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TLC3574IDWG4

Texas Instruments

TLC3574IDWG4 by Texas Instruments

TLC3574IDWG4 by Texas Instruments is a 14-bit ADC with 4 analog in channels, 0.0061% max linearity error, and 0.2 MHz sample rate. Ideal for industrial applications requiring precise analog-to-digital conversion in a compact package. Operates at -40 to 85°C with low power consumption of 5mA at 5V nominal voltage.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,395 parts In-Stock

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3,395

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Digiode

USA . 1,974 parts In-Stock

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1,974

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Distributors (Availability)

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AZTECH Wire

Italy . 623 parts In-Stock

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$14.454

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623

$14.454

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Parana Technologies

USA . 247 parts In-Stock

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$22.943

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$23.597

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247

$22.943

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$23.597

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DigiPath Technology Company

USA . 1,730 parts In-Stock

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$25.263

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1,730

$25.263

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ChromeModa Solutions

Germany . 1,020 parts In-Stock

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$25.779

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$21.139

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$25.779

$21.139

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IDEA Electronic Components Group

UK . 764 parts In-Stock

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$25.779

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$24.490

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$23.201

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764

$25.779

$24.490

$23.201

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One Stop Electronics

USA . 1,470 parts In-Stock

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$33.000

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$33.000

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QUARKTWIN TECHNOLOGY LTD

USA . 8,180 parts In-Stock

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Corphita

USA . 3,056 parts In-Stock

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Microchip USA

USA . 2,395 parts In-Stock

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Overview

Unlock the power of precision with the TLC3574IDWG4 Analog-to-Digital Converter by Texas Instruments. Crafted with top-notch quality and expertise, this converter offers unparalleled accuracy and reliability for a wide range of applications. From industrial automation to medical devices, this versatile component provides exceptional value and performance. Experience seamless integration and superior results with the TLC3574IDWG4 - the ultimate choice for your analog-to-digital conversion needs.

Feature Benefit Bullets

Number of Analog Input Channels: 4

Having 4 analog input channels allows for versatile input options and the ability to convert multiple analog signals simultaneously.

Number of Bits: 14

With a higher number of bits, this ADC offers increased resolution and accuracy in converting analog signals to digital data.

Maximum Linearity Error: 0.0061%

The low linearity error ensures accurate and precise conversion of analog signals with minimal distortion or deviation from the original signal.

Power Supplies: 3/5,5V

Supporting multiple power supply voltages offers flexibility in powering the ADC, catering to various system requirements and configurations.

Maximum Operating Temperature: 85°C

With a high maximum operating temperature, this ADC can reliably operate in industrial environments with elevated temperatures.

Sample Rate: 0.2 MHz

The high sample rate enables fast and efficient conversion of analog signals to digital data, making it suitable for real-time applications.

Technology: CMOS

Utilizing CMOS technology enhances the ADC's performance, providing low power consumption, high speed, and compatibility with a wide range of digital systems.

Technical Specifications

Analog-to-Digital Converters TLC3574IDWG4 attributes and parameters. Explore more Analog-to-Digital Converters devices from Texas Instruments

Converter Specifications

No. of Analog In Channels:

4

No. of Functions:

1

No. of Bits:

14

Sub-Category:

Analog to Digital Converters

Output Bit Code:

Offset Binary, 2's Complement Binary

Output Format:

Serial

Maximum Linearity Error (EL):

0.0061 %

Sample Rate:

200 kHz

Hold Mode:

Sample

Maximum Conversion Time:

2.785 µs

Electrical Specifications

Power Supplies:

3/5,5 V

Minimum Analog Input Voltage:

-10 V

Maximum Analog Input Voltage:

10 V

Nominal Supply Voltage:

5 V

Minimum Supply Voltage:

2.7 V

Maximum Supply Current:

5 mA

Operating Conditions

Moisture Sensitivity Level (MSL):

1

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Maximum Time At Peak Reflow Temperature:

30 s

Form Factor

Terminal Position:

Dual

No. of Terminals:

20

Terminal Form:

Terminal Pitch:

0.05 in (1.27 mm)

Surface Mount:

Yes

Width:

0.295 in (7.5 mm)

Length:

0.504 in (12.8 mm)

Maximum Seated Height:

0.104 in (2.65 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

Small Outline

Package Shape:

Package Equivalence Code:

SOP20,.4

Package Code:

SOP

Standards and Codes

JESD-30 Code:

R-PDSO-G20

Qualified:

No

JESD-609 Code:

e4

Trade Compliance

TLC3574IDWG4 Converters trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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