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TLV320DAC23IPW

Texas Instruments

TLV320DAC23IPW by Texas Instruments

D/A CONVERTER; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 28; Package Code: TSSOP; Package Shape: RECTANGULAR;

Median Price

$3.800

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 2,172 parts In-Stock

1+ parts

-

100+ parts

$4.080

1k+ parts

-

10k+ parts

-

2,172

-

$4.080

-

-

Rochester

USA . 36 parts In-Stock

1+ parts

-

100+ parts

$3.520

1k+ parts

$3.150

10k+ parts

$2.970

36

-

$3.520

$3.150

$2.970

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,735 parts In-Stock

1+ parts

$3.724

100+ parts

-

1k+ parts

-

10k+ parts

-

2,735

$3.724

-

-

-

Vyrian

USA . 3,520 parts In-Stock

1+ parts

$3.920

100+ parts

-

1k+ parts

-

10k+ parts

-

3,520

$3.920

-

-

-

DigiKey Marketplace

USA . 2,312 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,312

-

-

-

-

Sensible Micro Corp

USA . 168 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

168

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 2,795 parts In-Stock

1+ parts

$3.528

100+ parts

-

1k+ parts

-

10k+ parts

-

2,795

$3.528

-

-

-

Parana Technologies

USA . 162 parts In-Stock

1+ parts

$12.489

100+ parts

$1,159.827

1k+ parts

$11.240

10k+ parts

-

162

$12.489

$1,159.827

$11.240

-

DigiPath Technology Company

USA . 116 parts In-Stock

1+ parts

$13.752

100+ parts

-

1k+ parts

-

10k+ parts

-

116

$13.752

-

-

-

ChromeModa Solutions

Germany . 6,263 parts In-Stock

1+ parts

$14.033

100+ parts

$11.507

1k+ parts

-

10k+ parts

-

6,263

$14.033

$11.507

-

-

IDEA Electronic Components Group

UK . 1,623 parts In-Stock

1+ parts

$14.033

100+ parts

$13.331

1k+ parts

$12.630

10k+ parts

-

1,623

$14.033

$13.331

$12.630

-

Authorized Procurement Solutions

USA . 7,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,000

-

-

-

-

Glotronic Ltd.

UK . 440 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

440

-

-

-

-

Microchip USA

USA . 205 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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205

-

-

-

-

Kepictronics

USA . 184 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

184

-

-

-

-

Technical Specifications

Digital-to-Analog Converters TLV320DAC23IPW attributes and parameters. Explore more Digital-to-Analog Converters devices from Texas Instruments

Converter Specifications

Sub-Category:

Other Converters

Input Format:

Serial

Input Bit Code:

Binary

Maximum Supply Current:

8 mA

No. of Bits:

32

No. of Functions:

1

Electrical Specifications

Nominal Supply Voltage:

3.3 V

Power Supplies:

1.5/3.3,3.3 V

Minimum Supply Voltage:

2.7 V

Operating Conditions

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Maximum Time At Peak Reflow Temperature:

30 s

Moisture Sensitivity Level (MSL):

1

Form Factor

No. of Terminals:

28

Terminal Form:

Terminal Position:

Dual

Terminal Pitch:

0.026 in (0.65 mm)

Terminal Finish:

Nickel Palladium Gold

Surface Mount:

Yes

Width:

0.173 in (4.4 mm)

Length:

0.382 in (9.7 mm)

Maximum Seated Height:

0.047 in (1.2 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Shape:

Package Style:

Small Outline, Thin Profile, Shrink Pitch

Package Code:

Package Equivalence Code:

TSSOP28,.25

Standards and Codes

Qualified:

No

JESD-30 Code:

R-PDSO-G28

JESD-609 Code:

e4

Trade Compliance

TLV320DAC23IPW Converters trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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