Z Elektronik GmbH

Germany . 8,607 parts In-Stock

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Continental Prestige Electronics

USA . 5,340 parts In-Stock

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Glotronic Ltd.

UK . 3,790 parts In-Stock

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Alle Elektronik GmbH

Germany . 3,738 parts In-Stock

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Corphita

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Microchip USA

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Advanced Electronics

New Zealand . 900 parts In-Stock

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Argo Parts USA

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Bastille Electronics

Australia . 10 parts In-Stock

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Overview

Unlock a world of precision and performance with the DAC7512N/3KG4 by Texas Instruments. As a leader in the industry, Texas Instruments ensures unparalleled quality and reliability in their products. This digital-to-analog converter is perfect for applications requiring high accuracy and fast settling time. With a compact design and low power consumption, this DAC offers exceptional value for customers looking to elevate their projects. Experience seamless integration and superior results with the Texas Instruments DAC7512N/3KG4.

Feature Benefit Bullets

Maximum Analog Output Voltage: 5.5 V

High maximum output voltage makes this DAC suitable for applications requiring a wide range of analog signals.

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides durability and protection for the internal components of the DAC.

Surface Mount: YES

Surface mount design allows for easy installation and integration into compact electronic devices.

Package Shape: RECTANGULAR

Rectangular shape simplifies PCB layout and ensures efficient use of space in electronic assemblies.

No. of Bits: 12

12-bit resolution allows for fine adjustment and precise control of analog output signals.

Maximum Settling Time: 10 us

Fast settling time ensures quick and accurate conversion of digital input to analog output.

Power Supplies (V): 3/5

Dual power supply options of 3V and 5V provide flexibility for different voltage requirements in electronic systems.

No. of Terminals: 6

Six terminals offer easy connectivity and secure attachment to external circuitry.

Package Style (Meter): SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

Compact package style saves space and allows for easy integration into tight spaces in electronic devices.

Nominal Settling Time (tstl): 10 us

Consistent settling time ensures reliable and accurate analog output signal conversion.

Maximum Operating Temperature: 105 °C

High maximum operating temperature range makes this DAC suitable for industrial applications with varying temperature conditions.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature range ensures the DAC can function in a wide range of environmental conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

High-quality terminal finish improves electrical conductivity and ensures reliable signal transmission.

Terminal Position: DUAL

Dual terminal positioning provides stability and secure connections in electronic assemblies.

Maximum Seated Height: 1.45 mm

Low seated height allows for compact design and space-saving installation in electronic devices.

Width: 1.6 mm

Narrow width enables efficient use of space on the PCB and ensures a compact footprint for the DAC.

Maximum Time At Peak Reflow Temperature (s): 30

Adequate time at peak reflow temperature ensures proper soldering and secure attachment during assembly.

Peak Reflow Temperature °C: 260

High peak reflow temperature tolerance ensures the DAC can withstand the soldering process without damage.

Minimum Analog Output Voltage: 0 V

Low minimum analog output voltage allows for precise control of the output signal close to zero.

Length: 2.9 mm

Short length facilitates easy installation and integration into electronic assemblies with limited space.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature tolerance makes this DAC suitable for use in harsh environments and industrial applications.

Sample Rate: 0.095 MHz

High sample rate ensures accurate and fast conversion of digital signals to analog output signals.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity for reliable performance.

Terminal Form: GULL WING

Gull wing terminal form provides easy installation and secure attachment to PCBs during assembly.

Maximum Supply Current: 0.2 mA

Low maximum supply current consumption ensures energy-efficient operation of the DAC.

Input Format: SERIAL

Serial input format simplifies data transmission and integration with digital systems.

Converter Type: D/A CONVERTER

Digital-to-analog converter type allows for conversion of digital input signals to precise analog output signals.

Nominal Supply Voltage: 3 V

Nominal supply voltage of 3V ensures compatibility with a wide range of electronic systems.

Terminal Pitch: 0.95 mm

Small terminal pitch allows for precise placement and secure soldering during assembly.

Moisture Sensitivity Level (MSL): 2

MSL level 2 ensures the DAC can withstand moderate moisture exposure during storage and handling.

Input Bit Code: BINARY

Binary input bit code simplifies digital signal processing and conversion to analog output signals.

Technical Specifications

Digital-to-Analog Converters DAC7512N/3KG4 attributes and parameters. Explore more Digital-to-Analog Converters devices from Texas Instruments

Converter Specifications

Technology:

CMOS

Sub-Category:

Other Converters

Input Format:

Serial

Input Bit Code:

Binary

Maximum Linearity Error (EL):

0.1953 %

Nominal Settling Time (tstl):

10 µs

Maximum Supply Current:

200 μA

Maximum Settling Time:

10 µs

Sample Rate:

95 kHz

No. of Bits:

12

No. of Functions:

1

Electrical Specifications

Nominal Supply Voltage:

3 V

Minimum Analog Output Voltage:

0 V

Maximum Analog Output Voltage:

5.5 V

Power Supplies:

3/5 V

Operating Conditions

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

105 °C (221 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Maximum Time At Peak Reflow Temperature:

30 s

Moisture Sensitivity Level (MSL):

2

Form Factor

No. of Terminals:

6

Terminal Form:

Terminal Position:

Dual

Terminal Pitch:

0.037 in (0.95 mm)

Terminal Finish:

Nickel Palladium Gold

Surface Mount:

Yes

Width:

0.063 in (1.6 mm)

Length:

0.114 in (2.9 mm)

Maximum Seated Height:

0.057 in (1.45 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Shape:

Package Style:

Small Outline, Low Profile, Shrink Pitch

Package Code:

Package Equivalence Code:

TSOP6,.11,37

Standards and Codes

Qualified:

No

JESD-30 Code:

R-PDSO-G6

JESD-609 Code:

e4

Trade Compliance

DAC7512N/3KG4 Converters trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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