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TLC876IPWR

Texas Instruments

TLC876IPWR by Texas Instruments

TLC876IPWR by Texas Instruments is a 10-bit ADC with 0.1172% EL, 20 MHz sample rate, and 2V max analog input voltage. Ideal for industrial applications, it operates b/w -40 to 85°C, has a small outline package style, and supports binary output format.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,312 parts In-Stock

1+ parts

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4,312

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Digiode

USA . 2,747 parts In-Stock

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2,747

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 358 parts In-Stock

1+ parts

$13.058

100+ parts

-

1k+ parts

$13.552

10k+ parts

-

358

$13.058

-

$13.552

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ChromeModa Solutions

Germany . 6,130 parts In-Stock

1+ parts

$14.672

100+ parts

$12.031

1k+ parts

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6,130

$14.672

$12.031

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IDEA Electronic Components Group

UK . 945 parts In-Stock

1+ parts

$14.672

100+ parts

$13.938

1k+ parts

$13.205

10k+ parts

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945

$14.672

$13.938

$13.205

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AZTECH Wire

Italy . 768 parts In-Stock

1+ parts

$17.426

100+ parts

-

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768

$17.426

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One Stop Electronics

USA . 520 parts In-Stock

1+ parts

$19.000

100+ parts

-

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520

$19.000

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Corphita

USA . 2,173 parts In-Stock

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2,173

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DigiPath Technology Company

USA . 1,775 parts In-Stock

1+ parts

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100+ parts

$13.228

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1,775

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$13.228

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Overview

Unlock the power of precision with the TLC876IPWR from Texas Instruments, a leading manufacturer known for top-quality products. As a versatile Analog-to-Digital Converter, this device offers unparalleled accuracy and reliability in a compact package. Ideal for industrial applications, the TLC876IPWR provides seamless integration and high performance, making it a valuable asset for any project. Experience the benefits of cutting-edge technology and superior design with this innovative solution.

Feature Benefit Bullets

No. of Bits: 10

With 10 bits, this ADC can provide more resolution and accuracy in converting analog signals to digital, making it suitable for applications requiring precise measurements.

Maximum Linearity Error (EL): 0.1172 %

The low linearity error ensures that the output digital values closely represent the input analog signals, resulting in accurate data conversion.

Power Supplies (V): 3.3,5

With multiple power supply options (3.3V and 5V), this ADC offers flexibility in different circuit designs and can be utilized in various voltage environments.

Package Style: SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The compact and slim profile of this package makes it suitable for space-constrained applications where size and weight are important factors.

Maximum Operating Temperature: 85 °C

The ability to operate at up to 85°C makes this ADC suitable for industrial applications requiring robust performance in challenging thermal conditions.

Sample Rate: 20 MHz

With a high sample rate of 20 MHz, this ADC can quickly capture and convert analog signals into digital form, making it ideal for time-sensitive applications.

Technology: CMOS

Utilizing CMOS technology, this ADC offers low power consumption, high speed, and compatibility with a wide range of digital circuits, enhancing its performance and efficiency.

Nominal Supply Voltage: 5 V

The 5V supply voltage ensures stable and consistent power for the ADC, enabling reliable and accurate operation in various electronic systems.

Technical Specifications

Analog-to-Digital Converters TLC876IPWR attributes and parameters. Explore more Analog-to-Digital Converters devices from Texas Instruments

Converter Specifications

No. of Analog In Channels:

1

No. of Functions:

1

No. of Bits:

10

Sub-Category:

Analog to Digital Converters

Output Bit Code:

Binary

Output Format:

Parallel, Word

Maximum Linearity Error (EL):

0.1172 %

Sample Rate:

20 MHz

Hold Mode:

Sample

Electrical Specifications

Power Supplies:

3.3,5 V

Minimum Analog Input Voltage:

1 V

Maximum Analog Input Voltage:

2 V

Nominal Supply Voltage:

5 V

Operating Conditions

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Form Factor

Terminal Position:

Dual

No. of Terminals:

28

Terminal Form:

Terminal Pitch:

0.026 in (0.65 mm)

Surface Mount:

Yes

Width:

0.173 in (4.4 mm)

Length:

0.382 in (9.7 mm)

Maximum Seated Height:

0.047 in (1.2 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

Small Outline, Thin Profile, Shrink Pitch

Package Shape:

Package Equivalence Code:

TSSOP28,.25

Package Code:

Standards and Codes

JESD-30 Code:

R-PDSO-G28

Qualified:

No

Trade Compliance

TLC876IPWR Converters trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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