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TLV0838CPWG4

Texas Instruments

TLV0838CPWG4 by Texas Instruments

TLV0838CPWG4 by Texas Instruments is an 8-bit ADC with 0.0977% linearity error, 3.3V supply, and 0.0379 MHz sample rate. Ideal for applications requiring precise analog-to-digital conversion in commercial temperature environments.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 7,946 parts In-Stock

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Digiode

USA . 156 parts In-Stock

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156

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Euro-Tech

UK . 70 parts In-Stock

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70

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Distributors (Availability)

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One Stop Electronics

USA . 1,296 parts In-Stock

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$6.000

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$6.000

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Parana Technologies

USA . 2,092 parts In-Stock

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$15.115

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$15.519

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2,092

$15.115

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$15.519

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AZTECH Wire

Italy . 823 parts In-Stock

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$16.639

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823

$16.639

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DigiPath Technology Company

USA . 505 parts In-Stock

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$16.643

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505

$16.643

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ChromeModa Solutions

Germany . 5,380 parts In-Stock

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$16.983

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$13.926

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$16.983

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IDEA Electronic Components Group

UK . 1,001 parts In-Stock

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$16.983

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$16.134

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$15.285

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$16.983

$16.134

$15.285

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Component Stockers USA

USA . 593 parts In-Stock

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$99.990

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Corphita

USA . 3,323 parts In-Stock

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Microchip USA

USA . 2,815 parts In-Stock

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Overview

Discover the exceptional precision and reliability of the TLV0838CPWG4 by Texas Instruments, a leading manufacturer in the Analog-to-Digital Converters category. With 8 analog input channels and a sleek rectangular package shape, this innovative product offers unmatched performance for a variety of applications. From industrial automation to consumer electronics, the TLV0838CPWG4 provides value, efficiency, and accuracy that customers can trust. Upgrade your systems with Texas Instruments' cutting-edge technology and experience the difference today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good durability and protection for the internal components, making the product reliable for long-term use.

No. of Analog In Channels: 8

Having 8 analog input channels allows for versatile and advanced signal processing capabilities, suitable for a wide range of applications.

Surface Mount: YES

Surface mount technology enables easy and efficient PCB assembly, saving space and reducing overall system size.

No. of Bits: 8

The 8-bit resolution provides sufficient accuracy for many applications while keeping the cost of the product economical.

Maximum Linearity Error (EL): 0.0977 %

The low linearity error ensures accurate conversion of analog signals to digital data, improving overall system performance.

Power Supplies (V): 3.3

Operating at 3.3V provides good compatibility with standard power sources, making integration into existing systems easier.

No. of Terminals: 20

Having 20 terminals allows for convenient connectivity options and ensures secure and stable connections during operation.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The compact and thin package design saves space on the PCB and makes the product suitable for small form factor applications.

Minimum Supply Voltage: 2.7 V

The low minimum supply voltage requirement allows for operation in low-power environments, increasing energy efficiency.

Maximum Operating Temperature: 70 °C

The wide operating temperature range ensures reliable performance in various environmental conditions, enhancing product versatility.

Minimum Operating Temperature: 0 °C

The ability to operate at low temperatures enables use in cold environments without compromising performance.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

The use of high-quality terminal finish materials ensures reliable electrical connections and prevents corrosion for long-term durability.

Terminal Position: DUAL

Dual terminal positions offer flexibility in PCB layout and make it easier to optimize signal paths for improved performance.

Maximum Conversion Time: 32 us

The fast conversion time allows for quick processing of analog signals, reducing latency and improving system response time.

Maximum Seated Height: 1.2 mm

The low seated height of the package saves space on the PCB and enables usage in slim devices or applications with height constraints.

Width: 4.4 mm

The compact width dimension facilitates easy integration into crowded PCB designs, making it suitable for space-constrained applications.

Peak Reflow Temperature °C: 260

The high peak reflow temperature tolerance ensures reliable soldering during manufacturing processes, preventing component damage.

Length: 6.5 mm

The moderate length dimension provides a good balance between compactness and ease of handling during assembly and installation.

Temperature Grade: COMMERCIAL

Designed for commercial temperature ranges, making the product suitable for general consumer electronics and industrial applications.

Maximum Analog Input Voltage: 3.65 V

The high maximum analog input voltage allows for processing a wide range of signal amplitudes, enhancing the product's versatility.

Sample Rate: 0.0379 MHz

The high sample rate enables capturing fast-changing signals accurately, making the product suitable for real-time data acquisition applications.

Terminal Form: GULL WING

The gull wing terminal form offers strong mechanical support and secure solder joints, ensuring reliable connections in demanding environments.

Maximum Supply Current: 0.75 mA

The low maximum supply current consumption helps in reducing overall power consumption and extending battery life in portable devices.

Converter Type: ADC, SUCCESSIVE APPROXIMATION

The successive approximation ADC type provides a good balance between speed and accuracy, suitable for a wide range of signal processing requirements.

Nominal Supply Voltage: 3.3 V

The nominal supply voltage ensures stable operation and compatibility with standard power sources, making the product easy to integrate.

Output Bit Code: BINARY

The binary output bit code simplifies data processing and interfacing with digital systems, ensuring compatibility with common data formats.

Terminal Pitch: 0.65 mm

The tight terminal pitch allows for high-density PCB layouts, enabling compact and space-efficient system designs.

Minimum Analog Input Voltage: -0.05 V

The ability to process negative analog input voltages expands the range of signals that can be measured accurately, enhancing the product's flexibility.

Output Format: SERIAL

The serial output format simplifies data transmission and interfacing with microcontrollers or other digital devices, enhancing system compatibility.

Technical Specifications

Analog-to-Digital Converters TLV0838CPWG4 attributes and parameters. Explore more Analog-to-Digital Converters devices from Texas Instruments

Converter Specifications

No. of Analog In Channels:

8

No. of Functions:

1

No. of Bits:

8

Sub-Category:

Analog to Digital Converters

Output Bit Code:

Binary

Output Format:

Serial

Maximum Linearity Error (EL):

0.0977 %

Sample Rate:

37.9 kHz

Maximum Conversion Time:

32 µs

Electrical Specifications

Power Supplies:

3.3 V

Minimum Analog Input Voltage:

-50 mV

Maximum Analog Input Voltage:

3.65 V

Nominal Supply Voltage:

3.3 V

Minimum Supply Voltage:

2.7 V

Maximum Supply Current:

750 μA

Operating Conditions

Moisture Sensitivity Level (MSL):

1

Minimum Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

70 °C (158 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Form Factor

Terminal Position:

Dual

No. of Terminals:

20

Terminal Form:

Terminal Pitch:

0.026 in (0.65 mm)

Surface Mount:

Yes

Width:

0.173 in (4.4 mm)

Length:

0.256 in (6.5 mm)

Maximum Seated Height:

0.047 in (1.2 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

Small Outline, Thin Profile, Shrink Pitch

Package Shape:

Package Equivalence Code:

TSSOP20,.25

Package Code:

Standards and Codes

JESD-30 Code:

R-PDSO-G20

Qualified:

No

JESD-609 Code:

e4

Trade Compliance

TLV0838CPWG4 Converters trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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