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TLV1508IPWG4

Texas Instruments

TLV1508IPWG4 by Texas Instruments

TLV1508IPWG4 by Texas Instruments is a 10-bit ADC with 8 analog input channels, 0.0488% linearity error, and 3/5V power supplies. It is ideal for industrial applications requiring a small outline package, 0.2 MHz sample rate, and binary output format.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,207 parts In-Stock

1+ parts

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6,207

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Digiode

USA . 1,072 parts In-Stock

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1,072

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EMSNET

USA . 6 parts In-Stock

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6

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,159 parts In-Stock

1+ parts

$5.639

100+ parts

$523.670

1k+ parts

$5.075

10k+ parts

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1,159

$5.639

$523.670

$5.075

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AZTECH Wire

Italy . 561 parts In-Stock

1+ parts

$6.161

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561

$6.161

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DigiPath Technology Company

USA . 2,185 parts In-Stock

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$6.209

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2,185

$6.209

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ChromeModa Solutions

Germany . 6,451 parts In-Stock

1+ parts

$6.336

100+ parts

$5.196

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6,451

$6.336

$5.196

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IDEA Electronic Components Group

UK . 283 parts In-Stock

1+ parts

$6.336

100+ parts

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$5.702

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283

$6.336

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$5.702

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One Stop Electronics

USA . 141 parts In-Stock

1+ parts

$23.000

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141

$23.000

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Corphita

USA . 2,640 parts In-Stock

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2,640

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Microchip USA

USA . 455 parts In-Stock

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455

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Overview

Unleash the power of precision with the TLV1508IPWG4 from Texas Instruments. This Analog-to-Digital Converter offers unparalleled quality and reliability, making it the perfect choice for a wide range of applications. With 8 analog input channels and a fast conversion time of just 3.86 us, this converter delivers accurate results every time. Designed with a small outline and thin profile package, the TLV1508IPWG4 is easy to integrate into any project. Trust Texas Instruments to provide cutting-edge technology that meets your needs and exceeds your expectations. Experience the difference with the TLV1508IPWG4 today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the package durable and resistant to environmental factors, ensuring a longer lifespan for the product.

No. of Analog In Channels: 8

Having 8 analog input channels allows for more flexibility in connectivity and data acquisition, making the product suitable for applications requiring multiple input signals.

Surface Mount: YES

Being surface mountable makes installation easier and more convenient, especially in compact spaces or on densely populated circuit boards.

No. of Bits: 10

With 10 bits of resolution, this ADC can provide accurate digital representations of analog signals, making it suitable for applications requiring precise measurements.

Maximum Linearity Error (EL): 0.0488 %

The low linearity error ensures high accuracy in conversion, making the product reliable for critical applications that require precise and consistent results.

Power Supplies (V): 3/5

Compatibility with multiple power supply voltages allows for greater flexibility in system integration and operation, making it versatile for a variety of applications.

No. of Terminals: 20

Having 20 terminals provides ample connectivity options and ensures secure connections, making the product suitable for complex circuit designs.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The compact and slim package style saves space on the PCB and allows for high-density mounting, making it ideal for applications with limited board space.

Maximum Operating Temperature: 85 °C

The wide operating temperature range allows the product to function reliably in harsh environments, making it suitable for industrial applications.

Minimum Operating Temperature: -40 °C

The ability to operate at low temperatures ensures the product's performance and accuracy in cold conditions, making it suitable for diverse environmental conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

The terminal finish provides excellent conductivity and corrosion resistance, ensuring reliable connections and long-term performance of the product.

Terminal Position: DUAL

Having dual terminal positions allows for flexible placement on the PCB, making it easier to integrate the product into different circuit layouts.

Maximum Conversion Time: 3.86 us

The fast conversion time enables quick signal processing, making the product suitable for real-time applications that require high-speed performance.

Maximum Seated Height: 1.2 mm

The low seated height saves space in the overall system design and allows for compact device configurations, making it suitable for portable or space-constrained applications.

Width: 4.4 mm

The narrow width of the product enables high-density mounting on the PCB, making it suitable for applications with limited board space.

