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TLV320DAC23IRHDG4

Texas Instruments

TLV320DAC23IRHDG4 by Texas Instruments

TLV320DAC23IRHDG4 by Texas Instruments is a 32-bit D/A converter with 3.3V nominal voltage, operating from -40 to 85°C. It features serial input format, quad terminal position, and no-lead terminal form. Ideal for industrial applications requiring high-quality audio conversion in a compact chip carrier package.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,599 parts In-Stock

1+ parts

-

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4,599

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Digiode

USA . 394 parts In-Stock

1+ parts

-

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-

1k+ parts

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394

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 166 parts In-Stock

1+ parts

$4.000

100+ parts

-

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-

166

$4.000

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Parana Technologies

USA . 2,193 parts In-Stock

1+ parts

$6.119

100+ parts

-

1k+ parts

$6.891

10k+ parts

-

2,193

$6.119

-

$6.891

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ChromeModa Solutions

Germany . 2,511 parts In-Stock

1+ parts

$6.875

100+ parts

$5.638

1k+ parts

-

10k+ parts

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2,511

$6.875

$5.638

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IDEA Electronic Components Group

UK . 2,028 parts In-Stock

1+ parts

$6.875

100+ parts

-

1k+ parts

$6.188

10k+ parts

-

2,028

$6.875

-

$6.188

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AZTECH Wire

Italy . 389 parts In-Stock

1+ parts

$9.948

100+ parts

-

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10k+ parts

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389

$9.948

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Kepictronics

USA . 1,195 parts In-Stock

1+ parts

-

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1,195

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Corphita

USA . 715 parts In-Stock

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715

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DigiPath Technology Company

USA . 495 parts In-Stock

1+ parts

-

100+ parts

$6.198

1k+ parts

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10k+ parts

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495

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$6.198

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Overview

Unlock the power of digital sound with the TLV320DAC23IRHDG4 by Texas Instruments, a top-of-the-line Digital-to-Analog Converter. Crafted with precision and expertise, this converter offers unparalleled audio quality and seamless performance. Whether you're designing professional audio equipment or enhancing your home entertainment system, this product provides crystal-clear sound reproduction and precise signal conversion. Elevate your audio experience with Texas Instruments' TLV320DAC23IRHDG4 and immerse yourself in the purest, most pristine sound imaginable.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the product suitable for various applications without adding unnecessary weight.

Surface Mount: YES

Allows for easy and secure installation on circuit boards, saving time and effort during assembly.

No. of Bits: 32

High resolution with 32 bits ensures accurate and precise conversion of digital signals to analog, resulting in high-quality output.

Power Supplies (V): 1.5/3.3,3.3

Flexible power supply options allow for compatibility with different systems, providing versatility in use.

No. of Terminals: 28

Sufficient number of terminals for connecting to other components and circuits, enabling seamless integration.

Maximum Operating Temperature: 85 °C

High maximum operating temperature ensures reliability and stability even in harsh environmental conditions.

Minimum Operating Temperature: -40 °C

Wide range of operating temperature ensures functionality in a variety of settings, from extreme cold to hot environments.

Terminal Finish: NICKEL PALLADIUM GOLD

Durable finish that resists corrosion and ensures long-term performance and reliability.

Temperature Grade: INDUSTRIAL

Suitable for industrial applications where reliability and durability are crucial, making it a robust choice for various industries.

Technical Specifications

Digital-to-Analog Converters TLV320DAC23IRHDG4 attributes and parameters. Explore more Digital-to-Analog Converters devices from Texas Instruments

Converter Specifications

Sub-Category:

Other Converters

Input Format:

Serial

Input Bit Code:

Binary

No. of Bits:

32

No. of Functions:

1

Electrical Specifications

Nominal Supply Voltage:

3.3 V

Power Supplies:

1.5/3.3,3.3 V

Operating Conditions

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Maximum Time At Peak Reflow Temperature:

30 s

Moisture Sensitivity Level (MSL):

2

Form Factor

No. of Terminals:

28

Terminal Form:

Terminal Position:

Quad

Terminal Pitch:

0.02 in (0.5 mm)

Terminal Finish:

Nickel Palladium Gold

Surface Mount:

Yes

Width:

0.197 in (5 mm)

Length:

0.197 in (5 mm)

Maximum Seated Height:

0.039 in (1 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Shape:

Package Style:

Chip Carrier, Heat Sink/Slug, Very Thin Profile

Package Code:

Package Equivalence Code:

LCC32,.2SQ,20

Standards and Codes

Qualified:

No

JESD-30 Code:

S-PQCC-N28

JESD-609 Code:

e4

Trade Compliance

TLV320DAC23IRHDG4 Converters trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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