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TLV5616CP

Texas Instruments

TLV5616CP by Texas Instruments

TLV5616CP by Texas Instruments is a 12-bit DAC with max output voltage of 3.2V and settling time of 20us. Ideal for applications requiring precise analog signal generation in commercial temperature range, it operates on 3/5V supplies with low current consumption at 1.35mA.

Median Price

$9.910

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 95 parts In-Stock

1+ parts

$12.670

100+ parts

$8.544

1k+ parts

$7.800

10k+ parts

-

95

$12.670

$8.544

$7.800

-

Mouser Electronics

USA . 86 parts In-Stock

1+ parts

$12.670

100+ parts

$8.540

1k+ parts

$7.710

10k+ parts

-

86

$12.670

$8.540

$7.710

-

Arrow

USA . 150 parts In-Stock

1+ parts

-

100+ parts

$5.861

1k+ parts

$5.441

10k+ parts

-

150

-

$5.861

$5.441

-

Rochester

USA . 2 parts In-Stock

1+ parts

-

100+ parts

$7.150

1k+ parts

$6.400

10k+ parts

$6.020

2

-

$7.150

$6.400

$6.020

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,470 parts In-Stock

1+ parts

$6.042

100+ parts

-

1k+ parts

-

10k+ parts

-

2,470

$6.042

-

-

-

Vyrian

USA . 3,182 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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3,182

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 236 parts In-Stock

1+ parts

$5.724

100+ parts

-

1k+ parts

-

10k+ parts

-

236

$5.724

-

-

-

Parana Technologies

USA . 1,081 parts In-Stock

1+ parts

$13.226

100+ parts

$1,228.262

1k+ parts

$11.904

10k+ parts

-

1,081

$13.226

$1,228.262

$11.904

-

DigiPath Technology Company

USA . 2,071 parts In-Stock

1+ parts

$14.564

100+ parts

-

1k+ parts

-

10k+ parts

-

2,071

$14.564

-

-

-

ChromeModa Solutions

Germany . 3,205 parts In-Stock

1+ parts

$14.861

100+ parts

$12.186

1k+ parts

-

10k+ parts

-

3,205

$14.861

$12.186

-

-

IDEA Electronic Components Group

UK . 2,295 parts In-Stock

1+ parts

$14.861

100+ parts

$14.118

1k+ parts

$13.375

10k+ parts

-

2,295

$14.861

$14.118

$13.375

-

Microchip USA

USA . 1,342 parts In-Stock

1+ parts

$26.910

100+ parts

$26.520

1k+ parts

$26.330

10k+ parts

$26.140

1,342

$26.910

$26.520

$26.330

$26.140

Lixinc

USA . 7,163 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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7,163

-

-

-

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A-Z Elektronik GmbH

Germany . 5,801 parts In-Stock

1+ parts

-

100+ parts

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5,801

-

-

-

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Authorized Procurement Solutions

USA . 4,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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4,000

-

-

-

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Kepictronics

USA . 2,000 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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2,000

-

-

-

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Overview

Unlock a world of precision and reliability with the TLV5616CP by Texas Instruments, a leading manufacturer known for delivering top-notch quality in digital-to-analog converters. Ideal for a wide range of applications, this product offers a maximum analog output voltage of 3.2V and a lightning-fast settling time of just 20us. With commercial-grade temperature tolerance and low power consumption, the TLV5616CP provides unbeatable value and performance for your projects. Trust in Texas Instruments to elevate your designs to new heights with the TLV5616CP.

Feature Benefit Bullets

Maximum Analog Output Voltage: 3.2 V

Higher maximum analog output voltage allows for greater range and accuracy in the converted analog signal.

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides durability and helps in maintaining the integrity of the device in various environmental conditions.

No. of Bits: 12

12-bit resolution offers higher precision and accuracy in converting digital signals to analog.

Maximum Settling Time: 20 us

Fast settling time ensures quick and efficient conversion of digital signals to analog outputs.

Power Supplies (V): 3/5

Support for multiple power supply voltages provides flexibility in different operating environments.

Maximum Operating Temperature: 70 °C

Wide operating temperature range makes the product suitable for use in various industrial and commercial applications.

Sample Rate: 0.102 MHz

High sample rate allows for accurate and real-time conversion of digital signals to analog outputs.

Technology: CMOS

CMOS technology ensures low power consumption and high performance in the digital-to-analog conversion process.

Technical Specifications

Digital-to-Analog Converters TLV5616CP attributes and parameters. Explore more Digital-to-Analog Converters devices from Texas Instruments

Converter Specifications

Technology:

CMOS

Sub-Category:

Other Converters

Input Format:

Serial

Input Bit Code:

Binary

Maximum Linearity Error (EL):

0.0977 %

Nominal Settling Time (tstl):

3 µs

Maximum Supply Current:

1.35 mA

Maximum Settling Time:

20 µs

Sample Rate:

102 kHz

No. of Bits:

12

No. of Functions:

1

Electrical Specifications

Nominal Supply Voltage:

3 V

Minimum Analog Output Voltage:

0 V

Maximum Analog Output Voltage:

3.2 V

Power Supplies:

3/5 V

Operating Conditions

Minimum Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

70 °C (158 °F)

Temperature Grade:

Form Factor

No. of Terminals:

8

Terminal Form:

Terminal Position:

Dual

Terminal Pitch:

0.1 in (2.54 mm)

Terminal Finish:

Nickel Palladium Gold

Surface Mount:

No

Width:

0.3 in (7.62 mm)

Length:

0.386 in (9.81 mm)

Maximum Seated Height:

0.2 in (5.08 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Shape:

Package Style:

In-Line

Package Code:

DIP

Package Equivalence Code:

DIP8,.3

Standards and Codes

Qualified:

No

JESD-30 Code:

R-PDIP-T8

JESD-609 Code:

e4

Trade Compliance

TLV5616CP Converters trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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