Maximum Time At Peak Reflow Temperature (s): 30

The short reflow time minimizes thermal stress on the components during assembly, ensuring reliable solder joints and long-term performance of the product.

Peak Reflow Temperature °C: 260

The high peak reflow temperature allows for secure soldering of the product onto the PCB, ensuring durable connections and reliable operation.

Length: 6.5 mm

The compact length of the product enables space-efficient board layouts and system designs, making it suitable for applications with size constraints.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures the product's reliability and performance in harsh operating conditions, making it suitable for demanding industrial applications.

Maximum Analog Input Voltage: 5.5 V

The high maximum analog input voltage allows for compatibility with a wide range of signal levels, making the product versatile for various input voltage requirements.

Sample Rate: 0.2 MHz

The high sample rate enables fast and accurate data acquisition, making the product suitable for applications that require high-speed signal processing and precise measurements.

Technology: CMOS

The CMOS technology used in the product offers low power consumption and high noise immunity, making it ideal for energy-efficient and reliable performance in digital systems.

Terminal Form: GULL WING

The gull wing terminal form provides secure and reliable connections during soldering, ensuring the product's durability and long-term performance.

Maximum Supply Current: 2.1 mA

The low maximum supply current consumption helps in minimizing power usage and heat dissipation, making the product suitable for battery-powered or low-power applications.

Converter Type: ADC, SUCCESSIVE APPROXIMATION

The successive approximation ADC type offers high accuracy and speed in conversion, making the product suitable for applications requiring precise and fast analog-to-digital conversion.

Nominal Supply Voltage: 3.3 V

The 3.3 V nominal supply voltage ensures compatibility with standard power sources, making the product easy to integrate into existing systems.

Output Bit Code: BINARY

The binary output bit code simplifies data processing and interpretation, making the product compatible with standard digital systems and formats.

Terminal Pitch: 0.65 mm

The small terminal pitch allows for high-density mounting on the PCB, making the product suitable for applications requiring compact and space-efficient layouts.

Minimum Analog Input Voltage: 0 V

The ability to accept zero input voltage enables the product to accurately measure small signal levels, making it suitable for applications with low-level analog inputs.

Output Format: SERIAL

The serial output format simplifies data transmission and processing, making the product compatible with serial communication protocols and digital interfaces.

Sample and Hold/Track and Hold: SAMPLE

The sample and hold functionality allows for accurate sampling and conversion of analog signals, making the product suitable for applications requiring precise signal processing and measurement.

Technical Specifications

Analog-to-Digital Converters TLV1508IPWG4 attributes and parameters. Explore more Analog-to-Digital Converters devices from Texas Instruments

Converter Specifications

No. of Analog In Channels:

8

No. of Functions:

1

No. of Bits:

10

Sub-Category:

Analog to Digital Converters

Output Bit Code:

Binary

Output Format:

Serial

Maximum Linearity Error (EL):

0.0488 %

Sample Rate:

200 kHz

Hold Mode:

Sample

Maximum Conversion Time:

3.86 µs

Electrical Specifications

Power Supplies:

3/5 V

Minimum Analog Input Voltage:

0 mV

Maximum Analog Input Voltage:

5.5 V

Nominal Supply Voltage:

3.3 V

Maximum Supply Current:

2.1 mA

Operating Conditions

Moisture Sensitivity Level (MSL):

1

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Maximum Time At Peak Reflow Temperature:

30 s

Form Factor

Terminal Position:

Dual

No. of Terminals:

20

Terminal Form:

Terminal Pitch:

0.026 in (0.65 mm)

Surface Mount:

Yes

Width:

0.173 in (4.4 mm)

Length:

0.256 in (6.5 mm)

Maximum Seated Height:

0.047 in (1.2 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

Small Outline, Thin Profile, Shrink Pitch

Package Shape:

Package Equivalence Code:

TSSOP20,.25

Package Code:

Standards and Codes

JESD-30 Code:

R-PDSO-G20

Qualified:

No

JESD-609 Code:

e4

Trade Compliance

TLV1508IPWG4 Converters trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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