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TLV5628IDWRG4

Texas Instruments

TLV5628IDWRG4 by Texas Instruments

TLV5628IDWRG4 by Texas Instruments is an 8-bit D/A converter with 10us settling time, 0.3906% linearity error, and 3.3V supply voltage. Ideal for industrial applications requiring precise analog signal generation in a compact package.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 8,580 parts In-Stock

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Digiode

USA . 2,521 parts In-Stock

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2,521

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Nova Conductors

Japan . 500 parts In-Stock

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500

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One Stop Electronics

USA . 658 parts In-Stock

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$7.000

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658

$7.000

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AZTECH Wire

Italy . 771 parts In-Stock

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$13.659

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771

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Parana Technologies

USA . 1,871 parts In-Stock

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$16.075

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$16.410

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$16.075

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DigiPath Technology Company

USA . 2,032 parts In-Stock

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$17.701

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$17.701

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ChromeModa Solutions

Germany . 1,834 parts In-Stock

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$18.062

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$14.811

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$14.811

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IDEA Electronic Components Group

UK . 633 parts In-Stock

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$18.062

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$17.159

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$16.256

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633

$18.062

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$16.256

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Ampacity Inc.

Singapore . 1,038 parts In-Stock

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$35.000

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Microchip USA

USA . 4,105 parts In-Stock

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Corphita

USA . 2,507 parts In-Stock

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Bastille Electronics

Australia . 800 parts In-Stock

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Overview

Unlock the potential of your analog applications with the TLV5628IDWRG4 by Texas Instruments. Designed with precision and reliability in mind, this digital-to-analog converter offers unparalleled performance in a compact package. From industrial automation to audio equipment, this versatile product delivers high-quality output with minimal settling time. Trust in Texas Instruments to provide cutting-edge technology that brings value and efficiency to your projects. Elevate your designs with the TLV5628IDWRG4 and experience the difference today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for portable and long-lasting applications.

Surface Mount: YES

Being surface mountable allows for easy and efficient assembly onto circuit boards, saving space and enhancing overall compactness.

No. of Functions: 8

Having 8 functions provides versatility and flexibility in signal conversion and processing, catering to a wide range of applications.

No. of Bits: 8

An 8-bit resolution offers a good balance between accuracy and complexity, suitable for many general-purpose digital-to-analog conversion tasks.

Maximum Settling Time: 10 us

With a fast settling time of 10 microseconds, the product ensures quick response and accurate output, essential for real-time signal processing.

Power Supplies (V): 3.3

Operating at a standard voltage of 3.3V makes the product compatible with common power sources, simplifying integration into existing systems.

Maximum Operating Temperature: 85 °C

The wide operating temperature range of up to 85°C ensures reliable performance in various environments and conditions.

Minimum Operating Temperature: -40 °C

Capable of functioning in extremely low temperatures down to -40°C, making it suitable for use in harsh and cold environments.

Sample Rate: 0.045 MHz

The high sample rate of 0.045 MHz allows for precise and continuous conversion of digital signals into analog outputs, ensuring smooth and accurate performance.

Input Bit Code: BINARY

Supporting binary input bit code simplifies data processing and interpretation, improving compatibility with standard digital systems and protocols.

Technical Specifications

Digital-to-Analog Converters TLV5628IDWRG4 attributes and parameters. Explore more Digital-to-Analog Converters devices from Texas Instruments

Converter Specifications

Sub-Category:

Other Converters

Input Format:

Serial

Input Bit Code:

Binary

Maximum Linearity Error (EL):

0.3906 %

Nominal Settling Time (tstl):

10 µs

Maximum Supply Current:

4 mA

Maximum Settling Time:

10 µs

Sample Rate:

45 kHz

No. of Bits:

8

No. of Functions:

8

Electrical Specifications

Nominal Supply Voltage:

3.3 V

Power Supplies:

3.3 V

Operating Conditions

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Maximum Time At Peak Reflow Temperature:

30 s

Moisture Sensitivity Level (MSL):

1

Form Factor

No. of Terminals:

16

Terminal Form:

Terminal Position:

Dual

Terminal Pitch:

0.05 in (1.27 mm)

Terminal Finish:

Nickel Palladium Gold

Surface Mount:

Yes

Width:

0.295 in (7.5 mm)

Length:

0.406 in (10.3 mm)

Maximum Seated Height:

0.104 in (2.65 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Shape:

Package Style:

Small Outline

Package Code:

SOP

Package Equivalence Code:

SOP16,.4

Standards and Codes

Qualified:

No

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Trade Compliance

TLV5628IDWRG4 Converters trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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