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TLV5636IDR

Texas Instruments

TLV5636IDR by Texas Instruments

TLV5636IDR by Texas Instruments is a 12-bit DAC with max output voltage of 2.9V, settling time of 7us, and linearity error of 0.0977%. Ideal for industrial applications requiring precise analog signal conversion in compact spaces. Operates at temperatures ranging from -40 to 85°C with low supply current of 3.3mA.

Median Price

$11.522

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 2,500 parts In-Stock

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$11.663

2,500

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$11.663

Rochester

USA . 18 parts In-Stock

1+ parts

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100+ parts

$11.380

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$10.180

10k+ parts

$9.580

18

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$11.380

$10.180

$9.580

Distributors (In-Stock)

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Digiode

USA . 3,923 parts In-Stock

1+ parts

$9.300

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Vyrian

USA . 5,324 parts In-Stock

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Inventory MP

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Bristol Electronics

USA . 1,499 parts In-Stock

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Distributors (Availability)

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Corphita

USA . 3,977 parts In-Stock

1+ parts

$8.811

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$8.811

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AZTECH Wire

Italy . 581 parts In-Stock

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$14.590

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$14.590

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Microchip USA

USA . 3,959 parts In-Stock

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$22.090

100+ parts

$21.770

1k+ parts

$21.610

10k+ parts

$21.460

3,959

$22.090

$21.770

$21.610

$21.460

Parana Technologies

USA . 1,633 parts In-Stock

1+ parts

$23.828

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$24.462

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1,633

$23.828

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$24.462

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DigiPath Technology Company

USA . 1,956 parts In-Stock

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$26.238

100+ parts

$24.139

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$24.139

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ChromeModa Solutions

Germany . 2,061 parts In-Stock

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$26.773

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$21.954

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$26.773

$21.954

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IDEA Electronic Components Group

UK . 1,579 parts In-Stock

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$26.773

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$25.434

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$24.096

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1,579

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$25.434

$24.096

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A-Z Elektronik GmbH

Germany . 8,544 parts In-Stock

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Authorized Procurement Solutions

USA . 4,000 parts In-Stock

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Kepictronics

USA . 2,500 parts In-Stock

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Alle Elektronik GmbH

Germany . 603 parts In-Stock

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Overview

Discover the powerful TLV5636IDR by Texas Instruments, a top-of-the-line Digital-to-Analog Converter that guarantees high-quality performance and reliability. With a compact design and advanced technology, this converter is ideal for a wide range of industrial applications. Experience seamless operation and precise output voltage control with the TLV5636IDR, offering customers unmatched value and superior benefits. Upgrade your system now with this exceptional product from a trusted manufacturer like Texas Instruments.

Feature Benefit Bullets

Maximum Analog Output Voltage: 2.9 V

Provides a high maximum analog output voltage, allowing for a wide range of output signals.

Package Body Material: PLASTIC/EPOXY

Durable and lightweight material for the package body, making the product easy to handle and transport.

Surface Mount: YES

Enables easy integration onto circuit boards and saves space compared to through-hole mounting.

No. of Bits: 12

Offers a higher resolution for converting digital signals to analog, resulting in more accurate outputs.

Maximum Settling Time: 7 us

Fast settling time ensures quick response and stability in output signals.

Power Supplies (V): 3/5

Compatible with common power supply voltages, making it versatile for various applications.

Maximum Operating Temperature: 85 °C

Can operate efficiently in high-temperature environments, suitable for industrial use.

Technology: CMOS

Utilizes CMOS technology for low power consumption and high noise immunity.

Technical Specifications

Digital-to-Analog Converters TLV5636IDR attributes and parameters. Explore more Digital-to-Analog Converters devices from Texas Instruments

Converter Specifications

Technology:

CMOS

Sub-Category:

Other Converters

Input Format:

Serial

Input Bit Code:

Binary

Maximum Linearity Error (EL):

0.0977 %

Nominal Settling Time (tstl):

1 µs

Maximum Supply Current:

3.3 mA

Maximum Settling Time:

7 µs

Sample Rate:

233 kHz

No. of Bits:

12

No. of Functions:

1

Electrical Specifications

Nominal Supply Voltage:

3 V

Minimum Analog Output Voltage:

0 V

Maximum Analog Output Voltage:

2.9 V

Power Supplies:

3/5 V

Operating Conditions

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Maximum Time At Peak Reflow Temperature:

30 s

Moisture Sensitivity Level (MSL):

1

Form Factor

No. of Terminals:

8

Terminal Form:

Terminal Position:

Dual

Terminal Pitch:

0.05 in (1.27 mm)

Terminal Finish:

Nickel Palladium Gold

Surface Mount:

Yes

Width:

0.154 in (3.9 mm)

Length:

0.193 in (4.9 mm)

Maximum Seated Height:

0.069 in (1.75 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Shape:

Package Style:

Small Outline

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Standards and Codes

Qualified:

No

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Trade Compliance

TLV5636IDR Converters trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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