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TLC876CDW

Texas Instruments

TLC876CDW by Texas Instruments

TLC876CDW by Texas Instruments is a 10-bit ADC with 0.1172% EL, 20 MHz sample rate, and 2 V max analog input voltage. Ideal for commercial applications, it offers binary output code in a small outline package with dual terminals and operates b/w 0-70°C.

Median Price

$5.230

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Component Electronics Inc.

Canada . 73 parts In-Stock

1+ parts

$5.230

100+ parts

$3.920

1k+ parts

$3.400

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73

$5.230

$3.920

$3.400

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Vyrian

USA . 6,472 parts In-Stock

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Digiode

USA . 466 parts In-Stock

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466

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Prism Electronics

USA . 13 parts In-Stock

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13

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Distributors (Availability)

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AZTECH Wire

Italy . 260 parts In-Stock

1+ parts

$11.093

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260

$11.093

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Parana Technologies

USA . 115 parts In-Stock

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$12.524

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$12.973

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115

$12.524

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$12.973

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One Stop Electronics

USA . 342 parts In-Stock

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$13.000

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342

$13.000

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DigiPath Technology Company

USA . 390 parts In-Stock

1+ parts

$13.791

100+ parts

$12.687

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390

$13.791

$12.687

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ChromeModa Solutions

Germany . 6,024 parts In-Stock

1+ parts

$14.072

100+ parts

$11.539

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6,024

$14.072

$11.539

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IDEA Electronic Components Group

UK . 895 parts In-Stock

1+ parts

$14.072

100+ parts

$13.368

1k+ parts

$12.665

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895

$14.072

$13.368

$12.665

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Authorized Procurement Solutions

USA . 4,000 parts In-Stock

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Corphita

USA . 3,833 parts In-Stock

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3,833

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A-Z Elektronik GmbH

Germany . 1,145 parts In-Stock

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1,145

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Kepictronics

USA . 970 parts In-Stock

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970

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Perfect Parts

USA . 15 parts In-Stock

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Overview

Unlock a world of precision and reliability with the Texas Instruments TLC876CDW Analog-to-Digital Converter. Crafted by industry leader Texas Instruments, this converter offers unparalleled performance in a compact package. Ideal for a wide range of applications, from industrial automation to consumer electronics, the TLC876CDW delivers accurate results with minimal error. Trust in Texas Instruments to provide cutting-edge technology that meets your needs and exceeds your expectations. Elevate your projects with the TLC876CDW and experience the difference quality makes.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the product suitable for a wide range of applications.

Surface Mount: YES

Allows for easy and convenient installation on circuit boards, saving space and improving reliability.

No. of Bits: 10

Provides a high resolution for accurate digital conversions of analog signals.

Maximum Linearity Error (EL): 0.1172%

Ensures precise output values, minimizing errors in the conversion process.

Power Supplies (V): 3.3,5

Supports multiple power supply options, giving flexibility in different operating conditions.

No. of Terminals: 28

Plenty of terminals for connecting to various components in a system, enabling versatile integration.

Technology: CMOS

Complementary metal-oxide-semiconductor technology offers low power consumption and high noise immunity.

Sample Rate: 20 MHz

Provides fast conversion speeds, suitable for applications that require real-time data processing.

Converter Type: ADC, PROPRIETARY METHOD

The proprietary method used in the analog-to-digital conversion ensures optimized performance and accuracy.

Technical Specifications

Analog-to-Digital Converters TLC876CDW attributes and parameters. Explore more Analog-to-Digital Converters devices from Texas Instruments

Converter Specifications

No. of Analog In Channels:

1

No. of Functions:

1

No. of Bits:

10

Sub-Category:

Analog to Digital Converters

Output Bit Code:

Binary

Output Format:

Parallel, Word

Maximum Linearity Error (EL):

0.1172 %

Sample Rate:

20 MHz

Hold Mode:

Sample

Electrical Specifications

Power Supplies:

3.3,5 V

Minimum Analog Input Voltage:

1 V

Maximum Analog Input Voltage:

2 V

Nominal Supply Voltage:

5 V

Operating Conditions

Minimum Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

70 °C (158 °F)

Temperature Grade:

Form Factor

Terminal Position:

Dual

No. of Terminals:

28

Terminal Form:

Terminal Pitch:

0.05 in (1.27 mm)

Surface Mount:

Yes

Width:

0.295 in (7.5 mm)

Length:

0.705 in (17.9 mm)

Maximum Seated Height:

0.104 in (2.65 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

Small Outline

Package Shape:

Package Equivalence Code:

SOP28,.4

Package Code:

SOP

Standards and Codes

JESD-30 Code:

R-PDSO-G28

Qualified:

No

Trade Compliance

TLC876CDW Converters trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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