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DAC8822QCDBTRG4

Texas Instruments

DAC8822QCDBTRG4 by Texas Instruments

DAC8822QCDBTRG4 by Texas Instruments is a 16-bit D/A converter with 10V max analog output voltage, 0.0015% max linearity error, and 0.5us nominal settling time. Ideal for automotive applications, it operates b/w -40 to 125 °C with a supply voltage of 3/5V.

Median Price

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Lifecycle Status

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4

In-Stock Inventory

1k+

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Chip Stock

USA . 6,300 parts In-Stock

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Vyrian

USA . 3,858 parts In-Stock

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Digiode

USA . 3,741 parts In-Stock

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Nova Conductors

Japan . 50 parts In-Stock

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Corohmni

South Africa . 700 parts In-Stock

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$5.585

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700

$5.585

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One Stop Electronics

USA . 1,039 parts In-Stock

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$7.000

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AZTECH Wire

Italy . 295 parts In-Stock

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$10.623

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Semicontronic

India . 366 parts In-Stock

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$12.000

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$11.700

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$11.640

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Parana Technologies

USA . 1,427 parts In-Stock

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$12.472

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$12.911

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DigiPath Technology Company

USA . 657 parts In-Stock

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$13.733

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ChromeModa Solutions

Germany . 5,621 parts In-Stock

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$14.013

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$11.491

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IDEA Electronic Components Group

UK . 1,229 parts In-Stock

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$12.612

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Advanced Electronics

New Zealand . 81 parts In-Stock

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$16.054

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Ampacity Inc.

Singapore . 1,294 parts In-Stock

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Lixinc

USA . 15,127 parts In-Stock

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iodParts Technologies Inc.

India . 10,000 parts In-Stock

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Argo Parts USA

USA . 4,433 parts In-Stock

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Corphita

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Continental Prestige Electronics

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Bastille Electronics

Australia . 100 parts In-Stock

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Overview

Unlock the power of precision with the Texas Instruments DAC8822QCDBTRG4 Digital-to-Analog Converter. Crafted by a trusted manufacturer, this innovative device offers unparalleled quality and reliability. Ideal for automotive applications, this converter boasts a 16-bit resolution and maximum linearity error of just 0.0015%. With a compact design and fast settling time, customers can expect seamless performance and enhanced functionality. Elevate your projects with this cutting-edge solution that delivers superior value and unmatched benefits.

Feature Benefit Bullets

Maximum Analog Output Voltage: 10 V

The high maximum analog output voltage of 10 V allows for a wide range of output signals, making this product suitable for a variety of applications requiring precise voltage control.

No. of Bits: 16

With 16 bits, this digital-to-analog converter offers high resolution and accuracy in converting digital signals to analog output, ensuring fine control and smooth transitions.

Nominal Settling Time (tstl): 0.5 us

The fast settling time of 0.5 microseconds enables quick and accurate conversion, making this product ideal for time-sensitive applications where rapid response is crucial.

Temperature Grade: AUTOMOTIVE

Designed for automotive applications, this digital-to-analog converter can withstand a wide temperature range from -40°C to 125°C, ensuring reliable performance in harsh environmental conditions.

Input Format: PARALLEL, WORD

Supporting parallel input format for word data, this converter simplifies the interface with digital systems, allowing for easy integration and compatibility with a wide range of devices.

Technical Specifications

Digital-to-Analog Converters DAC8822QCDBTRG4 attributes and parameters. Explore more Digital-to-Analog Converters devices from Texas Instruments

Converter Specifications

Sub-Category:

Other Converters

Input Format:

Parallel, Word

Input Bit Code:

Binary

Maximum Linearity Error (EL):

0.0015 %

Nominal Settling Time (tstl):

500 ns

Maximum Supply Current:

6 μA

No. of Bits:

16

No. of Functions:

1

Electrical Specifications

Nominal Supply Voltage:

5 V

Minimum Analog Output Voltage:

-10 V

Maximum Analog Output Voltage:

10 V

Power Supplies:

3/5 V

Operating Conditions

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

125 °C (257 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Maximum Time At Peak Reflow Temperature:

30 s

Moisture Sensitivity Level (MSL):

2

Form Factor

No. of Terminals:

38

Terminal Form:

Terminal Position:

Dual

Terminal Pitch:

0.02 in (0.5 mm)

Terminal Finish:

Nickel Palladium Gold

Surface Mount:

Yes

Width:

0.173 in (4.4 mm)

Length:

0.382 in (9.7 mm)

Maximum Seated Height:

0.047 in (1.2 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Shape:

Package Style:

Small Outline, Thin Profile, Shrink Pitch

Package Code:

Package Equivalence Code:

TSSOP38,.25,20

Standards and Codes

Qualified:

No

JESD-30 Code:

R-PDSO-G38

JESD-609 Code:

e4

Trade Compliance

DAC8822QCDBTRG4 Converters trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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