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DAC8551IADGKRG4

Texas Instruments

DAC8551IADGKRG4 by Texas Instruments

DAC8551IADGKRG4 by Texas Instruments is a 16-bit D/A converter with max analog output voltage of 5.5V and settling time of 10us. Ideal for industrial applications, it operates b/w -40 to 105°C, has a small outline package style, and requires nominal voltage of 3V.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

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Chip Stock

USA . 14,430 parts In-Stock

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Digiode

USA . 4,554 parts In-Stock

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Vyrian

USA . 3,751 parts In-Stock

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Nova Conductors

Japan . 700 parts In-Stock

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700

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Distributors (Availability)

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Parana Technologies

USA . 522 parts In-Stock

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$5.068

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$5.637

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522

$5.068

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$5.637

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ChromeModa Solutions

Germany . 5,863 parts In-Stock

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$5.694

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$4.669

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$5.694

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IDEA Electronic Components Group

UK . 661 parts In-Stock

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$5.694

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$5.125

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One Stop Electronics

USA . 984 parts In-Stock

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$14.000

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AZTECH Wire

Italy . 548 parts In-Stock

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$16.403

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Advanced Electronics

New Zealand . 1,000 parts In-Stock

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$22.896

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$21.751

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$21.751

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Corohmni

South Africa . 939 parts In-Stock

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$23.879

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Ampacity Inc.

Singapore . 1,067 parts In-Stock

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$33.000

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Semicontronic

India . 687 parts In-Stock

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$34.000

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$33.150

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$32.980

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Argo Parts USA

USA . 3,170 parts In-Stock

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Corphita

USA . 2,083 parts In-Stock

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Bastille Electronics

Australia . 1,000 parts In-Stock

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iodParts Technologies Inc.

India . 812 parts In-Stock

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DigiPath Technology Company

USA . 699 parts In-Stock

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$5.134

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Robosynatics

Brazil . 500 parts In-Stock

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Lucentia Tech

USA . 500 parts In-Stock

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Kepictronics

USA . 300 parts In-Stock

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Continental Prestige Electronics

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Germany . 236 parts In-Stock

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Modulus Dynamics

Lithuania . 74 parts In-Stock

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Overview

Experience unparalleled performance and precision with the Texas Instruments DAC8551IADGKRG4 Digital-to-Analog Converter. Crafted by the industry leader in semiconductor technology, this cutting-edge product offers exceptional quality and reliability. Ideal for a wide range of applications, this converter provides customers with seamless integration and superior results. Elevate your projects to new heights with the unmatched value and benefits that the DAC8551IADGKRG4 brings to the table. Choose Texas Instruments for innovation that exceeds expectations.

Feature Benefit Bullets

Maximum Analog Output Voltage: 5.5 V

High maximum output voltage allows for flexibility in a variety of applications, making this product a versatile choice.

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material makes this product lightweight and durable, ideal for portable or rugged environments.

Surface Mount: YES

Being surface mountable makes this product easy to integrate into circuit boards, saving space and simplifying the assembly process.

Package Shape: SQUARE

The square package shape allows for efficient use of board space and easy alignment during assembly, making this product user-friendly.

No. of Bits: 16

With a high number of bits, this product offers high resolution for precise and accurate analog output, making it suitable for applications requiring fine control.

Maximum Settling Time: 10 us

Fast settling time ensures quick response and stability, making this product suitable for dynamic applications where speed is essential.

Maximum Linearity Error (EL): 0.0183%

Low linearity error ensures accuracy and consistency in analog output, making this product reliable for precision applications.

Power Supplies (V): 3/5

Compatibility with both 3V and 5V power supplies provides flexibility in design and integration, accommodating a range of power requirements.

No. of Terminals: 8

With a moderate number of terminals, this product offers a balance between connectivity and compactness, suitable for various PCB layouts.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The small outline, thin profile, and shrink pitch package style offer space-saving advantages, making this product ideal for applications with limited board space.

Nominal Settling Time (tstl): 12 us

The nominal settling time provides a reliable benchmark for performance, ensuring consistent operation in various conditions.

