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TLV1549IDRG4

Texas Instruments

TLV1549IDRG4 by Texas Instruments

TLV1549IDRG4 by Texas Instruments is a 10-bit ADC with 0.0977% linearity error, 21us conversion time, and 3.3V supply voltage. Ideal for industrial applications requiring precise analog-to-digital conversion in a compact package with serial output format.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,481 parts In-Stock

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Digiode

USA . 3,967 parts In-Stock

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3,967

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Distributors (Availability)

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AZTECH Wire

Italy . 783 parts In-Stock

1+ parts

$11.361

100+ parts

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783

$11.361

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Parana Technologies

USA . 273 parts In-Stock

1+ parts

$20.238

100+ parts

-

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$20.226

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273

$20.238

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$20.226

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ChromeModa Solutions

Germany . 4,708 parts In-Stock

1+ parts

$22.739

100+ parts

$18.646

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4,708

$22.739

$18.646

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IDEA Electronic Components Group

UK . 1,105 parts In-Stock

1+ parts

$22.739

100+ parts

$21.602

1k+ parts

$20.465

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1,105

$22.739

$21.602

$20.465

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One Stop Electronics

USA . 404 parts In-Stock

1+ parts

$37.000

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404

$37.000

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Component Stockers USA

USA . 433 parts In-Stock

1+ parts

$99.990

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433

$99.990

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Corphita

USA . 4,938 parts In-Stock

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Microchip USA

USA . 311 parts In-Stock

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311

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Kepictronics

USA . 250 parts In-Stock

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250

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DigiPath Technology Company

USA . 26 parts In-Stock

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$20.501

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26

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$20.501

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Overview

Experience superior analog-to-digital conversion with the TLV1549IDRG4 by Texas Instruments. This cutting-edge ADC offers unmatched quality and reliability, backed by the renowned reputation of its manufacturer. Ideal for a wide range of applications, this converter provides precise and efficient performance, delivering exceptional value to customers. Trust in Texas Instruments and elevate your projects with the TLV1549IDRG4.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and lightweight, making the product suitable for various applications while maintaining longevity.

No. of Bits: 10

With a 10-bit resolution, this ADC can provide detailed and accurate conversion of analog signals into digital data.

Maximum Linearity Error (EL): 0.0977 %

The low linearity error percentage ensures accuracy in the conversion process, resulting in precise digital outputs.

Technology: CMOS

CMOS technology offers low power consumption and high speed operation, making the ADC efficient and reliable.

Maximum Operating Temperature: 85 °C

The wide temperature range allows the ADC to function effectively in different environmental conditions, enhancing its versatility.

Output Format: SERIAL

The serial output format simplifies data transmission and integration with other digital systems, improving overall system performance.

Technical Specifications

Analog-to-Digital Converters TLV1549IDRG4 attributes and parameters. Explore more Analog-to-Digital Converters devices from Texas Instruments

Converter Specifications

No. of Analog In Channels:

1

No. of Functions:

1

No. of Bits:

10

Sub-Category:

Analog to Digital Converters

Output Bit Code:

Binary

Output Format:

Serial

Maximum Linearity Error (EL):

0.0977 %

Hold Mode:

Sample

Maximum Conversion Time:

21 µs

Electrical Specifications

Power Supplies:

3.3 V

Minimum Analog Input Voltage:

0 mV

Maximum Analog Input Voltage:

3.3 V

Nominal Supply Voltage:

3.3 V

Operating Conditions

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Form Factor

Terminal Position:

Dual

No. of Terminals:

8

Terminal Form:

Terminal Pitch:

0.05 in (1.27 mm)

Surface Mount:

Yes

Width:

0.154 in (3.9 mm)

Length:

0.193 in (4.9 mm)

Maximum Seated Height:

0.069 in (1.75 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

Small Outline

Package Shape:

Package Equivalence Code:

SOP8,.25

Package Code:

SOP

Standards and Codes

JESD-30 Code:

R-PDSO-G8

Qualified:

No

Trade Compliance

TLV1549IDRG4 Converters trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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