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TLC876MDW

Texas Instruments

TLC876MDW by Texas Instruments

TLC876MDW by Texas Instruments is a 10-bit ADC with 0.1172% EL, operating at 20 MHz sample rate. Ideal for military applications, it has a 28-terminal small outline package and supports input voltages from 1V to 2V.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,694 parts In-Stock

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7,694

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Digiode

USA . 3,103 parts In-Stock

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3,103

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Distributors (Availability)

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AZTECH Wire

Italy . 655 parts In-Stock

1+ parts

$11.605

100+ parts

-

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655

$11.605

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One Stop Electronics

USA . 536 parts In-Stock

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$13.000

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536

$13.000

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Parana Technologies

USA . 741 parts In-Stock

1+ parts

$19.842

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$19.799

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741

$19.842

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$19.799

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DigiPath Technology Company

USA . 1,842 parts In-Stock

1+ parts

$21.848

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$20.100

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1,842

$21.848

$20.100

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IDEA Electronic Components Group

UK . 2,009 parts In-Stock

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$22.294

100+ parts

$21.179

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$20.065

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2,009

$22.294

$21.179

$20.065

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ChromeModa Solutions

Germany . 1,016 parts In-Stock

1+ parts

$22.294

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$18.281

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1,016

$22.294

$18.281

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Corphita

USA . 2,221 parts In-Stock

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Overview

Elevate your analog-to-digital conversion experience with the TLC876MDW by Texas Instruments. Crafted with precision and reliability, this small outline package converter offers unparalleled performance in a variety of applications. From industrial automation to consumer electronics, this ADC provides accurate data conversion with minimal linearity error. With a military-grade temperature range and dual terminal position, the TLC876MDW ensures optimal functionality in any environment. Trust Texas Instruments to deliver cutting-edge technology that exceeds expectations, providing value and efficiency to customers seeking top-tier performance.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides good insulation and protection for the internal components of the converter.

Surface Mount: YES

Surface mount technology allows for easy installation and soldering onto circuit boards, saving time and effort.

No. of Bits: 10

10-bit resolution provides high accuracy and precision in digital conversion of analog signals.

Maximum Linearity Error (EL): 0.1172 %

Low linearity error ensures that the converted digital signal closely matches the original analog input.

Power Supplies (V): 3.3,5

Supports multiple power supply options for flexibility in different electronic systems.

No. of Terminals: 28

Ample terminals allow for easy connectivity with other components in the circuit.

Maximum Analog Input Voltage: 2 V

Handles up to 2V analog input voltage, suitable for a wide range of signal levels.

Sample Rate: 20 MHz

High sample rate of 20 MHz allows for fast and accurate conversion of analog signals to digital values.

Technology: CMOS

CMOS technology offers low power consumption, high speed, and noise immunity for efficient operation.

Temperature Grade: MILITARY

Military-grade temperature specifications ensure reliable performance in harsh environments.

Technical Specifications

Analog-to-Digital Converters TLC876MDW attributes and parameters. Explore more Analog-to-Digital Converters devices from Texas Instruments

Converter Specifications

No. of Analog In Channels:

1

No. of Functions:

1

No. of Bits:

10

Sub-Category:

Analog to Digital Converters

Output Bit Code:

Binary

Output Format:

Parallel, Word

Maximum Linearity Error (EL):

0.1172 %

Sample Rate:

20 MHz

Hold Mode:

Sample

Electrical Specifications

Power Supplies:

3.3,5 V

Minimum Analog Input Voltage:

1 V

Maximum Analog Input Voltage:

2 V

Nominal Supply Voltage:

5 V

Operating Conditions

Minimum Operating Temperature:

-55 °C (-67 °F)

Maximum Operating Temperature:

125 °C (257 °F)

Temperature Grade:

Form Factor

Terminal Position:

Dual

No. of Terminals:

28

Terminal Form:

Terminal Pitch:

0.05 in (1.27 mm)

Surface Mount:

Yes

Width:

0.295 in (7.5 mm)

Length:

0.705 in (17.9 mm)

Maximum Seated Height:

0.104 in (2.65 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

Small Outline

Package Shape:

Package Equivalence Code:

SOP28,.4

Package Code:

SOP

Standards and Codes

JESD-30 Code:

R-PDSO-G28

Qualified:

No

Trade Compliance

TLC876MDW Converters trade compliance attributes, and parameters.

ECCN

3A001.A.2.C

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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