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TLV5638IDRG4

Texas Instruments

TLV5638IDRG4 by Texas Instruments

TLV5638IDRG4 by Texas Instruments is a 12-bit DAC with max output voltage of 5.1 V and settling time of 7 us. Ideal for industrial applications, it operates b/w -40 to 85 °C with low linearity error at 0.0977%.

Median Price

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Lifecycle Status

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4

In-Stock Inventory

1k+

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Chip Stock

USA . 9,400 parts In-Stock

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Vyrian

USA . 5,869 parts In-Stock

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Nova Conductors

Japan . 150 parts In-Stock

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Digiode

USA . 87 parts In-Stock

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AZTECH Wire

Italy . 863 parts In-Stock

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$8.214

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863

$8.214

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Parana Technologies

USA . 817 parts In-Stock

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$15.393

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$15.779

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One Stop Electronics

USA . 483 parts In-Stock

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$16.000

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DigiPath Technology Company

USA . 2,251 parts In-Stock

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$16.950

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$15.594

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IDEA Electronic Components Group

UK . 2,307 parts In-Stock

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$17.296

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$16.431

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$15.566

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ChromeModa Solutions

Germany . 1,368 parts In-Stock

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$17.296

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$14.183

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Ampacity Inc.

Singapore . 963 parts In-Stock

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$35.000

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Authorized Procurement Solutions

USA . 4,000 parts In-Stock

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Corphita

USA . 2,985 parts In-Stock

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Microchip USA

USA . 2,615 parts In-Stock

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S.R.D Solutions

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Bastille Electronics

Australia . 32 parts In-Stock

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Overview

Unlock a world of precision and reliability with the TLV5638IDRG4 from Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-quality Digital-to-Analog Converters that are perfect for a wide range of applications. With a maximum analog output voltage of 5.1V and a fast settling time of just 7us, this product offers unmatched performance and accuracy. Experience the value and benefits of this versatile converter, whether you're working on industrial automation, telecommunications, or audio equipment. Trust Texas Instruments to provide you with the tools you need for success.

Feature Benefit Bullets

Maximum Analog Output Voltage: 5.1 V

The high maximum analog output voltage of 5.1 V means that this DAC can provide a wide range of output voltages, making it suitable for various applications.

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material provides durability and protection to the internal components of the DAC, ensuring a longer lifespan.

No. of Bits: 12

With 12 bits of resolution, this DAC can provide fine and precise control over the analog output, allowing for high-quality signal conversion.

Maximum Settling Time: 7 us

The fast settling time of 7 us ensures that the DAC can quickly stabilize and provide accurate output signals, making it suitable for real-time applications.

Power Supplies (V): 3/5

Having multiple power supply options of 3V and 5V allows for flexibility in powering the DAC, making it compatible with a wide range of systems.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85°C, this DAC can withstand harsh environmental conditions, making it suitable for industrial use.

Sample Rate: 0.233 MHz

The high sample rate of 0.233 MHz enables fast and accurate signal processing, making this DAC ideal for high-speed applications.

Technology: CMOS

Utilizing CMOS technology ensures low power consumption and high reliability, making this DAC energy-efficient and durable for long-term use.

Technical Specifications

Digital-to-Analog Converters TLV5638IDRG4 attributes and parameters. Explore more Digital-to-Analog Converters devices from Texas Instruments

Converter Specifications

Technology:

CMOS

Sub-Category:

Other Converters

Input Format:

Serial

Input Bit Code:

Binary

Maximum Linearity Error (EL):

0.0977 %

Nominal Settling Time (tstl):

3.5 µs

Maximum Supply Current:

5.2 mA

Maximum Settling Time:

7 µs

Sample Rate:

233 kHz

No. of Bits:

12

No. of Functions:

1

Electrical Specifications

Nominal Supply Voltage:

3 V

Minimum Analog Output Voltage:

0 V

Maximum Analog Output Voltage:

5.1 V

Power Supplies:

3/5 V

Operating Conditions

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Moisture Sensitivity Level (MSL):

1

Form Factor

No. of Terminals:

8

Terminal Form:

Terminal Position:

Dual

Terminal Pitch:

0.05 in (1.27 mm)

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Surface Mount:

Yes

Width:

0.154 in (3.9 mm)

Length:

0.193 in (4.9 mm)

Maximum Seated Height:

0.069 in (1.75 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Shape:

Package Style:

Small Outline

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Standards and Codes

Qualified:

No

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Trade Compliance

TLV5638IDRG4 Converters trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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