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TLV0838CDWRG4

Texas Instruments

TLV0838CDWRG4 by Texas Instruments

TLV0838CDWRG4 by Texas Instruments is an 8-bit ADC with 8 analog in channels, 0.0977% linearity error, and 32us conversion time. Ideal for applications requiring precise analog-to-digital conversion in commercial temperature environments.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 4,910 parts In-Stock

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Vyrian

USA . 3,528 parts In-Stock

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3,528

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Parana Technologies

USA . 1,027 parts In-Stock

1+ parts

$7.457

100+ parts

$692.524

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$6.712

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1,027

$7.457

$692.524

$6.712

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DigiPath Technology Company

USA . 1,219 parts In-Stock

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$8.211

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ChromeModa Solutions

Germany . 4,644 parts In-Stock

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$8.379

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$6.871

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IDEA Electronic Components Group

UK . 1,082 parts In-Stock

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$8.379

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$7.960

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$7.541

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1,082

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AZTECH Wire

Italy . 864 parts In-Stock

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$14.649

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One Stop Electronics

USA . 351 parts In-Stock

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$16.000

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A-Z Elektronik GmbH

Germany . 4,947 parts In-Stock

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Corphita

USA . 4,447 parts In-Stock

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Kepictronics

USA . 1,820 parts In-Stock

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Microchip USA

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Overview

Experience the precision and reliability of Texas Instruments with the TLV0838CDWRG4 Analog-to-Digital Converter. This high-quality product offers 8 analog input channels in a compact rectangular package, making it ideal for a wide range of applications. With a maximum linearity error of only 0.0977%, this converter provides accurate results every time. Trust in Texas Instruments for top-notch performance and value, and unlock the potential of your projects with the TLV0838CDWRG4.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is cost-effective and provides good protection for the internal components of the ADC.

No. of Analog In Channels: 8

Having 8 analog input channels allows for versatile signal processing and conversion capabilities.

No. of Bits: 8

8 bits of resolution provide sufficient accuracy for many common applications.

Power Supplies (V): 3.3

Operating at a standard 3.3V power supply simplifies integration into existing systems.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making this ADC efficient and reliable.

Maximum Analog Input Voltage: 3.65 V

The high maximum analog input voltage allows for processing of a wide range of signal amplitudes.

Sample Rate: 0.031 MHz

The high sample rate allows for fast and accurate signal conversion.

Converter Type: ADC, SUCCESSIVE APPROXIMATION

Successive approximation ADCs are known for their high-speed performance and accuracy.

Technical Specifications

Analog-to-Digital Converters TLV0838CDWRG4 attributes and parameters. Explore more Analog-to-Digital Converters devices from Texas Instruments

Converter Specifications

No. of Analog In Channels:

8

No. of Functions:

1

No. of Bits:

8

Sub-Category:

Analog to Digital Converters

Output Bit Code:

Binary

Output Format:

Serial

Maximum Linearity Error (EL):

0.0977 %

Sample Rate:

31 kHz

Maximum Conversion Time:

32 µs

Electrical Specifications

Power Supplies:

3.3 V

Minimum Analog Input Voltage:

-50 mV

Maximum Analog Input Voltage:

3.65 V

Nominal Supply Voltage:

3.3 V

Minimum Supply Voltage:

2.7 V

Maximum Supply Current:

750 μA

Operating Conditions

Moisture Sensitivity Level (MSL):

1

Minimum Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

70 °C (158 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Form Factor

Terminal Position:

Dual

No. of Terminals:

20

Terminal Form:

Terminal Pitch:

0.05 in (1.27 mm)

Surface Mount:

Yes

Width:

0.295 in (7.5 mm)

Length:

0.504 in (12.8 mm)

Maximum Seated Height:

0.104 in (2.65 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

Small Outline

Package Shape:

Package Equivalence Code:

SOP20,.4

Package Code:

SOP

Standards and Codes

JESD-30 Code:

R-PDSO-G20

Qualified:

No

JESD-609 Code:

e4

Trade Compliance

TLV0838CDWRG4 Converters trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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