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TLV320AD12APZ

Texas Instruments

TLV320AD12APZ by Texas Instruments

TLV320AD12APZ by Texas Instruments is a 100-terminal audio codec in a square package with synchronous operation. It has a temperature range of 0-70°C, operates at 3.3V, and features an ADSL codec for telecom applications. The codec includes filters and is designed for surface mount assembly with gull wing terminals.

Median Price

$11.725

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 2,990 parts In-Stock

1+ parts

-

100+ parts

$9.380

1k+ parts

$8.390

10k+ parts

$7.900

2,990

-

$9.380

$8.390

$7.900

DigiKey

USA . 2,990 parts In-Stock

1+ parts

-

100+ parts

$12.340

1k+ parts

-

10k+ parts

-

2,990

-

$12.340

-

-

Verical

USA . 2,990 parts In-Stock

1+ parts

-

100+ parts

$11.725

1k+ parts

$10.488

10k+ parts

$9.875

2,990

-

$11.725

$10.488

$9.875

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,654 parts In-Stock

1+ parts

$9.899

100+ parts

-

1k+ parts

-

10k+ parts

-

2,654

$9.899

-

-

-

Vyrian

USA . 1,179 parts In-Stock

1+ parts

$10.420

100+ parts

-

1k+ parts

-

10k+ parts

-

1,179

$10.420

-

-

-

DigiKey Marketplace

USA . 2,990 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,990

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,506 parts In-Stock

1+ parts

$9.378

100+ parts

-

1k+ parts

-

10k+ parts

-

1,506

$9.378

-

-

-

Parana Technologies

USA . 459 parts In-Stock

1+ parts

$15.473

100+ parts

-

1k+ parts

$15.856

10k+ parts

-

459

$15.473

-

$15.856

-

IDEA Electronic Components Group

UK . 1,346 parts In-Stock

1+ parts

$17.385

100+ parts

$16.516

1k+ parts

$15.646

10k+ parts

-

1,346

$17.385

$16.516

$15.646

-

ChromeModa Solutions

Germany . 466 parts In-Stock

1+ parts

$17.385

100+ parts

$14.256

1k+ parts

-

10k+ parts

-

466

$17.385

$14.256

-

-

DigiPath Technology Company

USA . 2,076 parts In-Stock

1+ parts

-

100+ parts

$15.674

1k+ parts

-

10k+ parts

-

2,076

-

$15.674

-

-

Overview

Experience the unparalleled quality and innovation of Texas Instruments with the TLV320AD12APZ Audio Codec. Designed for a wide range of applications, this cutting-edge product offers crystal-clear sound performance and seamless integration. Whether you're in the telecommunications industry or working on ADSL projects, this codec delivers exceptional value and benefits to meet your needs. Trust Texas Instruments for superior products that exceed expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material in the package body makes the product lightweight and durable, ideal for portable audio devices.

Surface Mount: YES

Being surface mountable allows for easy and efficient PCB assembly, saving time and reducing production costs.

Operating Mode: SYNCHRONOUS

The synchronous operating mode ensures precise synchronization of audio data, resulting in high-quality audio output.

No. of Terminals: 100

Having a large number of terminals provides flexibility for connecting various components, enhancing the product's functionality.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature allows the product to perform reliably in a wide range of environmental conditions.

Nominal Supply Voltage: 3.3 V

The nominal supply voltage of 3.3V is common in most electronic devices, making it compatible with a wide range of applications.

Technical Specifications

Audio Codecs TLV320AD12APZ attributes and parameters. Explore more Audio Codecs devices from Texas Instruments

Specs

Filter:

YES

JESD-30 Code:

S-PQFP-G100

Length:

14 mm

No. of Functions:

1

No. of Terminals:

100

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Qualification:

Not Qualified

Maximum Seated Height:

1.6 mm

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

14 mm

Trade Compliance

TLV320AD12APZ Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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