Maximum Operating Temperature: 105 °C

High maximum operating temperature tolerance enables operation in challenging environments, making this product suitable for industrial applications.

Minimum Operating Temperature: -40 °C

With a low minimum operating temperature, this product can withstand cold conditions, making it suitable for outdoor or harsh environments.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold terminal finish offers excellent corrosion resistance and conductivity, ensuring long-term reliability in various operating conditions.

Terminal Position: DUAL

Dual terminal position provides added flexibility in PCB layout and installation, enhancing usability and compatibility.

Maximum Seated Height: 1.1 mm

The maximum seated height of 1.1 mm allows for low-profile designs, making this product suitable for space-constrained applications.

Width: 3 mm

The compact width of 3 mm contributes to a small footprint, allowing for efficient use of board space and easy integration into compact systems.

Maximum Time At Peak Reflow Temperature (s): 30

The maximum time at peak reflow temperature indicates robustness during soldering processes, ensuring reliable performance during assembly.

Peak Reflow Temperature °C: 260

High peak reflow temperature tolerance ensures compatibility with standard soldering processes, making this product easy to integrate into manufacturing workflows.

Minimum Analog Output Voltage: 0 V

The ability to achieve a zero output voltage allows for precise control and flexibility in analog signal generation, making this product versatile in various applications.

Length: 3 mm

The compact length of 3 mm contributes to a small overall footprint, making this product suitable for space-constrained designs.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures reliable performance in harsh operating conditions, making this product suitable for industrial and automotive applications.

Terminal Form: GULL WING

The gull wing terminal form offers secure mechanical attachment and ease of soldering, ensuring a reliable connection in various environments.

Maximum Supply Current: 0.25 mA

Low maximum supply current consumption results in low power consumption, making this product energy-efficient and suitable for battery-operated devices.

Input Format: SERIAL

Serial input format offers ease of integration and communication with other digital systems, enhancing compatibility and flexibility in application design.

Converter Type: D/A CONVERTER

As a digital-to-analog converter, this product provides precise and accurate analog output from digital input signals, making it essential for digital control and signal processing applications.

Nominal Supply Voltage: 3 V

The nominal supply voltage of 3V offers compatibility with standard power sources, making this product easy to integrate into existing designs and systems.

Terminal Pitch: 0.65 mm

The terminal pitch of 0.65 mm allows for precise and secure connections, ensuring reliable operation in various environments.

Input Bit Code: BINARY, 2'S COMPLEMENT BINARY

Support for both binary and 2's complement binary input bit codes enhances flexibility in data representation, making this product compatible with a wide range of digital systems.

Technical Specifications

Digital-to-Analog Converters DAC8551IADGKRG4 attributes and parameters. Explore more Digital-to-Analog Converters devices from Texas Instruments

Converter Specifications

Sub-Category:

Other Converters

Input Format:

Serial

Input Bit Code:

Binary, 2's Complement Binary

Maximum Linearity Error (EL):

0.0183 %

Nominal Settling Time (tstl):

12 µs

Maximum Supply Current:

250 μA

Maximum Settling Time:

10 µs

No. of Bits:

16

No. of Functions:

1

Electrical Specifications

Nominal Supply Voltage:

3 V

Minimum Analog Output Voltage:

0 V

Maximum Analog Output Voltage:

5.5 V

Power Supplies:

3/5 V

Operating Conditions

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

105 °C (221 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Maximum Time At Peak Reflow Temperature:

30 s

Moisture Sensitivity Level (MSL):

1

Form Factor

No. of Terminals:

8

Terminal Form:

Terminal Position:

Dual

Terminal Pitch:

0.026 in (0.65 mm)

Terminal Finish:

Nickel Palladium Gold

Surface Mount:

Yes

Width:

0.118 in (3 mm)

Length:

0.118 in (3 mm)

Maximum Seated Height:

0.043 in (1.1 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Shape:

Package Style:

Small Outline, Thin Profile, Shrink Pitch

Package Code:

Package Equivalence Code:

TSSOP8,.19

Standards and Codes

Qualified:

No

JESD-30 Code:

S-PDSO-G8

JESD-609 Code:

e4

Trade Compliance

DAC8551IADGKRG4 Converters trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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