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TLV5633CPWRG4

Texas Instruments

TLV5633CPWRG4 by Texas Instruments

TLV5633CPWRG4 by Texas Instruments is a 12-bit DAC with max output voltage of 5.1V and settling time of 7us. Ideal for applications requiring precise analog signal generation in commercial temperature range, it features CMOS technology, parallel input format, and low supply current of 2.8mA.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,176 parts In-Stock

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Vyrian

USA . 3,370 parts In-Stock

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Distributors (Availability)

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Parana Technologies

USA . 974 parts In-Stock

1+ parts

$11.955

100+ parts

$1,110.237

1k+ parts

$10.760

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974

$11.955

$1,110.237

$10.760

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DigiPath Technology Company

USA . 1,004 parts In-Stock

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$13.164

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$12.111

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$13.164

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ChromeModa Solutions

Germany . 4,553 parts In-Stock

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$13.433

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$11.015

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$13.433

$11.015

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IDEA Electronic Components Group

UK . 111 parts In-Stock

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$13.433

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$12.761

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$12.090

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111

$13.433

$12.761

$12.090

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AZTECH Wire

Italy . 571 parts In-Stock

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$17.563

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571

$17.563

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One Stop Electronics

USA . 1,011 parts In-Stock

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$29.000

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$29.000

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QUARKTWIN TECHNOLOGY LTD

USA . 20,434 parts In-Stock

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Microchip USA

USA . 5,223 parts In-Stock

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Corphita

USA . 647 parts In-Stock

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Overview

Unlock a world of precision and performance with the TLV5633CPWRG4 by Texas Instruments, a top-of-the-line Digital-to-Analog Converter that delivers exceptional quality and reliability. Manufactured by industry leader Texas Instruments, this cutting-edge product is designed to provide seamless conversion for a wide range of applications. Experience unparalleled value and superior results with the TLV5633CPWRG4, offering customers unmatched benefits and advantages in their projects. Elevate your designs with the unbeatable performance of this innovative converter from Texas Instruments.

Feature Benefit Bullets

Maximum Analog Output Voltage: 5.1 V

High maximum output voltage allows for a wide range of analog signal generation, suitable for various applications.

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides durability and protection for the internal components of the converter.

No. of Bits: 12

With 12 bits, the converter offers high resolution and accuracy in converting digital signals to analog.

Maximum Settling Time: 7 us

Fast settling time ensures quick response and accuracy in output voltage stabilization.

Power Supplies (V): 3/5

Compatible with both 3V and 5V power supplies, offering flexibility in power source selection.

Maximum Operating Temperature: 70 °C

Wide operating temperature range allows for use in various environmental conditions.

Technology: CMOS

CMOS technology ensures low power consumption and high noise immunity, enhancing overall performance.

Technical Specifications

Digital-to-Analog Converters TLV5633CPWRG4 attributes and parameters. Explore more Digital-to-Analog Converters devices from Texas Instruments

Converter Specifications

Technology:

CMOS

Sub-Category:

Other Converters

Input Format:

Parallel, Word

Input Bit Code:

Binary

Maximum Linearity Error (EL):

0.0732 %

Nominal Settling Time (tstl):

3.5 µs

Maximum Supply Current:

2.8 mA

Maximum Settling Time:

7 µs

No. of Bits:

12

No. of Functions:

1

Electrical Specifications

Nominal Supply Voltage:

3 V

Minimum Analog Output Voltage:

0 V

Maximum Analog Output Voltage:

5.1 V

Power Supplies:

3/5 V

Operating Conditions

Minimum Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

70 °C (158 °F)

Temperature Grade:

Form Factor

No. of Terminals:

20

Terminal Form:

Terminal Position:

Dual

Terminal Pitch:

0.026 in (0.65 mm)

Surface Mount:

Yes

Width:

0.173 in (4.4 mm)

Length:

0.256 in (6.5 mm)

Maximum Seated Height:

0.047 in (1.2 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Shape:

Package Style:

Small Outline, Thin Profile, Shrink Pitch

Package Code:

Package Equivalence Code:

TSSOP20,.25

Standards and Codes

Qualified:

No

JESD-30 Code:

R-PDSO-G20

Trade Compliance

TLV5633CPWRG4 Converters trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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