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TLV320DAC23RHDG4

Texas Instruments

TLV320DAC23RHDG4 by Texas Instruments

TLV320DAC23RHDG4 by Texas Instruments is a 32-bit D/A converter with 1.5/3.3,3.3 V power supplies and SERIAL input format. It comes in a PLASTIC/EPOXY package style with NICKEL PALLADIUM GOLD terminal finish, suitable for commercial temperature grade applications. The chip carrier has a square shape, QUAD terminal position, and 0.5 mm terminal pitch for compact designs requiring high-quality audio output.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,970 parts In-Stock

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4,970

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Digiode

USA . 4,366 parts In-Stock

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4,366

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ACDS - Activité Composants Distribution Service

France . 73 parts In-Stock

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73

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Euro-Tech

UK . 69 parts In-Stock

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69

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 2,004 parts In-Stock

1+ parts

$12.542

100+ parts

-

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$12.995

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2,004

$12.542

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$12.995

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DigiPath Technology Company

USA . 1,304 parts In-Stock

1+ parts

$13.810

100+ parts

$12.705

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1,304

$13.810

$12.705

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ChromeModa Solutions

Germany . 2,169 parts In-Stock

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$14.092

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$11.555

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2,169

$14.092

$11.555

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IDEA Electronic Components Group

UK . 487 parts In-Stock

1+ parts

$14.092

100+ parts

$13.387

1k+ parts

$12.683

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487

$14.092

$13.387

$12.683

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AZTECH Wire

Italy . 510 parts In-Stock

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$16.780

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510

$16.780

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One Stop Electronics

USA . 1,321 parts In-Stock

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$32.000

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1,321

$32.000

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Component Stockers USA

USA . 355 parts In-Stock

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$99.990

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355

$99.990

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Corphita

USA . 3,212 parts In-Stock

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3,212

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Perfect Parts

USA . 164 parts In-Stock

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164

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Cyclops Electronics Ltd (Excess)

UK . 73 parts In-Stock

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73

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Overview

Unlock the power of audio with the TLV320DAC23RHDG4 by Texas Instruments. Crafted with precision and innovation, this Digital-to-Analog Converter offers unparalleled sound quality and reliability. Whether you're a music enthusiast, audiophile, or professional in need of top-notch audio performance, this product delivers exceptional value and benefits. Elevate your listening experience with the TLV320DAC23RHDG4 and immerse yourself in crystal-clear sound like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material in the package body ensures durability and protection for the internal components of the digital-to-analog converter.

Surface Mount: YES

The surface mount capability allows for easy and efficient installation onto circuit boards, saving space and simplifying the manufacturing process.

No. of Bits: 32

With 32 bits, this digital-to-analog converter can provide high resolution and accuracy in converting digital signals to analog signals, suitable for a wide range of applications.

Power Supplies (V): 1.5/3.3,3.3

The multiple voltage options for power supplies allow flexibility in usage and compatibility with various systems and environments.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The different package styles offer versatility in installation and heat dissipation, catering to different design requirements.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature ensures reliable performance even under demanding conditions, making it suitable for industrial applications.

Minimum Operating Temperature: -10 °C

The low minimum operating temperature allows for operation in cold environments without compromising performance, increasing the product's usability range.

Input Format: SERIAL

The serial input format simplifies the integration of this digital-to-analog converter into existing systems and allows for streamlined data transmission.

Nominal Supply Voltage: 3.3 V

The 3.3 V nominal supply voltage is common in many electronic devices, ensuring compatibility and ease of integration with various systems.

Technical Specifications

Digital-to-Analog Converters TLV320DAC23RHDG4 attributes and parameters. Explore more Digital-to-Analog Converters devices from Texas Instruments

Converter Specifications

Sub-Category:

Other Converters

Input Format:

Serial

Input Bit Code:

Binary

Maximum Supply Current:

8 mA

No. of Bits:

32

No. of Functions:

1

Electrical Specifications

Nominal Supply Voltage:

3.3 V

Power Supplies:

1.5/3.3,3.3 V

Operating Conditions

Minimum Operating Temperature:

-10 °C (14 °F)

Maximum Operating Temperature:

70 °C (158 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Maximum Time At Peak Reflow Temperature:

30 s

Moisture Sensitivity Level (MSL):

2

Form Factor

No. of Terminals:

28

Terminal Form:

Terminal Position:

Quad

Terminal Pitch:

0.02 in (0.5 mm)

Terminal Finish:

Nickel Palladium Gold

Surface Mount:

Yes

Width:

0.197 in (5 mm)

Length:

0.197 in (5 mm)

Maximum Seated Height:

0.039 in (1 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Shape:

Package Style:

Chip Carrier, Heat Sink/Slug, Very Thin Profile

Package Code:

Package Equivalence Code:

LCC32,.2SQ,20

Standards and Codes

Qualified:

No

JESD-30 Code:

S-PQCC-N28

JESD-609 Code:

e4

Trade Compliance

TLV320DAC23RHDG4 Converters trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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