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TLC876IDBR

Texas Instruments

TLC876IDBR by Texas Instruments

TLC876IDBR by Texas Instruments is a 10-bit ADC with 0.1172% EL, 20 MHz sample rate, and 2V max analog input voltage. Ideal for industrial applications, it operates b/w -40 to 85 °C with a supply voltage of 3.3-5V. The small outline package has dual terminals and Gull Wing form factor for SMT assembly.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,809 parts In-Stock

1+ parts

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7,809

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Digiode

USA . 632 parts In-Stock

1+ parts

-

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632

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 257 parts In-Stock

1+ parts

$11.374

100+ parts

-

1k+ parts

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257

$11.374

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Parana Technologies

USA . 1,981 parts In-Stock

1+ parts

$13.839

100+ parts

-

1k+ parts

$14.321

10k+ parts

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1,981

$13.839

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$14.321

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DigiPath Technology Company

USA . 333 parts In-Stock

1+ parts

$15.238

100+ parts

-

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333

$15.238

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IDEA Electronic Components Group

UK . 1,397 parts In-Stock

1+ parts

$15.549

100+ parts

$14.772

1k+ parts

$13.994

10k+ parts

-

1,397

$15.549

$14.772

$13.994

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ChromeModa Solutions

Germany . 234 parts In-Stock

1+ parts

$15.549

100+ parts

$12.750

1k+ parts

-

10k+ parts

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234

$15.549

$12.750

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One Stop Electronics

USA . 1,530 parts In-Stock

1+ parts

$37.000

100+ parts

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1,530

$37.000

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Corphita

USA . 3,061 parts In-Stock

1+ parts

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3,061

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Overview

Experience superior performance and reliability with the TLC876IDBR Analog-to-Digital Converter by Texas Instruments. As a trusted industry leader, Texas Instruments delivers top-quality products that meet the highest standards. The TLC876IDBR is versatile, offering high precision and accuracy for a wide range of applications. Enjoy the benefits of fast sampling rates and low power consumption, making it ideal for industrial use. Upgrade your systems with the TLC876IDBR for unmatched value and performance.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the components inside the package, ensuring reliability in various operating conditions.

Surface Mount: YES

Allows for easy and convenient integration onto circuit boards, saving space and simplifying assembly processes.

No. of Bits: 10

Provides high resolution and accuracy in converting analog signals to digital, suitable for a wide range of applications.

Maximum Linearity Error (EL): 0.1172 %

Ensures precision in converting analog signals to digital, producing accurate and reliable digital output.

Power Supplies (V): 3.3,5

Compatible with common power supply voltages, making it versatile and easy to integrate into different systems.

No. of Terminals: 28

Offers flexibility in connecting to external components and peripherals, enhancing the functionality of the ADC.

Package Style (Meter): SMALL OUTLINE, SHRINK PITCH

Compact and space-saving design, suitable for applications where size constraints are a consideration.

Maximum Operating Temperature: 85 °C

Can withstand high temperatures, making it suitable for industrial and harsh environments.

Technology: CMOS

CMOS technology ensures low power consumption and high speed performance, ideal for various applications.

Technical Specifications

Analog-to-Digital Converters TLC876IDBR attributes and parameters. Explore more Analog-to-Digital Converters devices from Texas Instruments

Converter Specifications

No. of Analog In Channels:

1

No. of Functions:

1

No. of Bits:

10

Sub-Category:

Analog to Digital Converters

Output Bit Code:

Binary

Output Format:

Parallel, Word

Maximum Linearity Error (EL):

0.1172 %

Sample Rate:

20 MHz

Hold Mode:

Sample

Electrical Specifications

Power Supplies:

3.3,5 V

Minimum Analog Input Voltage:

1 V

Maximum Analog Input Voltage:

2 V

Nominal Supply Voltage:

5 V

Operating Conditions

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Form Factor

Terminal Position:

Dual

No. of Terminals:

28

Terminal Form:

Terminal Pitch:

0.026 in (0.65 mm)

Surface Mount:

Yes

Width:

0.209 in (5.3 mm)

Length:

0.402 in (10.2 mm)

Maximum Seated Height:

0.079 in (2 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

Small Outline, Shrink Pitch

Package Shape:

Package Equivalence Code:

SSOP28,.3

Package Code:

Standards and Codes

JESD-30 Code:

R-PDSO-G28

Qualified:

No

Trade Compliance

TLC876IDBR Converters trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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