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TLC876CDWR

Texas Instruments

TLC876CDWR by Texas Instruments

TLC876CDWR by Texas Instruments is a 10-bit ADC with 0.1172% EL, 20 MHz sample rate, and 2 V max analog input voltage. Ideal for commercial applications, it features a small outline package, operates b/w 0-70°C, and supports binary output format.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,238 parts In-Stock

1+ parts

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6,238

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Digiode

USA . 610 parts In-Stock

1+ parts

-

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610

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 1,424 parts In-Stock

1+ parts

$8.000

100+ parts

-

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1,424

$8.000

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AZTECH Wire

Italy . 863 parts In-Stock

1+ parts

$13.691

100+ parts

-

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863

$13.691

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Parana Technologies

USA . 618 parts In-Stock

1+ parts

$18.310

100+ parts

$1,700.358

1k+ parts

$16.479

10k+ parts

-

618

$18.310

$1,700.358

$16.479

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DigiPath Technology Company

USA . 2,304 parts In-Stock

1+ parts

$20.162

100+ parts

$18.549

1k+ parts

-

10k+ parts

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2,304

$20.162

$18.549

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ChromeModa Solutions

Germany . 4,961 parts In-Stock

1+ parts

$20.573

100+ parts

$16.870

1k+ parts

-

10k+ parts

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4,961

$20.573

$16.870

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IDEA Electronic Components Group

UK . 1,679 parts In-Stock

1+ parts

$20.573

100+ parts

$19.544

1k+ parts

$18.516

10k+ parts

-

1,679

$20.573

$19.544

$18.516

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A-Z Elektronik GmbH

Germany . 7,319 parts In-Stock

1+ parts

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7,319

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Corphita

USA . 1,033 parts In-Stock

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1,033

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Overview

Experience unparalleled precision and reliability with the TLC876CDWR by Texas Instruments. Crafted with top-notch quality and cutting-edge technology, this Analog-to-Digital Converter offers exceptional performance in a variety of applications. From industrial automation to medical devices, this converter delivers accurate results with ease. Trust Texas Instruments to provide you with the best-in-class solutions for your analog-to-digital conversion needs. Elevate your projects with the TLC876CDWR and unlock a world of possibilities.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good insulation and protection for the internal components of the converter, ensuring reliability and durability.

Surface Mount: YES

Allows for easy installation on PCBs, saving space and making it suitable for compact designs.

No. of Bits: 10

Offers a high resolution for accurate conversion of analog signals to digital form.

Maximum Linearity Error (EL): 0.1172%

Provides high accuracy in converting analog signals with minimal error.

Power Supplies (V): 3.3,5

Can operate with different power supply voltages to suit various applications.

No. of Terminals: 28

Provides multiple connection points for interfacing with other electronic components.

Maximum Operating Temperature: 70 °C

Can operate effectively in a wide range of temperature environments.

Technology: CMOS

Utilizes CMOS technology for low power consumption and high speed operation.

Nominal Supply Voltage: 5 V

Operates efficiently with a standard 5V power supply.

Technical Specifications

Analog-to-Digital Converters TLC876CDWR attributes and parameters. Explore more Analog-to-Digital Converters devices from Texas Instruments

Converter Specifications

No. of Analog In Channels:

1

No. of Functions:

1

No. of Bits:

10

Sub-Category:

Analog to Digital Converters

Output Bit Code:

Binary

Output Format:

Parallel, Word

Maximum Linearity Error (EL):

0.1172 %

Sample Rate:

20 MHz

Hold Mode:

Sample

Electrical Specifications

Power Supplies:

3.3,5 V

Minimum Analog Input Voltage:

1 V

Maximum Analog Input Voltage:

2 V

Nominal Supply Voltage:

5 V

Operating Conditions

Minimum Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

70 °C (158 °F)

Temperature Grade:

Form Factor

Terminal Position:

Dual

No. of Terminals:

28

Terminal Form:

Terminal Pitch:

0.05 in (1.27 mm)

Surface Mount:

Yes

Width:

0.295 in (7.5 mm)

Length:

0.705 in (17.9 mm)

Maximum Seated Height:

0.104 in (2.65 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

Small Outline

Package Shape:

Package Equivalence Code:

SOP28,.4

Package Code:

SOP

Standards and Codes

JESD-30 Code:

R-PDSO-G28

Qualified:

No

Trade Compliance

TLC876CDWR Converters trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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