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TLV5618ACD

Texas Instruments

TLV5618ACD by Texas Instruments

TLV5618ACD by Texas Instruments is a 12-bit DAC with max output voltage of 2.9V and settling time of 10us. Ideal for applications requiring precise analog signal generation in commercial temperature range, it features serial input format and low supply current of 2.3mA.

Median Price

$11.717

Lifecycle Status

Suppliers In-Stock

18

In-Stock Inventory

1k+

Distributors (Authorized)

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Arrow

USA . 3 parts In-Stock

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$4.537

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$4.537

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Rochester

USA . 20 parts In-Stock

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$7.420

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$7.270

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$7.120

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$7.420

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$7.120

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Verical

USA . 3 parts In-Stock

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$11.993

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$11.993

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Mouser Electronics

USA . 457 parts In-Stock

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$20.430

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$13.900

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$13.270

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457

$20.430

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$13.270

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Chip1Stop

Japan . 225 parts In-Stock

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$11.717

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Distributors (In-Stock)

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Mobius Materials

USA . 38 parts In-Stock

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$9.100

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$7.290

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38

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$7.290

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Nova Conductors

Japan . 10 parts In-Stock

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$9.132

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10

$9.132

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Digiode

USA . 2,803 parts In-Stock

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$11.393

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Vyrian

USA . 8,162 parts In-Stock

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Chip Stock

USA . 579 parts In-Stock

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579

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Prism Electronics

USA . 75 parts In-Stock

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ComSIT Distribution GmbH

Germany . 20 parts In-Stock

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ComSIT USA

USA . 20 parts In-Stock

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Bristol Electronics

USA . 10 parts In-Stock

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Flex Direct, LLC

USA . 10 parts In-Stock

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Semi Source

USA . 9 parts In-Stock

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Microfarads

USA . 5 parts In-Stock

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Technoshack Inc.

Canada . 5 parts In-Stock

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Distributors (Availability)

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Parana Technologies

USA . 2,368 parts In-Stock

1+ parts

$7.472

100+ parts

$693.929

1k+ parts

$6.725

10k+ parts

-

2,368

$7.472

$693.929

$6.725

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DigiPath Technology Company

USA . 943 parts In-Stock

1+ parts

$8.228

100+ parts

$7.570

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943

$8.228

$7.570

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ChromeModa Solutions

Germany . 2,313 parts In-Stock

1+ parts

$8.396

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$6.885

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2,313

$8.396

$6.885

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IDEA Electronic Components Group

UK . 1,404 parts In-Stock

1+ parts

$8.396

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$7.976

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$7.556

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1,404

$8.396

$7.976

$7.556

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Netroflash

USA . 50 parts In-Stock

1+ parts

$9.132

100+ parts

$8.949

1k+ parts

$8.675

10k+ parts

$8.493

50

$9.132

$8.949

$8.675

$8.493

Corphita

USA . 1,391 parts In-Stock

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$10.794

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AZTECH Wire

Italy . 780 parts In-Stock

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$13.433

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$13.433

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Ampacity Inc.

Singapore . 162 parts In-Stock

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$21.680

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Microchip USA

USA . 2,898 parts In-Stock

1+ parts

$39.650

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$39.080

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$38.800

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$38.520

2,898

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$39.080

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$38.520

Futuretech Components

Singapore . 3,000 parts In-Stock

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Authorized Procurement Solutions

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Kepictronics

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Perfect Parts

USA . 1,119 parts In-Stock

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GreenTree Electronics

Israel . 50 parts In-Stock

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50

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Overview

Unlock a world of precision and reliability with the TLV5618ACD from Texas Instruments. Crafted with cutting-edge technology, this Digital-to-Analog Converter offers unparalleled performance and accuracy for your applications. With a compact design and fast settling times, this product delivers seamless operation in a variety of scenarios. Trust Texas Instruments to provide you with top-notch quality and value that will elevate your projects to new heights. Experience the difference with TLV5618ACD today.

Feature Benefit Bullets

Maximum Analog Output Voltage: 2.9 V

Higher maximum analog output voltage allows for greater flexibility and range in output signals.

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides durability and protection for the components within the package.

Surface Mount: YES

Surface mount capability makes it easier to integrate into a variety of electronic devices.

No. of Bits: 12

Higher number of bits allows for more precise digital-to-analog conversion and improved signal accuracy.

Maximum Settling Time: 10 us

Quick settling time ensures rapid and accurate conversion of digital signals to analog output.

Power Supplies (V): 3/5

Compatibility with multiple power supply voltages provides flexibility in powering the device.

Maximum Operating Temperature: 70 °C

High maximum operating temperature allows for reliable performance in various environmental conditions.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the product energy-efficient and reliable.

Input Bit Code: BINARY

Binary input bit code simplifies the input signal format, making it easy to connect to digital systems.

Technical Specifications

Digital-to-Analog Converters TLV5618ACD attributes and parameters. Explore more Digital-to-Analog Converters devices from Texas Instruments

Converter Specifications

Technology:

CMOS

Sub-Category:

Other Converters

Input Format:

Serial

Input Bit Code:

Binary

Maximum Linearity Error (EL):

0.0977 %

Nominal Settling Time (tstl):

2.5 µs

Maximum Supply Current:

2.3 mA

Maximum Settling Time:

10 µs

Sample Rate:

93 kHz

No. of Bits:

12

No. of Functions:

1

Electrical Specifications

Nominal Supply Voltage:

3 V

Minimum Analog Output Voltage:

0 V

Maximum Analog Output Voltage:

2.9 V

Power Supplies:

3/5 V

Operating Conditions

Minimum Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

70 °C (158 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Moisture Sensitivity Level (MSL):

1

Form Factor

No. of Terminals:

8

Terminal Form:

Terminal Position:

Dual

Terminal Pitch:

0.05 in (1.27 mm)

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Surface Mount:

Yes

Width:

0.154 in (3.9 mm)

Length:

0.193 in (4.9 mm)

Maximum Seated Height:

0.069 in (1.75 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Shape:

Package Style:

Small Outline

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Standards and Codes

Qualified:

No

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Trade Compliance

TLV5618ACD Converters trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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