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TLV320DAC23IPWR

Texas Instruments

TLV320DAC23IPWR by Texas Instruments

TLV320DAC23IPWR by Texas Instruments is a 32-bit D/A converter with 1.5/3.3,3.3 V power supplies and -40 to 85°C operating temperature range. It features a small outline package style and gull wing terminal form, suitable for industrial applications requiring high-quality digital-to-analog conversion in compact spaces.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,319 parts In-Stock

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8,319

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Digiode

USA . 4,154 parts In-Stock

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4,154

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 216 parts In-Stock

1+ parts

$11.989

100+ parts

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216

$11.989

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Parana Technologies

USA . 65 parts In-Stock

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$21.413

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-

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$21.762

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65

$21.413

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$21.762

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DigiPath Technology Company

USA . 748 parts In-Stock

1+ parts

$23.578

100+ parts

$21.692

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748

$23.578

$21.692

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ChromeModa Solutions

Germany . 4,296 parts In-Stock

1+ parts

$24.059

100+ parts

$19.728

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4,296

$24.059

$19.728

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IDEA Electronic Components Group

UK . 2,344 parts In-Stock

1+ parts

$24.059

100+ parts

$22.856

1k+ parts

$21.653

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2,344

$24.059

$22.856

$21.653

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One Stop Electronics

USA . 1,152 parts In-Stock

1+ parts

$27.000

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1,152

$27.000

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Corphita

USA . 4,117 parts In-Stock

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4,117

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Assy Fe

Spain . 1,160 parts In-Stock

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Microchip USA

USA . 389 parts In-Stock

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389

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Kepictronics

USA . 251 parts In-Stock

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251

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Overview

Enhance your audio experience with the TLV320DAC23IPWR by Texas Instruments, a top-of-the-line Digital-to-Analog Converter designed for superior performance and precision. Crafted by a renowned manufacturer, this product guarantees quality and reliability in converting digital signals to analog, making it perfect for a range of applications. With its compact design and innovative features, this converter offers unmatched value and benefits to customers, ensuring crystal-clear sound and seamless integration into any system. Elevate your audio projects with the TLV320DAC23IPWR and experience unparalleled audio quality like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for portable and long-lasting applications.

No. of Bits: 32

The high number of bits allows for accurate and precise conversion of digital signals to analog, resulting in high-quality output.

Minimum Supply Voltage: 2.7 V

The low minimum supply voltage requirement allows for efficient power usage and compatibility with a wide range of power sources.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures reliable performance even in harsh environmental conditions.

Input Format: SERIAL

The serial input format simplifies the interface with other devices, making integration and communication easier.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures the product can withstand and operate in industrial environments with varying temperature ranges.

Converter Type: D/A CONVERTER

Being a digital-to-analog converter, this product is essential for converting digital signals from systems like microcontrollers to analog signals for applications like audio output.

Technical Specifications

Digital-to-Analog Converters TLV320DAC23IPWR attributes and parameters. Explore more Digital-to-Analog Converters devices from Texas Instruments

Converter Specifications

Sub-Category:

Other Converters

Input Format:

Serial

Input Bit Code:

Binary

Maximum Supply Current:

8 mA

No. of Bits:

32

No. of Functions:

1

Electrical Specifications

Nominal Supply Voltage:

3.3 V

Power Supplies:

1.5/3.3,3.3 V

Minimum Supply Voltage:

2.7 V

Operating Conditions

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Maximum Time At Peak Reflow Temperature:

30 s

Moisture Sensitivity Level (MSL):

1

Form Factor

No. of Terminals:

28

Terminal Form:

Terminal Position:

Dual

Terminal Pitch:

0.026 in (0.65 mm)

Terminal Finish:

Nickel Palladium Gold

Surface Mount:

Yes

Width:

0.173 in (4.4 mm)

Length:

0.382 in (9.7 mm)

Maximum Seated Height:

0.047 in (1.2 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Shape:

Package Style:

Small Outline, Thin Profile, Shrink Pitch

Package Code:

Package Equivalence Code:

TSSOP28,.25

Standards and Codes

Qualified:

No

JESD-30 Code:

R-PDSO-G28

JESD-609 Code:

e4

Trade Compliance

TLV320DAC23IPWR Converters trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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