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TLV320DAC23PWG4

Texas Instruments

TLV320DAC23PWG4 by Texas Instruments

TLV320DAC23PWG4 by Texas Instruments is a 32-bit D/A converter with 3.3V nominal voltage and 8mA max supply current. It features a small outline package style, serial input format, and operates in commercial temperature grade range. Ideal for audio applications requiring precise analog signal conversion in compact designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,954 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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8,954

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-

-

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Digiode

USA . 2,923 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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2,923

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Semi Source

USA . 675 parts In-Stock

1+ parts

-

100+ parts

-

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10k+ parts

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675

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 726 parts In-Stock

1+ parts

$5.887

100+ parts

-

1k+ parts

$6.671

10k+ parts

-

726

$5.887

-

$6.671

-

DigiPath Technology Company

USA . 995 parts In-Stock

1+ parts

$6.483

100+ parts

$5.964

1k+ parts

-

10k+ parts

-

995

$6.483

$5.964

-

-

ChromeModa Solutions

Germany . 4,234 parts In-Stock

1+ parts

$6.615

100+ parts

$5.424

1k+ parts

-

10k+ parts

-

4,234

$6.615

$5.424

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IDEA Electronic Components Group

UK . 25 parts In-Stock

1+ parts

$6.615

100+ parts

-

1k+ parts

$5.954

10k+ parts

-

25

$6.615

-

$5.954

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AZTECH Wire

Italy . 582 parts In-Stock

1+ parts

$7.353

100+ parts

-

1k+ parts

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10k+ parts

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582

$7.353

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One Stop Electronics

USA . 1,196 parts In-Stock

1+ parts

$23.000

100+ parts

-

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1,196

$23.000

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Corphita

USA . 4,635 parts In-Stock

1+ parts

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4,635

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Microchip USA

USA . 453 parts In-Stock

1+ parts

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1k+ parts

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453

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Overview

Experience crystal-clear audio quality like never before with the TLV320DAC23PWG4 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-notch digital-to-analog converters that are perfect for a wide range of applications. Whether you're looking to enhance your audio equipment or improve signal processing capabilities, this product offers unmatched value, benefits, and advantages. Upgrade your sound experience today with the TLV320DAC23PWG4 and discover the difference for yourself.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and low cost, making it a reliable choice for industrial applications.

Surface Mount: YES

The surface mount design allows for easy and compact integration onto circuit boards, saving space and simplifying assembly.

No. of Bits: 32

The 32-bit resolution provides high precision and accuracy in converting digital signals to analog, suitable for high-performance audio or measurement applications.

Power Supplies (V): 1.5/3.3,3.3

The versatile voltage supply options allow compatibility with different systems and power requirements, enhancing flexibility in design.

Maximum Operating Temperature: 70 °C

With a high maximum operating temperature, this product can withstand harsh environmental conditions and ensure reliable performance even in industrial settings.

Terminal Finish: NICKEL PALLADIUM GOLD

The use of nickel palladium gold terminal finish provides excellent conductivity and corrosion resistance, ensuring stable connections and long-term reliability.

Converter Type: D/A CONVERTER

Being a digital-to-analog converter, this product is essential for converting digital signals from microcontrollers or digital signal processors into analog signals for various applications.

Technical Specifications

Digital-to-Analog Converters TLV320DAC23PWG4 attributes and parameters. Explore more Digital-to-Analog Converters devices from Texas Instruments

Converter Specifications

Sub-Category:

Other Converters

Input Format:

Serial

Input Bit Code:

Binary

Maximum Supply Current:

8 mA

No. of Bits:

32

No. of Functions:

1

Electrical Specifications

Nominal Supply Voltage:

3.3 V

Power Supplies:

1.5/3.3,3.3 V

Operating Conditions

Minimum Operating Temperature:

-10 °C (14 °F)

Maximum Operating Temperature:

70 °C (158 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Maximum Time At Peak Reflow Temperature:

30 s

Moisture Sensitivity Level (MSL):

1

Form Factor

No. of Terminals:

28

Terminal Form:

Terminal Position:

Dual

Terminal Pitch:

0.026 in (0.65 mm)

Terminal Finish:

Nickel Palladium Gold

Surface Mount:

Yes

Width:

0.173 in (4.4 mm)

Length:

0.382 in (9.7 mm)

Maximum Seated Height:

0.047 in (1.2 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Shape:

Package Style:

Small Outline, Thin Profile, Shrink Pitch

Package Code:

Package Equivalence Code:

TSSOP28,.25

Standards and Codes

Qualified:

No

JESD-30 Code:

R-PDSO-G28

JESD-609 Code:

e4

Trade Compliance

TLV320DAC23PWG4 Converters trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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